Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
IMEC vzw Patents
Assignee:
IMEC vzw
Address:
Leuven, BE
No. of patents:
51
Patents:


1 2


Patent Number Title Of Patent Date Issued
7160482 Composition comprising an oxidizing and complexing compound January 9, 2007
The present invention is related to a composition comprising an oxidizing compound and a complexing compound with the chemical formula wherein R1, R2, R3 and R4 are selected from the group consisting of H and any organic side chain. The oxidizing compound can be in the form of an aqueous
7042091 Fluorinated hard mask for micropatterning of polymers May 9, 2006
The present invention discloses the formation of a hard mask layer in an organic polymer layer by modifying at least locally the chemical composition of a part of said exposed organic low-k polymer. This modification starts from an exposed surface of the polymer and extends into the
7009645 Constant resolution and space variant sensor arrays March 7, 2006
A sensor array is described comprising a substantially constant resolution portion comprising a first series of first concentric closed rings, each first closed ring comprising a monodimensional array of equally spaced sensor element location sites, each location site including at aleast
6910487 Method and apparatus for liquid-treating and drying a substrate June 28, 2005
The present invention is related to a method and apparatus for liquid treating and drying a substrate, such as a semiconductor wafer, the method comprising the step of immersing a substrate or a batch of substrates in a tank filled with a liquid, and removing the substrate(s) through an
6904091 Methods and apparatus for progressive transmission of subband images June 7, 2005
Images are subband transformed to create a plurality of subband images. Each subband image includes a plurality of pixels. Each pixel is represented by a plurality of bits with each bit associated to a certain quantization level. Encoding of an image requires scanning essentially all
6898233 Programmable modem apparatus for transmitting and receiving digital data, design method and use May 24, 2005
The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to
6833868 Method and device for determining corrected color aspects of a pixel in an imaging device December 21, 2004
The invention is a method for determining at least two corrected color values for a pixel, said pixel being embedded in a configuration of pixels and having a color filter for filtering substantially one color type while obtaining a measurement on the pixel. The method comprises the step
6812161 Method of manufacturing surface textured high-efficiency radiating devices and devices obtained November 2, 2004
A method of texturing a surface of a substrate, includes providing a substrate, and distributing separate particles of an overlayer material in a substantially random pattern over at least a part of a surface of the substrate. The substantially random pattern of separate particles is use
6812078 Method for transferring and stacking of semiconductor devices November 2, 2004
A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred t
6730997 Method of transferring ultra-thin substrates and application of the method to the manufacture of May 4, 2004
The present invention provides a method of transfer of a first planar substrate with two major surfaces to a second substrate, comprising the steps of forming the first planar substrate, attaching one of the major surfaces of the first planar substrate to a carrier by means of a release
6683367 Thin-film opto-electronic device and a method of making it January 27, 2004
The present invention is related to a thin-film opto-electronic device and a method of fabricating the same. Particularly this thin film opto-electronic device is fabricated on a Si-containing substrate. The thin-film material is a crystalline semiconductor material. In order to incr
6615066 Gastrointestinal probe September 2, 2003
Gastrointestinal probe (2) comprising a sensitive material (4) which is able to be connected to electrical or optical readout means or measurement means (10) characterized in that said sensitive material (4) undergoes an irreversible change when it is submitted to the cumulative action o
6597727 Programmable modem apparatus for transmitting and receiving digital data, design method and use July 22, 2003
The programmable modem for digital data of the present invention provides a highly programmable, digital modem implemented in an integrated circuit which can be customized to specific applications. The programmable modem uses spread spectrum techniques and is specifically programmable to
6585811 Method for depositing copper or a copper alloy July 1, 2003
The present invention is related to the fabrication of at least a part of a Cu-containing layers or a Cu-containing pattern used for the electrical connection of active or passive devices as well as integrated circuits. Such Cu-containing patterns and/or layers are formed on an activated
6576505 Method for transferring and stacking of semiconductor devices June 10, 2003
A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred t
6566745 Image sensor ball grid array package and the fabrication thereof May 20, 2003
The present invention is related to an image sensor packaging technique based on a Ball Grid Array (BGA) IC packaging technique, further referred to as image sensor ball grid array (ISBGA). A transparent cover is attached to a semiconductor substrate. Depending on the method of attac
6545334 Device and a method for thermal sensing April 8, 2003
A device for thermal sensing is disclosed based on only one thermopile. The cold junctions of said thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions of said thermopile are coupled thermally to a second channel comprising a second sub
6504152 Probe tip configuration and a method of fabrication thereof January 7, 2003
A probe tip configuration, being part of a probe (FIG. 2) for use in a scanning proximity microscope, is disclosed, comprising a cantilever beam (1) and a probe tip. Said tip comprises a first portion of a tip (2) and at least one second portion of a tip (5). Said first portion of a tip
6486509 Non-volatile memory cell November 26, 2002
The present invention is related to a non-volatile memory cell, comprising a semiconductor substrate including a source region and a drain region with a channel region there between; a floating gate of a conductive material at least partially extending over a first portion of said channe
6398855 Method for depositing copper or a copper alloy June 4, 2002
The present invention is related to the fabrication of at least a part of a Cu-containing layers or a Cu-containing pattern used for the electrical connection of active or passive devices as well as integrated circuits. Such Cu-containing patterns and/or layers are formed on an activated
6384317 Solar cell and process of manufacturing the same May 7, 2002
The solar cell in the semiconductor substrate includes at least a radiation receiving front surface and a second surface. The substrate includes a first region of one type of conductivity and a second region of the opposite conductivity type with at least a first part located adjacent to
6380605 Device and a method for thermal sensing April 30, 2002
A device for thermal sensing is disclosed based on only one thermopile. The cold junctions of said thermopile are coupled thermally to a first channel comprising a first substance while the hot junctions of said thermopile are coupled thermally to a second channel comprising a second sub
6362484 Imager or particle or radiation detector and method of manufacturing the same March 26, 2002
The present invention may provide a particle or radiation detector or imager which may be used for accurate recording of medical (2-D) X-ray images. The imager includes at least one detector panel. The detector panel includes a microgap detector with an array of pixel electrodes of a
6358866 Method for post-oxidation heating of a structure comprising SiO2 March 19, 2002
The present invention is related to a method for post-oxidation heating of at least one substrate comprising at least a SiO.sub.2 layer or a SiO.sub.2 /poly-Si layer structure, comprising the steps of: creating an inert gaseous ambient in a furnace, said ambient having a partial pressure
6352936 Method for stripping ion implanted photoresist layer March 5, 2002
The present invention concerns a method for stripping the photoresist layer and the crust from a semiconductor. The crust has been formed with as a result of an ion implantation step, wherein the method comprises an ion assisted plasma step using a mixture of water vapour, helium and a
6330465 Gastro-intestinal probe December 11, 2001
Gastrointestinal probe (2) comprising a sensitive material (4) which is able to be connected to electrical or optical readout means or measurement means (10) characterized in that said sensitive material (4) undergoes an irreversible change when it is submitted to the cumulative action o
6328902 Probe tip configuration and a method of fabrication thereof December 11, 2001
A probe tip configuration, being part of a probe (FIG. 2) for use in a scanning proximity microscope, is disclosed, comprising a cantilever beam (1) and a probe tip. Said tip comprises a first portion of a tip (2) and at least one second portion of a tip (5). Said first portion of a tip
6322598 Semiconductor processing system for processing discrete pieces of substrate to form electronic d November 27, 2001
A semiconductor processing system for the production of semiconductor electronic devices is described, which includes a sequence of semiconductor processing steps carried out on a plurality of semiconductor processing machines, whereby the processing is carried out on discrete pieces
6303522 Oxidation in an ambient comprising ozone and the reaction products of an organic chloro-carbon p October 16, 2001
The present invention is related to an efficient thermal oxidation process that allows the controlled growth of in-situ cleaned high quality thin oxides on a silicon-containing substrate. Said oxidation is performed in an ambient comprising at least the reaction products of a chloro-carb
6245489 Fluorinated hard mask for micropatterning of polymers June 12, 2001
The present invention discloses the formation of a hard mask layer in an organic polymer layer by modifying at least locally the chemical composition of a part of said exposed organic low-k polymer. This modification starts from an exposed surface of the polymer and extends into the
6153484 Etching process of CoSi.sub.2 layers November 28, 2000
The present invention relates to methods for controlling the etching rate of CoSi.sub.2 layers by adjusting the pH of an HF-based solution to obtain the desired etch rate. The pH of the HF-based solution may be adjusted by adding pH modifying chemicals to the solution. A further aspect o
6096657 Method for forming a spacer August 1, 2000
A method is disclosed for forming a spacer, wherein said formation is preferably performed in a single dry etch sequence in a single dry etch tool. In this single dry etch sequence subsequently polysilicon spacers are defined, used as an etch mask and removed. Said etch sequence comp
6093577 Low temperature adhesion bonding method for composite substrates July 25, 2000
A method of bonding a first substrate (10) to a second substrate (30) is described, comprising the steps of: coating an adhesive (28) onto a first major surface of said first substrate (10); aligning said first and second substrates (10, 30) so that said coated first major surface of sai
6058211 Data compression method and apparatus May 2, 2000
The present invention relates to a method and apparatus for compressing digital data, such as the digital representation of a colored image. A scanning routine is described which aims to maintain the integrity of regions of the image that the human visual system also finds important.
6044015 Method of programming a flash EEPROM memory cell array optimized for low power consumption March 28, 2000
The present invention is a method for programming SSI cells or an array of said cells. The method achieves very fast programming while consuming only a very small amount of power, which paves the way for new applications such as battery-operated systems, page-mode programming for very hi
6043882 Emission microscope and method for continuous wavelength spectroscopy March 28, 2000
A photon-emission microscope method and system are described which allow both emission spot localization and continuous spectral analysis of the emited light from the emission spot of a biased electronic circuit. The system includes an emission microscope, a detector and an in-line, dire
6038248 Method and apparatus for receiving and converting spread spectrum signals March 14, 2000
A method and apparatus for receiving and converting spread spectrum signals is disclosed. The method and apparatus allow the receiving of spread spectrum signals and different frequency bands substantially simultaneously on the same chain of hardware components. The received signals
6006121 Gastrointestinal probe December 21, 1999
Gastrointestinal probe (2) comprising a sensitive material (4) which is able to be connected to electrical or optical readout devices or measurement devices (10) such that the sensitive material (4) undergoes an irreversible change when it is submitted to the cumulative action of the
5954068 Device and method for treating substrates in a fluid container September 21, 1999
A device for treatment of substrates in a fluid container includes a container containing a treatment fluid and a substrate transport device moveable into a position above the container. The substrate transport device has at least one substrate holding device for securing the substra
5953060 Method for reducing fixed pattern noise in solid state imaging devices September 14, 1999
An amplifying circuit comprising an amplifying element and a memory element as well as an element to adjust the signal in an output terminal of the amplifying element to a known level, a measure of the corresponding level in a control terminal of the amplifying element being stored on th
5933190 Pixel structure, image sensor using such pixel structure and corresponding peripheral circuitry August 3, 1999
A pixel structure for CMOS imaging applications, the pixel structure including a photosensitive element, a load transistor in series with the photosensitive element, a first reading transistor, coupled to the photosensitive element and to the load transistor, for reading out signals
5922624 Method for semiconductor processing using mixtures of HF and carboxylic acid July 13, 1999
Method for semiconductor processing comprising etching of oxide layers, especially etching thick SiO.sub.2 layers and/or last step in the cleaning process wherein the oxide layers are etched in the gas phase with a mixture of hydrogen fluoride and one or more carboxylic acids, eventually
5918035 Method for processor modeling in code generation and instruction set simulation June 29, 1999
A method of modeling a programmable processor is particularly adapted for use in an automatic retargetable code generator and instruction set simulator. The method represents the processor as a single graph with vertices and edges. The graph includes the instruction set of the proces
5915838 Method and apparatus for local temperature sensing for use in performing high resolution in-situ June 29, 1999
An apparatus and method for measuring a parameter of a sample or component at a measurement temperature, wherein the parameter and the measurement temperature are measured at substantially the same time. A temperature coefficient of the sample or component is also established by using
5871888 Method of forming multiple-layer microlenses and use thereof February 16, 1999
A method of forming refractive microlenses which includes the steps of depositing or growing a first transparent layer on a substrate; depositing or growing a second transparent layer on the first transparent layer; forming a columnar structure in the second transparent layer; forming a
5798520 Cell for optical-to-electrical signal conversion and amplification, and operation method thereof August 25, 1998
An optoelectronic cell structure includes a plurality of pnpn-devices and circuitry for driving these pnpn-devices. The anodes or the cathodes of said pnpn-devices tied together form a competition node allowing differential charge amplification to take place. The unconnected electrode
5779802 Thin film deposition chamber with ECR-plasma source July 14, 1998
A process chamber is described wherein a plasma is generated by electron-cyclotron resonance (ECR) and is isolated from chamber walls by a magnetic field from two diametrically-opposed solenoids. A substance to be deposited on a substrate is introduced into the chamber by laser ablation,
5742814 Background memory allocation for multi-dimensional signal processing April 21, 1998
Data storage and transfer cost is responsible for a large amount of the VLSI system realization cost in terms of area and power consumption for real-time multi-dimensional signal processing applications. Applications or this type are data-dominated because they handle a large amount of
5731584 Position sensitive particle sensor and manufacturing method therefor March 24, 1998
A microgap sensor, and manufacturing method therefor, which includes a cathode and at least one strip anode parallel to the cathode, in which the strip anode is separated and insulated from the cathode by an insulation layer made from a polymeric material. The microgap sensor further inc
5726065 Method of preparing solar cell front contacts March 10, 1998
Method of preparing on a solar cell the top contact pattern which consists of a set of parallel narrow finger lines and wide collector lines deposited essentially at right angles to the finger lines on the semiconductor substrate, characterized in that it comprises at least the follo
1 2

 
 
  Recently Added Patents
Electrically driven power steering apparatus
Apparatus and method for partitioning moving picture data
Permanent magnet motor
Tooling assembly
Wave energy recovery system
Channel estimation for time division duplex communication systems
Mobile station controlling antenna directionality
  Randomly Featured Patents
Neurostimulation delivery during transurethral prostate treatment
Optical disk device
Circuit and method for the radiotelemetry of esophageal pH in an ECG radiotelemetry system
Apparatus and method for preparing winding mandrels and cores for rewinding machines
Counterrotatable booster compressor assembly for a gas turbine engine
Ethylene/propylene copolymer rubbers
Dipstick wiper
Slingshot
System for after-run heating of a vehicle interior
Arch telephone