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Industry-University Cooperation Foundation Hanyang University Patents
Assignee:
Industry-University Cooperation Foundation Hanyang University
Address:
Seoul, KR
No. of patents:
9
Patents:




Patent Number Title Of Patent Date Issued
7624320 Apparatus for testing system-on-chip November 24, 2009
A system-on-chip (SoC) test apparatus is disclosed. The system-on-chip (SoC) testing apparatus reduces a test time due to a small amount of overhead in the case of testing an AMBA-based system-on-chip (SoC) using a TIC, an EBI, and a Test Harness, and maintains AMBA- or TIC- compatib
7613344 System and method for encoding and decoding an image using bitstream map and recording medium th November 3, 2009
Disclosed are a system and method for encoding and decoding an image. The image compression system includes an image segmentation unit (110) for segmenting a first image into a plurality of sub-images; a first encoding unit (120) for encoding the sub-images to output sub-image bitstreams
7592239 Flexible single-crystal film and method of manufacturing the same September 22, 2009
The present invention relates to a flexible single-crystal film and a method of manufacturing the same from a single-crystal wafer. That is, the present invention can manufacture a silicon-on-insulator (SOI) wafer comprising a base wafer, one or more buried insulator layers, and a si
7577185 Finger for symbol-rate weighting using in smart antenna system, and its application for demodula August 18, 2009
The present invention relates to a finger using symbol-rate weighting in Smart Antenna System, and an apparatus and method for Demodulating signals using such a finger. The present invention is useful in a wireless communication network having a reverse pilot channel. Further, by usi
7554308 Digital DC-DC converter using digital modulation June 30, 2009
A digital DC-DC converter is implemented using first-order delta-sigma modulation, rather than A/D conversion. In the DC-DC converter, a PWM generator converts an input DC voltage to a preset level DC voltage according to an input PWM signal. A converter converts the DC voltage from
7491342 Bonded semiconductor substrate manufacturing method thereof February 17, 2009
The present invention provides a bonded substrate fabricated to have its final active layer thickness of 200 nm or lower by performing the etching by only 1 nm to 1 .mu.m with a solution having an etching effect on a surface of an active layer of a bonded substrate which has been prepare
7196336 Apparatus for injecting plasma gas in atmosphere March 27, 2007
An apparatus for injecting plasma in the atmosphere is provided, including a plurality of dielectric panels (13a, 13b, 13c), and 13d, which are disposed in parallel at predetermined intervals, a gas supply portion (14), to which the dielectric panels (13a, 13b, 13c, and 13d) are fixed
7022628 Method for forming quantum dots using metal thin film or metal powder April 4, 2006
Disclosed herein is a method for forming quantum dots, comprising the steps of (a) depositing a metal thin layer onto a substrate, (b) coating a dielectric precursor onto the metal thin layer, and (c) stepwisely heating the resultant substrate; or a method for forming quantum dots, c
6912074 Method of producing a big size holographic projection screen for displaying a three-dimensional June 28, 2005
A method of producing a big size holographic screen for projection of the stereoscopic or multiview 3-dimensional color images is proposed, where a narrow and elongate slit-shaped diffuser is recorded on the hologram as an object to ensure the well defined viewing zone forming in course

 
 
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