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Kingpak Technology Inc. Patents
Assignee:
Kingpak Technology Inc.
Address:
Chu-Pei, Hsin-Chu Hsien, TW
No. of patents:
45
Patents:












Patent Number Title Of Patent Date Issued
8563350 Wafer level image sensor packaging structure and manufacturing method for the same October 22, 2013
The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one s
8093674 Manufacturing method for molding image sensor package structure and image sensor package structu January 10, 2012
A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transpa
8004602 Image sensor structure and integrated lens module thereof August 23, 2011
An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting cha
7598580 Image sensor module package structure with supporting element October 6, 2009
An image sensor module package structure with a supporting element comprises a chip, the supporting element and a light-transmitting element. The chip has light-sensing elements arranged on a light-sensing area of a first surface thereof, first conducting pads electrically connected
7554599 Image sensor module with air escape hole and a method for manufacturing the same June 30, 2009
An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coate
7440263 Image sensor and method for manufacturing the same October 21, 2008
An image sensor and a method for manufacturing the same. The image sensor includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substrate to surround th
7423334 Image sensor module with a protection layer and a method for manufacturing the same September 9, 2008
An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip
7402839 Image sensor package structure July 22, 2008
An image sensor package structure includes a plastic substrate, frame layer, a chip, wires, a transparent layer, and an encapsulate layer. The plastic substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes. T
7368795 Image sensor module with passive component May 6, 2008
An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second surface and a pen
7345360 Multiple chips image sensor package March 18, 2008
A multi-chip image sensor module includes a first substrate; a photosensitive chip arranged on an upper surface of the first substrate; a lens holder mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel arranged within the lens hol
7268346 Method of disassembling an image sensor package September 11, 2007
A method of disassembling an image sensor package, which includes a substrate and a glass layer at opposite sides. The method includes the steps of: providing a film tape adhered to the glass layer; providing a vacuuming means to suck the substrate of the image sensor package; and mo
7250324 Method for manufacturing an image sensor July 31, 2007
A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer on the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip, which is for
7235869 Integrated circuit package having a resistant layer for stopping flowed glue June 26, 2007
An integrated circuit package comprises a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface. The lower surface is formed with a wiring regioins arranged at side of the long slot, and the wiring regions formed w
7233060 Module card structure June 19, 2007
A module card structure includes a structure, a first chip, a second chip, an adhesive layer, and a compound layer. The substrate has an upper surface on which a plurality of golden fingers are formed, and a lower surface. The first chip is mounted on the upper surface of the substrate
7196322 Image sensor package March 27, 2007
An image sensor module includes a substrate, frame layer, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface, and a lower surface on which second electrodes are formed. The frame layer is arranged on the upper surface of the substrate, a cavity
7126219 Small memory card October 24, 2006
A small memory card includes a substrate, a plurality of memory chips, a plurality of wires, and a glue layer, the substrate is formed with a plurality of through slots of the substrate, then the plurality of memory chips are mounted on the substrate, so that the plurality of bounding
7064404 Image sensor structure June 20, 2006
An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four
7015586 Stacked structure of integrated circuits March 21, 2006
A stacked structure of integrated circuits includes a substrate, a lower integrated circuit, a space layer, an upper integrated circuit, and a compound resin. The substrate has an upper surface on which a plurality of signal input terminals are formed at one side of the upper surface,
6940058 Injection molded image sensor module September 6, 2005
An injection molded image sensor module includes an image sensor, an injection molded body for sealing the image sensor, a lens barrel and an aspheric lens. The image sensor includes a substrate, a frame layer on the substrate, a photosensitive chip electrically connected to the substrat
6939456 Miniaturized image sensor module September 6, 2005
A miniaturized image sensor module including a substrate, a photosensitive chip, a transparent layer, an injection molded structure, and a lens barrel. The substrate has an upper surface, a lower surface and a slot. The chip is electrically connected to the lower surface of the substrate
6933493 Image sensor having a photosensitive chip mounted to a metal sheet August 23, 2005
An image sensor includes a substrate, a metal sheet, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has a slot. The metal sheet is attached to the lower surface of the substrate and located under the slot to form a cavity together with the slot. The
6906397 Image sensor having an improved transparent layer June 14, 2005
An image sensor having an improved transparent layer includes a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate has an upper surface formed with a plurality of first connected points. The frame layer is arranged on the upp
6878917 Injection molded image sensor and a method for manufacturing the same April 12, 2005
An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a {character pullout}-shaped s
6876544 Image sensor module and method for manufacturing the same April 5, 2005
An image sensor module and a method for manufacturing the same. The image sensor module includes a substrate, a photosensitive chip mounted to the substrate, a plurality of wires for electrically connecting the photosensitive chip to the substrate, a frame layer mounted to the substr
6874227 Method for packaging an image sensor April 5, 2005
A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface
6870208 Image sensor module March 22, 2005
An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed wi
6838759 Small memory card January 4, 2005
A small memory card with a monitor includes a substrate, at least one memory chip, at least one monitor, and a glue layer. The substrate is formed with an upper surface and a lower surface, the upper surface is formed with a plurality of connected points and a plurality of golden fin
6791842 Image sensor structure September 14, 2004
An image sensor includes a substrate, a frame layer, signal input terminals, a photosensitive chip, a transparent layer, a plurality of wires and a glue layer. The substrate has a first surface and a second surface. The frame layer is placed on the first surface to form a cavity toge
6753203 Method for manufacturing an image sensor June 22, 2004
A method for manufacturing an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a cavity together with the substrate; mounting a photosensitive chip to the upper surf
6751882 Mechanism for positioning a substrate of an image sensor June 22, 2004
A mechanism for positioning a substrate of an image sensor. The substrate has first to fourth edges. The mechanism includes a standard unit, a link unit, and a push-up needle unit. The standard unit has adjacent first and second standard planes, both of which define a positioning region
6747261 Image sensor having shortened wires June 8, 2004
An image sensor having shortened wires. The image sensor includes a substrate composed of metal sheets arranged in a matrix, a photosensitive chip, bonding pads on the chip, a frame layer, wires and a transparent layer placed on the frame layer. Each metal sheet has a first board and a
6740973 Stacked structure for an image sensor May 25, 2004
An image sensor, which is electrically connected to a printed circuit board. The image sensor includes a transparent glass layer on which signal input terminals and signal output terminals are formed, a photosensitive chip on which bonding pads are formed, a substrate, and an integrated
6740967 Image sensor having an improved package structure May 25, 2004
An image sensor includes a substrate, a coating layer, a frame layer, a photosensitive chip, multiple wires, and a transparent layer. The substrate has an upper surface formed with first terminals projecting over the upper surface, and a lower surface formed with second terminals. The
6696738 Miniaturized image sensor February 24, 2004
An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second boards, which are located at dif
6680525 Stacked structure of an image sensor January 20, 2004
An image sensor to be mounted to a printed circuit board. The module includes a substrate, an integrated circuit, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate is composed of metal sheets arranged in a matrix, and a middle board po
6649834 Injection molded image sensor and a method for manufacturing the same November 18, 2003
An injection molded image sensor includes metal sheets arranged in a matrix, an injection molded structure, a photosensitive chip, bonding pads, wires, and a transparent layer. Each metal sheet has a first board, a second board and a third board to form a {character pullout}-shaped s
6646316 Package structure of an image sensor and packaging November 11, 2003
A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer.
6642554 Memory module structure November 4, 2003
A memory module structure of the invention is used for being assembled on a locking device. The memory module includes a substrate and a plurality of memories. The substrate has certain long sides and short sides. Notches are formed on the short sides for being secured by the locking dev
6642137 Method for manufacturing a package structure of integrated circuits November 4, 2003
A package structure for an integrated circuit includes a substrate, an integrated circuit, an adhesive layer, a plurality of wirings, and a glue layer. The substrate has a first surface and a second surface. The first surface is formed with a plurality of signal input terminals. The seco
6590269 Package structure for a photosensitive chip July 8, 2003
A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the uppe
6565008 Module card and a method for manufacturing the same May 20, 2003
A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a b
6521881 Stacked structure of an image sensor and method for manufacturing the same February 18, 2003
A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated
6489572 Substrate structure for an integrated circuit package and method for manufacturing the same December 3, 2002
A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets inclu
6472736 Stacked structure for memory chips October 29, 2002
A stacked structure for memory chips includes a substrate, a lower memory chip, an upper memory chip, and an insulation medium. The substrate has an upper surface, a lower surface and a slot penetrating through the substrate from the upper surface to the lower surface. The lower memory
6400007 Stacked structure of semiconductor means and method for manufacturing the same June 4, 2002
An stacked structure of semiconductor means and method for manufacturing the same, comprises a substrate, a lower semiconductor chip, an adhered glue layer, a plurality of wires and an upper semiconductor chip. The adhered glue layer located between the substrate and the lower semico

 
 
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