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I C MIC-Process, Inc. Patents |
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Assignee: I C MIC-Process, Inc.
Address: Santa Ana, CA
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 5868609 |
Wafer carrier rotating head assembly for chemical-mechanical polishing apparatus |
February 9, 1999 |
| A chemical-mechanical polishing apparatus includes a wafer carrier with a very low center of gravity which allows pressure to be applied evenly on a wafer being polished. The wafer carrier includes top, center, and bottom mating subassemblies with only the center and bottom subassembly o |
| 5843269 |
Slurry dispensing system for chemical-mechanical polishing apparatus |
December 1, 1998 |
| Chemical-mechanical polishing apparatus includes three subassemblies, a top subassembly which is non-rotating but which has a lower section which forms a shell about a center and a lower subassembly both of which rotate within the shell. The system also includes a slurry dispensing syste |
| 5830043 |
Chemical-mechanical polishing apparatus with in-situ pad conditioner |
November 3, 1998 |
| Chemical-mechanical polishing apparatus includes a pad reconditioning mechanism which comprises nested conical tubes which overly the pad. The outer tube has an array of holes in it much like the head of an electric razor and is rotated about its axis by being in contact with the rotatin |
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