| Patent Number |
Title Of Patent |
Date Issued |
| D557599 |
Package for bonding tools |
December 18, 2007 |
|
| 7442641 |
Integrated ball and via package and formation process |
October 28, 2008 |
| A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a sec |
| 7431192 |
Wire bonding apparatus |
October 7, 2008 |
| A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure. |
| 7411157 |
Electronic flame-off electrode with ball-shaped tip |
August 12, 2008 |
| An electrode for a wire bonding apparatus is provided. The electrode includes a body portion and a tip portion adjacent the body portion. The tip portion has a substantially spherical configuration. |
| 7377415 |
Bond head link assembly for a wire bonding machine |
May 27, 2008 |
| A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support |
| 7347352 |
Low loop height ball bonding method and apparatus |
March 25, 2008 |
| In accordance with the invention, a bump is formed on top of a die bond pad by forming a ball bond there. Then, without severing the wire, the capillary undergoes a set of coordinated motions to fold the wire on top of the ball bond. The wire is then bonded on top of the ball bond bump |
| 7320425 |
Low-profile capillary for wire bonding |
January 22, 2008 |
| A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside |
| 7320424 |
Linear split axis wire bonder |
January 22, 2008 |
| A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the |
| 7320423 |
High speed linear and rotary split-axis wire bonder |
January 22, 2008 |
| A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head |
| 7294217 |
Electrical interconnect structures for integrated circuits and methods of manufacturing the same |
November 13, 2007 |
| Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying co |
| 7249702 |
Multi-part capillary |
July 31, 2007 |
| A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. |
| 7229906 |
Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding m |
June 12, 2007 |
| The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined |
| 7199475 |
Semiconductor copper bond pad surface protection |
April 3, 2007 |
| Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the sur |
| 7188759 |
Methods for forming conductive bumps and wire loops |
March 13, 2007 |
| A method of forming a conductive bump is provided. The method includes depositing a conductive bump on a bonding location using a bonding tool such that a junction exists between (1) a length of wire extending at least partially within the bonding tool and (2) the deposited conductive |
| 7179688 |
Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding devic |
February 20, 2007 |
| A method of packaging a multi-tier wire bonded semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors per layer providing interconnection between elements in the multi-tier wire bonded s |
| 7160797 |
Method of bumping die pads for wafer testing |
January 9, 2007 |
| A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the r |
| 7137543 |
Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers |
November 21, 2006 |
| The present invention is directed to an integrated flexure mount scheme for dynamic isolation of ultrasonic transducers for use with a wire bonding machine. The transducer has a body of a generally elongated shape having front, rear, and main portions. The transducer has mounting fla |
| 7109586 |
System for reducing or eliminating semiconductor device wire sweep |
September 19, 2006 |
| Packaging a semiconductor device is provided. The semiconductor device comprises a plurality of semiconductor elements; a plurality of conductors providing interconnection between said plurality of semiconductor elements; and an insulative material applied across only a portion of at |
| 6992001 |
Screen print under-bump metalization (UBM) to produce low cost flip chip substrate |
January 31, 2006 |
| A method for forming an integrated circuit interconnect pad is described. In one embodiment a method of forming an integrated circuit comprises screen printing a conductive paste onto a terminal metalization pad and curing the conductive paste in an inert or reducing atmosphere at an |
| 6171456 |
Method for making improved long life bonding tools |
January 9, 2001 |
| The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger interconnections. After the desir |
| 5808379 |
Bi-directional linear drive motor |
September 15, 1998 |
| The present invention comprises an improvement of a known bi-directional linear motor and is applicable to other linear motors. The linear motor comprises a plurality of pole pieces arranged as a closed frame having three horizontal pole pieces and two vertical end pieces with permanent |
| 5310702 |
Method of preventing short-circuiting of bonding wires |
May 10, 1994 |
| A method of preventing the interconnecting fine wires of a bonded semiconductor devices from moving from their preferred loop position after being bonded in an automatic wire bonder includes the step of automatically transferring the bonded semiconductor device to an insulating stati |
| 5119436 |
Method of centering bond positions |
June 2, 1992 |
| A method for increasing accuracy and reducing the time required to teach the target bonding points on a reference semiconductor device and its associated lead frame comprises manually approximately locating at least a first target bonding point and at each approximately located bonding p |
| 5119435 |
Pattern recognition apparatus and method |
June 2, 1992 |
| A method of operating a pattern recognition apparatus comprises generating a plurality of sub pixel sub signatures from a reference signature, wherein the sub pixel sub signatures correspond to fractional pixel (sub pixel) positions. A target sub signature is compared to each of the sub |
| 5083192 |
Cluster mount for high intensity LEDs |
January 21, 1992 |
| A light concentrating cluster mount for super bright light emitting diodes is provided. The cluster mount is provided with a plurality of LED receivers therein. Said cluster mount has a central axis and each of the LED receivers has a focus axis displaced from the central axis and is |
| 4990051 |
Pre-peel die ejector apparatus |
February 5, 1991 |
| A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a sour |
| 4972311 |
X-Y table error mapping apparatus and method |
November 20, 1990 |
| Apparatus and a method of correcting for repeatable positioning errors in an X-Y table is provided. An accurate mask is provided having a plurality of repetitive recognizable patterns thereon which is placed in the field of view of a pattern recognition system of a semiconductor processi |
| 4850780 |
Pre-peel die ejector apparatus |
July 25, 1989 |
| A die ejector chuck is provided with a central housing and an outer housing and the central housing is provided with a die eject collar which extends through an aperture in the outer housing. A preselected die on a flexible adhesive tape is positioned over the die eject collar and a sour |
| 4772835 |
Interactive multiaxis encoder positioning system |
September 20, 1988 |
| An interactive multiaxis encoder positioning system is provided for positioning a tool or a work piece to a degree of accuracy which is only limited by the encoder system and not the mechanical guides, slides and bearings of prior art systems. A highly precise and accurate multiaxis |
| 4771930 |
Apparatus for supplying uniform tail lengths |
September 20, 1988 |
| A novel and improved monitoring and detecting circuit is provided for an automatic wedge wire bonder. The detecting circuit is initiated at the second wire bond while the bonding tool is pressing the bonding wire on the pad or electrode. If the fine wire is missing under the working face |
| 4765531 |
Quick change work station apparatus for automatic wire bonders |
August 23, 1988 |
| A modular quick change work station is provided for automatic wire bonders which permits the rapid exchange of work stations without manual adjustments for continuing operations. The modular work station comprises a fixed portion and a movable portion. The fixed portion is affixed to a |
| 4671835 |
Handling system for laminar objects |
June 9, 1987 |
| Apparatus for applying adhesive film to an annular frame having a substantially circular disc of uniformly tensioned film adhered to one surface thereof, said film covering the whole of the central aperture of the frame and not extending beyond the outer periphery of the frame at any |
| 4653681 |
Voice coil actuated fine wire clamp |
March 31, 1987 |
| A high speed low inertia fine wire clamp is provided for automatic wire bonders of the type which move the bond head and bond head frame relative to the workstation which supports the semiconductor device to be wire bonded. The wire clamp comprises a fixed clamp lever mounted on a bond |
| 4619395 |
Low inertia movable workstation |
October 28, 1986 |
| The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is mounted on a retractable pedestal which is vertically and rotationally movable by a high s |
| 4591087 |
Apparatus for making rolling spot bonds |
May 27, 1986 |
| An ultrasonic transducer is provided with a wedge bonding tool having an arcuate convex working face. The wedge bonding tool is engaged on top of a foil finger of a connector to be spot bonded to a terminal or pad on a device or substrate. As force and ultrasonic power are applied to the |
| 4586642 |
Wire bond monitoring system |
May 6, 1986 |
| Apparatus is provided for monitoring conditions of a fine wire interconnection during a bonding operation. The apparatus comprise a system which is capable of being installed on new automatic wire bonders or retrofitted into existing automatic wire bonders of the type which employ a |
| 4558596 |
Apparatus for detecting missing wires |
December 17, 1985 |
| Apparatus is provided for monitoring the bond condition of a fine aluminum wire being ultrasonically bonded to an electrode pad. The apparatus comprises a counter for generating a start and stop signal indicative of a predetermined plurality of cycles from the ultrasonic generator of the |
| 4422568 |
Method of making constant bonding wire tail lengths |
December 27, 1983 |
| In a high speed automatic fine wire bonding machine of the type adapted to produce a wire interconnection between two bonding points on a semiconductor device there is provided a method of making consistent, exact predetermined lengths of wire under the working face of a bonding tool |
| 4405074 |
Composite bonding tool and method of making same |
September 20, 1983 |
| A method of making a bonding tool from two different materials is provided. A bonding nib partially made from hard jewel-like material and a bonding nib holder is partially made from a larger and tougher material. The two partially made elements are joined by shrink fitting the nib holde |
| 4315128 |
Electrically heated bonding tool for the manufacture of semiconductor devices |
February 9, 1982 |
| A heated bonding tool for the manufacture of semiconductor devices comprises a high density non-porous alumina body having a mounting portion at one end and a working portion at the other end. The working portion end is tapered and converges toward the working tip portion. An electricall |
| 4073424 |
Second bond positioning wire bonder |
February 14, 1978 |
| An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After position |
