| Patent Number |
Title Of Patent |
Date Issued |
| RE39018 |
High speed method of aligning cutting lines of a workplace using patterns |
March 21, 2006 |
| Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns |
| D455625 |
Dicing blade |
April 16, 2002 |
|
| D453670 |
Dicing blade |
February 19, 2002 |
|
| 7077304 |
Bonding tool with polymer coating |
July 18, 2006 |
| A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface |
| 7004369 |
Capillary with contained inner chamfer |
February 28, 2006 |
| A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having |
| 6997368 |
Fiber alignment process using cornercube offset tool |
February 14, 2006 |
| A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first o |
| 6960022 |
Macrocomposite guideway and gib produced therefrom |
November 1, 2005 |
| A "hybrid" or macrocomposite guideway, wherein the "traditional" or existing guideway material (e.g., hardened steel) is maintained as the wear resistant, low friction surface intended to be in physical contact with one or more bearings, and further wherein this surface is backed up |
| 6955949 |
System and method for reducing or eliminating semiconductor device wire sweep |
October 18, 2005 |
| A method of packaging a semiconductor device is provided. The method includes applying an insulative material across only a portion of at least two of a plurality of conductors providing interconnection between elements in the semiconductor device. The method also includes encapsulat |
| 6910612 |
Capillary with contained inner chamfer |
June 28, 2005 |
| A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes an annular chamfer formed at an inner portion of the end of the working tip, the inner annular chamfer having |
| 6903880 |
Method for providing plural magnified images |
June 7, 2005 |
| A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of i |
| 6872589 |
High density chip level package for the packaging of integrated circuits and method to manufactu |
March 29, 2005 |
| A package for mounting an integrated circuit die. In one embodiment the package comprises a metal substrate having first and second opposing primary surfaces and an aperture formed therebetween. A flexible thin film interconnect structure is formed over the first surface of the metal |
| 6870684 |
Multi-wavelength aperture and vision system and method using same |
March 22, 2005 |
| A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of i |
| 6847122 |
System and method for preventing and alleviating short circuiting in a semiconductor device |
January 25, 2005 |
| A method of packaging a semiconductor device including a plurality of elements is provided. The method includes applying an insulative material to at least a portion of the semiconductor device, where the insulative material includes insulative particles having a diameter smaller than a |
| 6784556 |
Design of interconnection pads with separated probing and wire bonding regions |
August 31, 2004 |
| The present invention provides a solution to the problem of weakening bond integrity in integrated circuit devices due in part to test probes galling and weakening the interconnect pads during functional and reliability test probing. In doing so, the invention enables a lowering of the c |
| 6778274 |
Die attach process using cornercube offset tool |
August 17, 2004 |
| A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offse |
| 6760161 |
Multi-color machine vision system |
July 6, 2004 |
| A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for recei |
| 6729530 |
Fiber alignment apparatus and process using cornercube offset tool |
May 4, 2004 |
| A system and method for aligning optical fibers that takes into account variations due to temperature changes and other nonrandom systemic effects. The system includes an alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the first o |
| 6729527 |
Bonding tool with polymer coating |
May 4, 2004 |
| A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface |
| 6715658 |
Ultra fine pitch capillary |
April 6, 2004 |
| A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip at an end thereof. The working tip includes i) a tapered section having a predetermined angle with respect to the longitudinal axis of the first cyli |
| 6712257 |
Indirect imaging method for a bonding tool |
March 30, 2004 |
| A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset |
| 6705507 |
Die attach system and process using cornercube offset tool |
March 16, 2004 |
| A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offse |
| 6641026 |
Indirect imaging system for a bonding tool |
November 4, 2003 |
| A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset |
| 6634545 |
Solder ball delivery and reflow method |
October 21, 2003 |
| An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is direct |
| 6610930 |
Composite noble metal wire |
August 26, 2003 |
| Composite wires in which a noble metal annulus is welded to an electrically-conductive, non-noble metal wire core. Methods of forming the composite wire and semiconductor packaging having at least one lead bonded to the composite wire are also disclosed. |
| 6608390 |
Wirebonded semiconductor package structure and method of manufacture |
August 19, 2003 |
| A wirebonded semiconductor package structure that provides for high frequency operation, a large number of I/O terminals, controlled low impedance, compensated inductance, electromagnetic shielding against cross-talk and prevention of false signals from ground bounce includes a semic |
| 6599561 |
Method for manufacturing a printed circuit board substrate |
July 29, 2003 |
| An inexpensive and high throughput process for manufacturing a printed circuit board (PCB) substrate includes first weaving a plurality of electrically non-conductive strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven |
| 6562698 |
Dual laser cutting of wafers |
May 13, 2003 |
| A method for singulating semiconductor wafers comprises the steps of aiming a first and a second laser beam over a top surface of the substrate; forming scribe lines in the coating layer by scanning the first laser beam across the coating layer; and cutting through the substrate along th |
| 6555447 |
Method for laser scribing of wafers |
April 29, 2003 |
| A method for laser scribing a semiconductor substrate with coatings on top. The method comprises the steps of focusing a laser beam on a top surface of the substrate coating; absorbing energy from the laser into the coating layer; forming a first set of scribe lines in a first direction |
| 6534877 |
Semiconductor copper bond pad surface protection |
March 18, 2003 |
| Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that i |
| 6529333 |
Multi-color machine vision system |
March 4, 2003 |
| A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for recei |
| 6523733 |
Controlled attenuation capillary |
February 25, 2003 |
| A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter; a second cylindrical section having a first end coupled to an end of the first cylindrical section, the seco |
| 6520400 |
Wire tensioning apparatus |
February 18, 2003 |
| A device and method for providing tension and a reserve wire reservoir to a bonding wire for use with a bonding machine. The device includes an outlet port providing fluid under pressure, and a surface along which the pressurized fluid flows in a direction away from the outlet port such |
| 6497356 |
Controlled attenuation capillary with planar surface |
December 24, 2002 |
| A controlled attenuation bonding tool for bonding a fine wire to a substrate. The bonding tool comprises a first cylindrical section having a substantially uniform first diameter and a second cylindrical section with a substantially uniform second diameter less than the first diameter. T |
| 6420245 |
Method for singulating semiconductor wafers |
July 16, 2002 |
| A method and apparatus for singulating semiconductor wafers is described. The method comprises the steps of aiming a laser beam at a layer placed over the substrate; absorbing energy from the laser beam into the layer; forming scribe lines in the layer by scanning the laser beam across t |
| 6413576 |
Semiconductor copper bond pad surface protection |
July 2, 2002 |
| Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness |
| 6412683 |
Cornercube offset tool |
July 2, 2002 |
| A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset |
| 6386433 |
Solder ball delivery and reflow apparatus and method |
May 14, 2002 |
| An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is direct |
| 6354912 |
Workpiece cutting method for use with dicing machine |
March 12, 2002 |
| Two blades are arranged oppositely at a predetermined interval along the Y-axis. The two blades cut a wafer along two cutting lines at the same time while the two blades are moving along the X-axis. After the wafer is cut along these two cutting lines, the two blades are moved along the |
| 6354285 |
Attachment for a dicing saw |
March 12, 2002 |
| An attachment for a dicing saw having a housing, a carriage mounted in the housing, a bellows coupled to the carriage, and at least one drainage channel in the housing, the attachment including a collector for automatically collecting debris and fallen dice during operation of the di |
| 6352743 |
Semiconductor copper band pad surface protection |
March 5, 2002 |
| Methods of protecting from atmospheric contaminants, or removing atmospheric contaminants from, the bonding surfaces of copper semiconductor bond pads by coating a bond pad with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that i |
| 6234376 |
Supplying a cover gas for wire ball bonding |
May 22, 2001 |
| Method and apparatus for supplying a protective cover gas during ball formation on a wire bonding machine to permit the use of wire formed from metals which may react with air, such as copper or aluminum. |
| 6179197 |
Missing wire detector |
January 30, 2001 |
| A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from |
| 6176414 |
Linkage guided bond head |
January 23, 2001 |
| A bond head for use with a bonding machine. The bond head has an arm assembly; and a linkage coupled between the arm assembly and the frame of the bonding machine. The linkage forms a virtual pivot point below a lower surface of the arm assembly. |
| 6165051 |
Monitoring system for dicing saws |
December 26, 2000 |
| A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a sensor for determining a speed of a blade of the dicing saw. A monitor determines a load placed on the blade by the substrate, where |
| 6142138 |
High speed method of aligning cutting lines of a workpiece using patterns |
November 7, 2000 |
| Two imaging equipment are provided at a pair of cutting blade units, and the two imaging equipment image patterns at first positions in proximity to the center of a wafer at the same time. A controller drives drive mechanisms to align the wafer in such a way that current image patterns a |
| 6136681 |
Tool used in forming a chip scale package |
October 24, 2000 |
| A method of assembling a plurality of semiconductor chips is provided. A portion of a semiconductor wafer containing the plurality of chips is provided. Each of the plurality of chips has a contact pattern area including a pattern of contacts on a surface of the chip. A respective se |
| 6073827 |
Wire bonding capillary with a conical surface |
June 13, 2000 |
| A bonding tool for use with an ultrasonic horn comprising an orifice at a first end of the ultrasonic horn and a capillary having a first tapered end coupled, the first tapered end to the orifice of the ultrasonic horn. |
| 6039234 |
Missing wire detector |
March 21, 2000 |
| A method and apparatus for monitoring the presence of a bonding wire in a wire bonding machine. The apparatus generates an AC signal which is coupled to the bonding tool. A sensor senses a current of the AC signal flowing to the bonding tool and a current of the AC signal returned from |
| 6033288 |
Monitoring system for dicing saws |
March 7, 2000 |
| A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a spindle motor with a blade attached to the spindle motor. A spindle driver is coupled the spindle to drive the spindle at a predeterm |
| 5547537 |
Ceramic carrier transport for die attach equipment |
August 20, 1996 |
| An aligning and positioning system for a bonder including a bond sensor for sensing the X, Y and .theta. coordinates of a substrate at the bonding location and a die sensor for sensing the X, Y and .theta. coordinates of the die on a die transport. A controller correlates the sensed coor |
