| Patent Number |
Title Of Patent |
Date Issued |
| 6937044 |
Bare die carrier |
August 30, 2005 |
| A bare semiconductor circuit die carrier is provided for use in the test of semiconductor circuits, the carrier, comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite |
| 6908364 |
Method and apparatus for probe tip cleaning and shaping pad |
June 21, 2005 |
| A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with a |
| 6745462 |
Method and apparatus for reducing deformation of encapsulant in semiconductor device encapsulati |
June 8, 2004 |
| The invention is a method and apparatus for encapsulating semiconductor dies via stencil printing in which, after the dies have been stencil printed with encapsulant and prior to removal of the stencil from the dies, the edges of the encapsulating material are partially cured in order |
| 6740543 |
Method and apparatus for encapsulating articles by stencil printing |
May 25, 2004 |
| The present invention is a method and apparatus for encapsulating semiconductor dies and other devices using stencil printing techniques. The apparatus includes a pressurized vessel for containing encapsulation material, the apparatus having a head including a slot through which the |
| 6245445 |
Rough electrical contact surface |
June 12, 2001 |
| A method for rendering a surface of a contact rough includes submerging the surface of the contact in an electroplating bath having a dissolved metal salt, and pulsing an electric current through the contact and the bath to form a rough metallic structure on the surface of the contact. |
| 6227437 |
Solder ball delivery and reflow apparatus and method of using the same |
May 8, 2001 |
| An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is direct |
| 6156990 |
Long-wearing impervious conductive wire clamp |
December 5, 2000 |
| A wire bonding machine having a wire clamp comprised of a platinum group metal such as iridium, rhodium, ruthenium, or osmium so as to minimize corrosion due to micro sparking. |
| 5973504 |
Programmable high-density electronic device testing |
October 26, 1999 |
| Generally, in one aspect, apparatus features a structure for routing test signals between pads of a device under test and a tester circuit. The structure features a probe support that includes a substrate having contact points, one for each of the pads to be tested, a number of condu |
| 5423927 |
Die paste transfer system and method |
June 13, 1995 |
| A die paste transfer system wherein a first layer of bonding paste is transfer to a surface of the die as the die moves through the paste station in a controlled manner. The control for the transport controls orientation which the die passes through the paste station and the orientat |
| 5125036 |
Video bond lead locator |
June 23, 1992 |
| An image processing system and method are used to ascertain the position of lead frame beams on a semiconductor lead frame prior to the formation of wire bonds to those lead frame beams. The lead frame beams are illuminated by a light source and light reflected from the lead frame beams |
| 4876791 |
Apparatus for and methods of die bonding |
October 31, 1989 |
| This invention relates to apparatus for and methods of bonding a component to a substrate. More particularly, this invention relates to apparatus for and methods of removing small components, such a dies or other electrical components, from a wafer and bonding the components to a substra |
| 4853968 |
Pattern recognition apparatus and method |
August 1, 1989 |
| A method of operating a pattern recognition apparatus comprises generating a plurality of sub pixel sub signatures from a reference signature, wherein the sub pixel sub signatures correspond to fractional pixel (sub pixel) positions. A target sub signature is compared to each of the sub |
| 4823394 |
Pattern recognition system |
April 18, 1989 |
| A system and method for determining the condition and location of an electronic die on a die holding means is disclosed. The system includes means for illuminating the die and means for generating a video image in which the appearance of the die is enhanced relative to the die holding |
| 4797994 |
Apparatus for and methods of die bonding |
January 17, 1989 |
| Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to whi |
| 4759073 |
Bonding apparatus with means and method for automatic calibration using pattern recognition |
July 19, 1988 |
| A wire bonding apparatus and method incorporating a pattern recognition system wherein there is stored, in a teach mode, signatures representing a pre-determined point on a chip to be bonded, the signatures being obtained at respective 90.degree. locations of the pedestal which carries t |
| 4444349 |
Wire bonding apparatus |
April 24, 1984 |
| A method for high speed bonding of fine wires to electrodes includes a method of teaching the wire bonding tool the exact point of engagement of the bonding tool with the semiconductor. The bonding position point of engagement is employed to calculate a tolerance inflection point rep |
| 4441205 |
Pattern recognition system |
April 3, 1984 |
| An improved pattern recognition system is disclosed which converts rows and columns of digitized video signal elements indicative of light intensity falling on a camera into integrated signatures, one for each of two orthogonal directions. Signatures corresponding to effectively rotated |
| 4437604 |
Method of making fine wire interconnections |
March 20, 1984 |
| The present invention teaches a novel method of making ultrasonic fine wire interconnections between pads on a semiconductor chip and lead out terminals which may be performed with commercially available computer controlled automatic wire bonding machines having an ultrasonic bonding |
| 4361261 |
Apparatus for wire bonding |
November 30, 1982 |
| A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating |
| 4340166 |
High speed wire bonding method |
July 20, 1982 |
| A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool rea |
| 4239144 |
Apparatus for wire bonding |
December 16, 1980 |
| A wire bonding machine for wedge bonding fine wires to semiconductor devices is provided with a rotating bonding head which is mounted on a fixed machine frame and having a X-Y table mounted on the fixed machine frame opposite a vertically movable bonding tool mounted on the rotating |
| 4202482 |
Solenoid actuated wire feed and tearing apparatus |
May 13, 1980 |
| A bonding head of the type having a bonding tool mounted in the bonding tool holder is provided with a pivotable wire clamp which is movable toward and away from the rear of the bonding tool. The wire clamp is pivotally movable to three distinct positions by a single solenoid. The wi |
