| Patent Number |
Title Of Patent |
Date Issued |
| 7304475 |
Mechanism for and method of biasing magnetic sensor |
December 4, 2007 |
| A magnetic sensor package having a biasing mechanism involving a coil-generated, resistor-controlled magnetic field for providing a desired biasing effect. In a preferred illustrated embodiment, the package broadly comprises a substrate; a magnetic sensor element; a biasing mechanism |
| 7258022 |
Micro-tensile testing system |
August 21, 2007 |
| A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The |
| 7243554 |
Micro-tensile testing system |
July 17, 2007 |
| A micro-tensile testing system providing a stand-alone test platform for testing and reporting physical or engineering properties of test samples of materials having thicknesses of approximately between 0.002 inch and 0.030 inch, including, for example, LiGA engineered materials. The |
| 7013068 |
Apparatus and method for combining light from two or more fibers into a single fiber |
March 14, 2006 |
| An apparatus and method for combining light signals carried on a plurality of input fibers onto a single receiving fiber with a high degree of efficiency. The apparatus broadly comprises the receiving fiber and a plurality of input fiber-lens assemblies, with each fiber lens assembly |
| 6897078 |
Programmable multi-chip module |
May 24, 2005 |
| A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components w |
| 6818984 |
Programmable multi-chip module |
November 16, 2004 |
| A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components w |
| 6807219 |
Laser housing having integral mounts and method of manufacturing same |
October 19, 2004 |
| A housing adapted to position, support, and facilitate aligning various components, including an optical path assembly, of a laser. In a preferred embodiment, the housing is constructed from a single piece of material and broadly comprises one or more through-holes; one or more cavities; |
| 6700196 |
Programmable multi-chip module |
March 2, 2004 |
| A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components w |
