| Patent Number |
Title Of Patent |
Date Issued |
| RE40947 |
Multilayer printed wiring board and its manufacturing method, and resin composition for filling |
October 27, 2009 |
| A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a fill |
| D538911 |
Particulate filter for diesel engine |
March 20, 2007 |
|
| D534264 |
Particulate filter for diesel engine |
December 26, 2006 |
|
| D530003 |
Particulate filter for diesel engine |
October 10, 2006 |
|
| D523544 |
Particulate filter for diesel engine |
June 20, 2006 |
|
| D523543 |
Particulate filter for diesel engine |
June 20, 2006 |
|
| D522117 |
Particulate filter for diesel engine |
May 30, 2006 |
|
| D319814 |
Semi-conductor substrate with conducting pattern |
September 10, 1991 |
|
| D319629 |
Semiconductor substrate with conducting pattern |
September 3, 1991 |
|
| D319045 |
Semi-conductor substrate with conducting pattern |
August 13, 1991 |
|
| D318461 |
Semi-conductor mounting substrate |
July 23, 1991 |
|
| 7622183 |
Multilayer printed wiring board with filled viahole structure |
November 24, 2009 |
| The present invention provides a multilayer printed wiring board having a filled viahole structure advantageously usable for forming a fine circuit pattern thereon, and having an excellent resistance against cracking under a thermal shock or due to heat cycle. The multilayer printed wiri |
| 7615162 |
Printed wiring board and method for manufacturing the same |
November 10, 2009 |
| A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of t |
| 7611764 |
Honeycomb structure |
November 3, 2009 |
| It is to provide a honeycomb structural body having an excellent durability, which is large in the catching amount of particulates per unit volume and does not cause uneven accumulation of ash and occurrence of cracks or the like even in use for a long period of time, and there is pr |
| 7603852 |
Exhaust gas purification apparatus |
October 20, 2009 |
| An exhaust gas purification apparatus 10 includes an engine 20, a manifold 22 connected to the engine 20 and through which exhaust gas generated by burning fuel flows, and a casing 26 connected to the manifold 22 and holding a honeycomb filter 30 with a catalyst carried thereon. In the |
| 7594320 |
Method of manufacturing printed wiring board |
September 29, 2009 |
| A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (7) having a conductor circuit (6). The solder resist is then heat-cured to form an insulating film (1) having a low thermal expansion coefficient. A laser beam (2) is then applied to the |
| 7589394 |
Interposer |
September 15, 2009 |
| An interposer is constructed with a substrate body having first and second through-holes, a capacitor formed by a laminating dielectric layer and a second electrode portion on a first electrode portion, which is structured on inner surfaces of first and second through-holes and on the |
| 7588716 |
Peripheral layer forming method for manufacturing honeycomb structure |
September 15, 2009 |
| A peripheral layer forming apparatus for coating a pillar-shaped member with a peripheral layer. The apparatus includes supporting members configured to sandwich the member from both sides and support the member so that an axis of the member is maintained in a horizontal orientation. |
| 7585541 |
Printed wiring board and method for manufacturing the same |
September 8, 2009 |
| A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of t |
| 7585471 |
Honeycomb structured body and exhaust gas purifying device |
September 8, 2009 |
| The honeycomb structured body of the present invention is a pillar-shaped honeycomb structured body having a honeycomb structure that a number of through holes are placed in parallel with one another in the length direction with a wall portion interposed therebetween and one of ends of |
| 7578625 |
Optical fiber array |
August 25, 2009 |
| An optical fiber array 10 includes: a substrate 30 with housing grooves 34 for housing optical fibers 24 formed therein; a cover plate 12 for covering the optical fibers 24 that are housed in the housing grooves 34; and an adhesive layer 16 for joining the substrate 30 with the optical |
| 7576035 |
Honeycomb structure and method for manufacturing honeycomb structure |
August 18, 2009 |
| A pillar-shaped honeycomb structure has a plurality of cells longitudinally placed in parallel with one another with a wall portion therebetween, wherein the honeycomb structure mainly includes inorganic fibers which form the honeycomb structure without lamination interfaces. |
| 7575727 |
Catalytic converter and method for manufacturing the same |
August 18, 2009 |
| A catalytic converter includes a catalyst carrier, a metal shell covering the outer periphery of the catalyst carrier, and a holding and sealing material disposed between the catalyst carrier and the metal shell.The holding and sealing material is a beltlike holding and sealing material |
| 7574085 |
Optical transmission structural body, optical waveguide, optical waveguide formation method, and |
August 11, 2009 |
| An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion being connected to |
| 7572415 |
Catalyst converter and diesel, particulate filter system |
August 11, 2009 |
| A holding and sealing material for disposal between a catalyst carrier and a metal shell covering the outer face of the catalyst carrier. The holding and sealing material includes an inorganic fiber mat subjected to needle punching producing needled holes having a density of 50-3,000 per |
| 7568922 |
Printed wiring board having a solder pad and a method for manufacturing the same |
August 4, 2009 |
| This invention provides a printed wiring board having an intensified drop impact resistance of a joint portion between pad and solder. An electrode pad comprises pad portion loaded with solder ball and a cylindrical portion projecting to the solder ball supporting the pad portion. An |
| 7566835 |
Multilayer printed wiring board and component mounting method thereof |
July 28, 2009 |
| A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the |
| 7559967 |
Honeycomb filter |
July 14, 2009 |
| A honeycomb filter includes a honeycomb structure in which a plurality of cells are placed in parallel with one another in the longitudinal direction with a cell wall therebetween; and a cylindrical metal casing that covers the outer peripheral side face of the honeycomb structure. A |
| 7559703 |
Optical module and data communication system including the optical module |
July 14, 2009 |
| An optical module includes a fiber array, a laser diode array, a photodiode array and a micro-lens array. The fiber array includes optical fibers which are divided to a transmitter group and a receiver group. The laser diode array includes laser diodes which are grouped in a transmit |
| 7556782 |
Honeycomb structured body |
July 7, 2009 |
| A honeycomb structured body of the present invention is a pillar-shaped honeycomb structured body comprising a large number of through holes that are longitudinally placed in parallel with one another with a partition wall therebetween, wherein the large number of through holes include a |
| 7556666 |
Honeycomb structure |
July 7, 2009 |
| A honeycomb structure including a plurality of porous ceramic members which are bonded through an adhesive layer, each of the porous ceramic members has a plurality of cells, which are arranged in parallel while being separated by cell walls. The cells extend in a longitudinal direct |
| 7553531 |
Honeycomb structure |
June 30, 2009 |
| A honeycomb structure is disclosed that includes plural honeycomb units bonded together by using a sealing material layer, each of the honeycomb units including plural through-holes separated by plural partition walls and provided in parallel along a longitudinal direction. Each of the |
| 7552531 |
Method of manufacturing a printed wiring board having a previously formed opening hole in an inn |
June 30, 2009 |
| A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the inn |
| 7551812 |
Optical module, method of manufacturing the optical module, and data communication system includ |
June 23, 2009 |
| An optical module includes a fiber array, a laser diode array and a photodiode array. The fiber array has optical fibers which are divided to a transmitter group and a receiver group. The laser diode array has laser diodes which are grouped in a transmitter group. The photodiode array ha |
| 7550119 |
Regeneration device of exhaust gas purification filter and filter regeneration method |
June 23, 2009 |
| A regeneration device of an exhaust gas purification filter that reduces the regeneration time of the filter. The regeneration device includes a plurality of first temperature detectors (26a, 26b) arranged in casings to detect the temperature in each casing and a second temperature d |
| 7550026 |
Honeycomb filter |
June 23, 2009 |
| A honeycomb filter includes at least one pillar-shape honeycomb structured body including a plurality of cells partitioned by partitions, and plugs for sealing upstream openings of a plurality of first cells selected from the plurality of cells and for sealing downstream openings of a pl |
| 7543513 |
Honeycomb structure mounting base and honeycomb structure inspection apparatus |
June 9, 2009 |
| A honeycomb structure mounting base includes a mounting member having a structure mounting surface configured to contact an entire end face of a honeycomb structure including a periphery of the honeycomb structure; a preliminary mounting member having a preliminary mounting surface c |
| 7541006 |
Honeycomb structured body |
June 2, 2009 |
| A honeycomb structured body of the present invention is configured by assembling one or at least two pillar-shaped porous ceramic member in which a number of through holes are longitudinally placed in parallel with one another with a partition wall therebetween, either one of ends of |
| 7540898 |
Honeycomb structured body |
June 2, 2009 |
| A honeycomb structured body of the present invention is a honeycomb structured body in which a plurality of porous ceramic members are combined with one another through an adhesive layer, each of the porous ceramic members having a plurality of cells which are allowed to penetrate in |
| 7535095 |
Printed wiring board and method for producing the same |
May 19, 2009 |
| The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in fracture toughness, dielectric constant, adhesion and processability, among other characteristics.The present invention is directed to a multilayer printed circuit boa |
| 7534482 |
Honeycomb structural body |
May 19, 2009 |
| A honeycomb structural body is constituted with a ceramic block made by arranging a plurality of through-holes side by side in the longitudinal direction through partition walls and sealing either one end portions of these through-holes. The ceramic block of this honeycomb structural bod |
| 7526152 |
Substrate for mounting IC chip, substrate for motherboard, device for optical communication, man |
April 28, 2009 |
| The present invention aims to provide a substrate for mounting an IC chip, on which an optical signal passing region is formed and which can suppress a transmission loss in an optical signal and transmit an optical signal more positively with high reliability. The substrate for mounting |
| 7525190 |
Printed wiring board with wiring pattern having narrow width portion |
April 28, 2009 |
| A filet F is added to a portion constituting a corner portion C equal to or smaller than 90.degree. in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected i |
| 7525175 |
Package substrate with built-in capacitor and manufacturing method thereof |
April 28, 2009 |
| When a package substrate with a built-in capacitor includes a first thin-film small electrode 41aa and a second thin-film small electrode 42aa that are electrically short-circuited to each other via a pinhole P in a high-dielectric layer 43, a power supply post 61a and a via hole 61b |
| 7524350 |
Ceramic honeycomb structural body |
April 28, 2009 |
| This honeycomb structural body is made from a sintered body having a pore structure wherein pores having a pore size ranging from 1.0 .mu.m to about 150 .mu.m are a first pore group and pores having a pore size ranging from about 0.006 or more to less than 1.0 .mu.m are a second pore |
| 7521025 |
Honeycomb structural body |
April 21, 2009 |
| An object of the present invention is to provide a honeycomb structural body for use in a filter, which can be provided with a large amount of catalyst, can suppress an increase in pressure loss upon collecting particulates, can have a high particulate collecting capability and can e |
| 7520178 |
Method for inspecting honeycomb fired body and method for manufacturing honeycomb structured bod |
April 21, 2009 |
| A method for inspecting a honeycomb fired body includes transporting the honeycomb fired body along a transportation line, and inspecting the honeycomb fired body for a crack during the transporting step. |
| 7517502 |
Honeycomb structural body |
April 14, 2009 |
| An object of the present invention is to provide a honeycomb structural body which makes it possible to prevent a thermal stress from concentrating on plugs for sealing a group of inlet-side through holes and the vicinity thereof during a regenerating process, and consequently to pre |
| 7514779 |
Multilayer build-up wiring board |
April 7, 2009 |
| Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 .mu.m. The reason is |
| 7514637 |
Electroplating solution, method for fabricating multilayer printed wiring board using the soluti |
April 7, 2009 |
| The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The |
