| Patent Number |
Title Of Patent |
Date Issued |
| D511328 |
Light-emitting diode |
November 8, 2005 |
|
| D509809 |
Metal base design for surface mount device LED |
September 20, 2005 |
|
| D509195 |
Light emitting diode package |
September 6, 2005 |
|
| D507544 |
Light emitting diode package |
July 19, 2005 |
|
| D507246 |
Light emitting diode package |
July 12, 2005 |
|
| D506732 |
Light-emitting diode |
June 28, 2005 |
|
| 7303984 |
Semiconductor substrate structure and processing method thereof |
December 4, 2007 |
| A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: pro |
| 7276782 |
Package structure for semiconductor |
October 2, 2007 |
| A package structure for a semiconductor is described. The advantages thereof are that it has a great structural strength and when being penetrated by light, it will not be influenced by external light and can condense the light. Therefore, it is not easily be deformed so that the yie |
| 7255463 |
Lighting module |
August 14, 2007 |
| A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed |
| 7237938 |
Backlight module |
July 3, 2007 |
| A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being p |
| 7211882 |
LED package structure and method for making the same |
May 1, 2007 |
| An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact |
| 7142181 |
Circuit board for large screen LED matrix array display |
November 28, 2006 |
| Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is |
| 7140753 |
Water-cooling heat dissipation device adopted for modulized LEDs |
November 28, 2006 |
| A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the |
| 7138995 |
Circuit for driving LED display |
November 21, 2006 |
| A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the cont |
| 7080924 |
LED light source with reflecting side wall |
July 25, 2006 |
| A light emitting diode chip or chips array mounted on a substrate is surrounded by one or more side walls. The wall has an uneven reflecting surface to diverge the light emitted from the LED chip or chip array. The wall may have a triangular cross-section so that the emitted light di |
| 7049639 |
LED packaging structure |
May 23, 2006 |
| An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two con |
| 6919584 |
White light source |
July 19, 2005 |
| A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer. |
| 6841934 |
White light source from light emitting diode |
January 11, 2005 |
| A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as t |
| 6794686 |
White light source |
September 21, 2004 |
| A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate. |
| 6627482 |
Mass production technique for surface mount optical device with a focusing cup |
September 30, 2003 |
| Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surface mounting. Glue is applied over |
| 6398983 |
Fluorescent material for packaging optical devices |
June 4, 2002 |
| A solid state epoxy powder and a solid state fluorescent powder material are mixed in a fixed ratio for application over the surface of an optical device. When the mixture is heated into liquid form and then cooled down, the mixture forms a fluorescent coating which emits colorless light |
| 6262481 |
Folded heat sink for semiconductor device package |
July 17, 2001 |
| A heat conducting metal is placed under a semiconductor chip and wraps around a substrate of the semiconductor device package to serve as the heat sink for the chip. The metal can wrap around a through-hole in the middle of the substrate, or wrap around the edge of the substrate. A metal |
| 6078092 |
Resettable fuse integrated circuit package |
June 20, 2000 |
| A resettable fuse is connected in series with a bonding pad of an IC chip, In the presence of a high voltage surge, the resettable fuse breaks the connection temporary. After the surge is over, the resettable reset itself and the IC resumes operation. |
