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Hei, Inc. Patents
Assignee:
Hei, Inc.
Address:
Victoria, MN
No. of patents:
16
Patents:




Patent Number Title Of Patent Date Issued
6838953 High-frequency interconnection for circuits January 4, 2005
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
6798223 Test methods, systems, and probes for high-frequency wireless-communications devices September 28, 2004
A test probe for a high-frequency device having an electronic circuit with two or more contact regions. The test probe comprises two or more signal probe tips. Each signal probe tip has a contact surface area for contacting one of the contact regions of the device. A ground probe has a
6696952 Structures and assembly methods for radio-frequency-identification modules February 24, 2004
Radio-frequency identification (RFID) devices are used in a variety of applications to facilitate the identification and tracking of people, objects, and animals. One problem with RFID devices or tags concerns manufacturing cost. Specifically, some tag designs use an integrated-circu
6674869 Hearing-aid assembly using folded flex circuits January 6, 2004
Hearing aids improve not only the hearing, but the lives of millions. Unfortunately, far too many sufferers of hearing loss forego the benefits of hearing aids because of size and cost of the devices. To address this need, the present inventor devised hearing-aid circuit modules that use
6646521 Connection for conducting high frequency signal between a circuit and a discrete electric compon November 11, 2003
An apparatus for processing high frequency signals comprises a circuit board has a trace. An electrical circuit is fabricated on a die, which is mounted on the circuit board. The die has a top portion and a contact point is positioned on the top portion. The circuit is configured to
6469592 High-frequency interconnection for circuits October 22, 2002
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
6294966 Interconnection device September 25, 2001
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal vie and close proximity ground vies as well as tuned wire bonds are disclosed.
6014320 High density stacked circuit module January 11, 2000
A high density circuit module construction uses a flex circuit attached to a substrate and folded over on it to provide higher packaging density while providing an increase in the surface area available for I/O pads. A substrate has components such as ICs mounted on one surface, and modu
5936847 Low profile electronic circuit modules August 10, 1999
An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted
5847930 Edge terminals for electronic circuit modules December 8, 1998
Improved edge terminals for electronic circuit modules such as single- or multi-chip modules and hybrid circuits, and methods of making the edge terminals are disclosed. The improved edge terminals are formed on the edges of the modules, where they do not take up appreciable surface area
4677428 Cordless light pen June 30, 1987
A cordless light pen for use with a cathode ray tube display screen as a data input for a digital computer. Contained within the exterior barrel of the pen is a depressible tip having a core made from a plastic which has been treated and whose index of refraction causes light entering in
4603261 Document reading apparatus July 29, 1986
A compact document reading station for transporting a document and sensing indicia carried on the document. First and second substantially identical box-like housing halves, each with four sides, a generally closed bottom and an open top, contain an in-line arrangement of a motor and a d
4587421 Photo-optic transducing head assembly May 6, 1986
A photo-optic transducer assembly comprising a frame constructed to surround the peripheral edges of a ceramic hybrid circuit card such that a radiation source and a radiation responsive element coupled to said hybrid circuit card are appropriately aligned with a photo-optic light pipe
4578569 Multi-width card reader with cancellation feature March 25, 1986
A hand-fed data-card reader compatible with cards of different widths and having a selectively actuable perforator for conveying cards past a reader head and for selectively cancelling desired cards via the perforation thereof. Cards are conveyed via a belt/pulley drive train that is ope
4550250 Cordless digital graphics input device October 29, 1985
A cordless graphics input device system for use with a computer. The device comprises an infrared emitting module useable on any surface adjacent a detector having a pair of patterned concave sensors. Coordinate information is determined via a detector contained microprocessor relative
4104603 Tactile feel device August 1, 1978
A tactile feel device which provides a characteristic resistance to movement, and breakaway feel to signal the operator that movement and accompanying function, such as switching, has been accomplished. Resistance to movement is provided by spring biasing means for the initial stroke

 
 
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