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Hitachi Chemical Co., Ltd. Patents
Assignee:
Hitachi Chemical Co., Ltd.
Address:
Tokyo, JP
No. of patents:
384
Patents:


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Patent Number Title Of Patent Date Issued
RE34061 Polymers of tricyclo[5.2.1.0.sup.2,6 ]deca-8-yl (meth)acrylate September 8, 1992
A polymer obtained by polymerizing tricyclo[5.2.1.0.sup.2,6 ]deca-8-yl acrylate or methacrylate in an amount of 100-5% by weight with one or more copolymerizable unsaturated monomers in an amount of 0 to 95% by weight is excellent in transparency, moisture resistance, and heat resistance
8574716 Ionic polymer devices and methods of fabricating the same November 5, 2013
An ionic polymer composite device and methods for fabricating the ionic polymer composite device are provided. The ionic polymer composite device includes two extended electrode layers, each extended electrode layer including at least one ionic polymer with a plurality of electrically
8293847 Film-like adhesive, adhesive sheet, and semiconductor device using same October 23, 2012
An object of the present invention is to provide a film-like adhesive capable of achieving a superior combination of processability and reflow resistance. A film-like adhesive of the present invention is used for bonding a semiconductor element to an adherend, and includes an adhesive
8288282 Polishing liquid for metal and method of polishing October 16, 2012
Disclosed is a metal-polishing liquid comprising: a metal-oxide-dissolving agent; a metal-oxidizing agent; a metal anticorrosive; a water-soluble polymer having a weight-average molecular weight of 8,000 or higher and having an anionic functional group and a nonionic functional group
8287676 Method of and apparatus for manufacturing liquid crystal display device October 16, 2012
A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible
8277948 Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad lamin October 2, 2012
Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and
8273605 Manufacturing method for electronic device having IC chip and antenna electrically connected by September 25, 2012
There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100,
8268982 Primers and probes for the detection of HIV September 18, 2012
Provided herein are primer/probe sets useful for detecting HIV (HIV-1) in a test sample. The primer/probe sets can be employed according to nucleic acid amplification procedures including PCR, real-time quantitative PCR, or RT-PCR. The primer/probe sets can also be provided in the form o
8268566 Enhanced FC receptor-mediated tumor necrosis factor superfamily MRNA expression in peripheral bl September 18, 2012
A method for predicting patient responsiveness to rheumatoid arthritis treatments involving altering expression of tumor necrosis factor superfamily ("TNFSF")-2, TNFSF-8, or TNFSF-15 is disclosed. A method for monitoring the effectiveness of such therapy is also disclosed. Furthermor
8253511 Triple plate feeder--waveguide converter having a square resonance patch pattern August 28, 2012
A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate
8242235 Purification process of electroluminescent material, electroluminescent material and electrolumi August 14, 2012
Objects of the present invention are to provide a purification process that enables Pd and P to be removed effectively, and to provide an electroluminescent material and an electroluminescent device obtained by employing the process. The present invention relates to a process for pur
8232355 Liquid resin composition for electronic components and electronic component device July 31, 2012
The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for
8231735 Polishing slurry for chemical mechanical polishing and method for polishing substrate July 31, 2012
The present invention is directed to a CMP polishing slurry comprising cerium oxide particles, an organic compound having an acetylene bond (triple bond between carbon and carbon) and water, and a method for polishing a substrate which comprises a step of polishing a film to be polis
8220717 Tubular container enabling individual identification July 17, 2012
A tubular container enabling individual identification, suitable to store semen of a domestic animal or a small amount of an organism individual sample and to manage history information, excellent in reliability, workability, and communication characteristics, and incorporating an IC
8212271 Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optica July 3, 2012
A substrate for mounting optical semiconductor elements is provided, including a base substrate having an insulating layer and a plurality of wiring circuits formed on the upper face of the insulating layer, and having at least one external connection terminal formation opening porti
8202622 Circuit connecting material, film-form circuit connecting material using the same, circuit membe June 19, 2012
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed a
8188805 Triplate line-to-waveguide transducer having spacer dimensions which are larger than waveguide d May 29, 2012
A ground conductor (1) has a through hole provided through an area thereof for connection with a waveguide (6), with dimensions substantially equal to cavity dimensions of the waveguide (6), and a metallic spacer (7a) is provided as a holding element for a film substrate (4), with an
8186889 Optical connecting member and display apparatus May 29, 2012
Disclosed is an information processing device with lighting function that realizes reduced power consumption and cost reductions. The optical connecting member 17 flexibly connects between a light guide plate 14 of a displaying part side and a light guide plate 21 of a key operating part
8179361 Reflector and backlight device May 15, 2012
A back light device realizing improvement in hotspots and bright line in the region of light incidence and of darkness arising in between light sources is provided by forming the reflective surface of the reflector as a structured face comprising an iteration of prism elements of tra
8168541 CMP polishing slurry and polishing method May 1, 2012
The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted p
8129467 Curing accelerating compound-silica composite material, method for producing curing accelerating March 6, 2012
The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the general formula (I-
8115105 Prepreg and its application products for low thermal expansion and low dielectric tangent February 14, 2012
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coeffici
8106385 Organic siloxane film, semiconductor device using the same, flat panel display device, and raw m January 31, 2012
Disclosed is materials design for prolonging the duration of the low relative dielectric constant of an organic siloxane film having a low relative dielectric constant. Specifically, in an organic siloxane film having a relative dielectric constant of not more than 2.1, the elemental
8098419 Light control film and light control glass January 17, 2012
The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates, wherein the light control layer contains a resin matrix and a light
8096693 Light guide plate and backlight unit January 17, 2012
A light guide plate includes: a plate surrounded by two main surfaces and a plurality of end surfaces connecting the main surfaces, one of the end surfaces designated as an entrance surface, one of the main surfaces designated as a reflection surface; a first reflection element provided
8084363 Polishing slurry and polishing method December 27, 2011
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made
8084362 Polishing slurry and polishing method December 27, 2011
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made
8084130 Epoxy resin molding material for sealing and electronic component device December 27, 2011
The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin mol
8075943 Purification process for organic electronics material December 13, 2011
Objects of the present invention are to provide a purification process that enables Pd contained in an organic electronics material to be removed effectively, to provide an electroluminescent device middle layer material purified by the process, and to provide an electroluminescent d
8075800 Polishing slurry and polishing method December 13, 2011
A polishing slurry containing a slurry dispersing particles of tetravalent metal hydroxide in a medium therein and an additive, characterized in that the additive is a polymer containing at least one kind of monomer component selected from a group of monomers represented with a gener
8059331 Light control film and light control glass November 15, 2011
The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates, wherein the light control layer contains a resin matrix and a light
8044379 Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same October 25, 2011
A method of producing silicon nanowires includes providing a substrate in the form of a doped material; formulating an etching solution; and applying an appropriate current density for an appropriate length of time. Related structures and devices composed at least in part from silico
8043709 Circuit connecting material, film-like circuit connecting material using the same, circuit membe October 25, 2011
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed a
8034545 Radiation curable composition, storing method thereof, forming method of cured film, patterning October 11, 2011
The present invention provides a radiation curing composition comprising (a): a siloxane resin, (b): a photoacid generator or photobase generator, and (c): a solvent capable of dissolving component (a) and containing an aprotic solvent.
8034427 Friction material composition and friction material produced therewith October 11, 2011
Disclosed is a friction material composition, comprising a fiber matrix, a binder, an organic filler, and an inorganic filler, wherein the fiber matrix contains at least two types of mineral fibers different in average fiber length from each other, and the difference between the minimum
8029701 Mixed conductive powder and use thereof October 4, 2011
There are disclosed a highly packed, mixed conductive powder with a relative packing density of at least 68%, a process for producing the same, a conductive paste using the mixed conductive powder and a process for producing the same, as well as a sheet and a sheet with attached film
8028402 Connection board, and multi-layer wiring board, substrate for semiconductor package and semicond October 4, 2011
Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition
8008418 High-molecular copolymer containing metal coordination compound and organic electroluminescence August 30, 2011
It is an object of the present invention to provide a copolymer containing a metal coordination compound that has blue phosphorescence emission with excellent color purity and, furthermore, to provide a copolymer containing a metal coordination compound that has luminescence of vario
8002860 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device u August 23, 2011
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a
7994058 Polishing slurry and polishing method August 9, 2011
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made
7991248 Optical waveguide substrate and substrate mounting photoelectric hybrid circuit August 2, 2011
There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high-density wiring fo
7982322 Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing th July 19, 2011
The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance
7981977 Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler July 19, 2011
The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member sel
7981608 Device and method for high-throughput quantification of MRNA from whole blood July 19, 2011
Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to oligo(dT)-immobilized
7973125 Method of evaluating polymide dissolution rate, method of producing polymide, and polymide obtai July 5, 2011
A method of evaluating the dissolution rate of a polyimide by Raman spectroscopy, wherein the Raman spectral intensity I(a) of imide groups contained within the polyimide is measured, and I(a) is then compared with the Raman spectral intensity I(b) of imide groups contained within a
7968288 Device and method for high-throughput quantification of mRNA from whole blood June 28, 2011
Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to oligo(dT)-immobilized
7968195 Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler June 28, 2011
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100.degree. C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape
7968194 Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler June 28, 2011
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100.degree. C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape
7955716 Metal coordination compound, polymer composition, and organic electroluminescent device employin June 7, 2011
It is an object of the present invention to provide a phosphorescence-emitting material that emits light in a wide visible light range from blue to red and has excellent color purity and reliability, etc. The present invention relates to a metal coordination compound represented by a
7955689 Resin coated metal foil, metal clad laminate, printed wiring board using them, and manufacturing June 7, 2011
The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufac
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