| Patent Number |
Title Of Patent |
Date Issued |
| 7609143 |
Multi-layer type over-current and over-temperature protection structure and method for manufactu |
October 27, 2009 |
| A multi-layer type over-current and over-temperature protection structure and a method of manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two over-current and over-temperature protection elements on a compo |
| 7592203 |
Method of manufacturing an electronic protection device |
September 22, 2009 |
| A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second conductive layer on the top surface and the bottom surface, respectively; cutting the substra |
| 7576697 |
Dual polarization antenna device for creating a dual band function |
August 18, 2009 |
| A dual polarization antenna device for creating a dual band function, includes: a first dielectric body, a patch layer, a first phase difference changing structure, a second dielectric body, a common metal layer, a ground layer, a second phase difference changing structure, a first a |
| 7554509 |
Column antenna apparatus and method for manufacturing the same |
June 30, 2009 |
| A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a metal layer with at least two spiral structures on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna app |
| 7528467 |
IC substrate with over voltage protection function |
May 5, 2009 |
| The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install |
| 7466268 |
Frequency adjustable antenna apparatus and a manufacturing method thereof |
December 16, 2008 |
| A frequency adjustable antenna apparatus and a manufacturing method thereof are disclosed. The antenna apparatus includes a plurality of antenna paths and the length of the antenna path is changed via the soldering pads. Therefore, the receiving frequency of the antenna can be change |
| 7414592 |
Antenna apparatus |
August 19, 2008 |
| An antenna apparatus includes a hollow column, a conductive cable, a first metal wire, a column structure, and a second metal wire. The conductive cable is received in the hollow column, and the conductive cable electrically contacts the hollow column via a second conductive wire lay |
| 7414514 |
Resettable chip-like over-current protection devices |
August 19, 2008 |
| The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structur |
| 7342554 |
Column antenna apparatus and a manufacturing method thereof |
March 11, 2008 |
| A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a spiral metal layer on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body |
| 7256742 |
Flexible antenna apparatus and a manufacturing method thereof |
August 14, 2007 |
| A flexible antenna apparatus and a manufacturing method thereof are provided for wireless communication devices. The flexible antenna has a metal layer with an adhesive layer pasted onto the back surface of the metal layer, so that it can be directly pasted onto the housing of the wi |
| 7253505 |
IC substrate with over voltage protection function |
August 7, 2007 |
| The present invention relates to an IC substrate provided with over voltage protection functions and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to install |
| 7212166 |
Antenna structure |
May 1, 2007 |
| An antenna module has a PCB with a plurality of contacts, a support element, and an antenna module. The support element has a support portion extended downwardly therefrom. The antenna module is connected with the support element. The antenna structure has a metal support element fixed |
| 7138900 |
Resetable over-current protection device and method of making the same |
November 21, 2006 |
| The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are p |
| 7135415 |
Insulated structure of a chip array component and fabrication method of the same |
November 14, 2006 |
| An insulated structure of a chip array component and fabrication method of the same, the element is fabricated by enclosing its main body with a dense layer of high surface insulation resistance material, and then exposing the portions of the main body where terminal electrodes are to |
| 7123125 |
Structure of a surface mounted resettable over-current protection device and method for manufact |
October 17, 2006 |
| The present invention is directed to a structure of a surface mounted resettable over-current protection device and a method for manufacturing the same. First, a raw material substrate having two ends is provided. On each of the two ends of the raw material substrate, a patterned con |
| 7081862 |
Integrated active satellite antenna module |
July 25, 2006 |
| An integrated active satellite antenna module has a low loss filter, a low noise amplifier, a switch, a chip, two input ends and an output end. A front-end microwave circuit is used for resolving the mutual coupling effect between the satellite antenna and the other antennas operating at |
| 6965167 |
Laminated chip electronic device and method of manufacturing the same |
November 15, 2005 |
| The present invention discloses a laminated chip electronic device and a method of manufacturing the same. In the laminated chip electronic device and the method of manufacturing the same according to the present invention, a body is made of a non-linear resistance coefficient material |
| 6952602 |
GPS receiving antenna for cellular phone |
October 4, 2005 |
| A GPS receiving antenna for cellular phone is configurated into a L-shaped frame, a Y-shaped frame, or a U-shaped frame so as to achieve the best capturing effect of the radio wave radiated from the satellite. It is not necessary to use materials of specially high dielectric constant for |
| 6867748 |
Multi-combined multi-frequency antenna |
March 15, 2005 |
| Disclosed herein is a multi-combined multi-frequency antenna, and in particular, to an antenna which has a helically wound conductor and a plate type or a linear type conductor, so as to form a multi-combined antenna which is operatable against various frequency bands. |
| 6849954 |
IC package substrate with over voltage protection function |
February 1, 2005 |
| The present invention relates to an IC package substrate provided with over voltage protection function and thus, a plurality of over voltage protection devices are provided on a single substrate to protect an IC chip directly. According to the present invention, there is no need to |
| 6756946 |
Multi-loop antenna |
June 29, 2004 |
| A multi-loop antenna includes two or more than two antennas units with different lengths, receiving signals with different frequencies respectively; and several slices of conductors, with different lengths, making the connections between above-mentioned antennas units. As different c |
| 6717554 |
Dual-band dual-polarization antenna |
April 6, 2004 |
| A substance structure of a dual-band dipole antenna, it consists of: an internal conductor, which is formed by a lead coated with an internal insulation layer; an external conductor, which is formed by a grounding layer coated or coiled to the said internal insulation layer, and an e |
| 6707108 |
Transient voltage suppressor structure |
March 16, 2004 |
| A kind of transient voltage suppressor structure that prevents the edge of the signal electrode from contacting with the variable impedance material by using an insulation layer to remove the point discharge existing on the edge of the signal electrode and increase the capability of the |
| 6645393 |
Material compositions for transient voltage suppressors |
November 11, 2003 |
| The material for transient voltage suppressors is composed of at least two kinds of evenly-mixed powders including a powder material with non-linear resistance interfaces and a conductive powder. The conductive powder is distributed in the powder with non-linear resistance interfaces to |
| 6498715 |
Stack up type low capacitance overvoltage protective device |
December 24, 2002 |
| Stack up type low capacitance overvoltage protective device is composed of a substrate; a conductive low electrode layer formed on the substrate; a voltage sensitive material layer formed on the conductive lower electrode layer; and a conductive upper electrode layer formed on the voltag |
| 6298544 |
Method of fabricating a high frequency thin film coil element |
October 9, 2001 |
| Disclosed herein is a method of fabricating a high frequency thin film coil element having a main coil body composed of a rod shaped ceramic substrate, a thin metallic film layer covering the ceramic substrate, a conductor layer covering the thin metallic film layer, and a plurality of |
