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Fry's Metals, Inc. Patents
Assignee:
Fry's Metals, Inc.
Address:
South Plainfield, NJ
No. of patents:
40
Patents:












Patent Number Title Of Patent Date Issued
8252417 Metallic particles for electrokinetic or electrostatic deposition August 28, 2012
Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.
8191757 Reducing joint embrittlement in lead-free soldering processes June 5, 2012
In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this
7968008 Particles and inks and films using them June 28, 2011
Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.
7749883 Electroformed stencils for solar cell front side metallization July 6, 2010
A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one ape
7678255 Mask and method for electrokinetic deposition and patterning process on substrates March 16, 2010
A mask for application to a substrate to facilitate electrokinetic deposition of charged particles onto the substrate, the mask comprising a conducting layer, a dielectric layer, and mask openings. A method for applying a pattern of charged particles to a substrate comprising applyin
7655304 Coated solder metal particles February 2, 2010
A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the part
7585549 Method of applying a pattern of particles to a substrate September 8, 2009
A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the
7533793 Solder preforms for use in electronic assembly May 19, 2009
A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacuum side pick up surfac
7413805 Preparation of metallic particles for electrokinetic or electrostatic deposition August 19, 2008
Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.
7413771 Coating solder metal particles with a charge director medium August 19, 2008
A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the part
7247683 Low voiding no flow fluxing underfill for electronic devices July 24, 2007
A no flow fluxing underfill having a hardener component comprising a phenolic component and an anhydride component in a molar ratio of phenolic component to anhydride component of between about 0.1:1 and about 2:1; or between about 0.8:1 and about 1.2:1. An underfill preparation meth
7213739 Underfill fluxing curative May 8, 2007
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing
7187083 Thermal interface material and solder preforms March 6, 2007
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved
7166491 Thermoplastic fluxing underfill composition and method January 23, 2007
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
7097806 Rapid surface cooling of solder droplets by flash evaporation August 29, 2006
A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contract the surfaces of molten solder droplets and be flash vaporized upon
7093746 Coated stencil with reduced surface tension August 22, 2006
A stencil used for printing solder paste on a contact pad of a printed wiring board has interior surfaces that define one or more apertures through the stencil. Those interior surfaces are coated with a material, such as parylene, having a lower surface tension than the interior surf
6988652 Solder printing using a stencil having a reverse-tapered aperture January 24, 2006
A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the
6938227 System and method for modifying electronic design data August 30, 2005
Customer data relating to the location and character of features (e.g., conductive pads to which electronic parts are soldered on a printed circuit board) are stored in a digital form (e.g., as "Gerber data"). A library of footprints that characterize the features is created from this
6936115 Soldering flux vehicle additive and fine pitch printing method August 30, 2005
A lubricant additive which is a branched chain fatty alcohol or fatty acid containing a total of from 8 to 50 carbon atoms with a minimum of 4 carbon atoms being present in the shorter alkyl chain, or an ester thereof. The lubricant additive is especially adapted for inclusion in a non-a
6863447 Photon-conducting media alignment using a thermokinetic material March 8, 2005
Photon-conducting receiving and transmitting media (e.g., optical fibers) are aligned by coupling the receiving medium with a thermokinetic structure, which can include a shape memory alloy. A photon beam is directed from the transmitting medium onto the thermokinetic structure, ther
6653741 Thermal interface material and heat sink configuration November 25, 2003
A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an act
6635101 Rapid surface cooling of solder droplets by flash evaporation October 21, 2003
A mist of liquid coolant is introduced into the path of atomized, molten, solder droplets. The mist and other conditions within the chamber are engineered to enable the liquid coolant droplets in the mist to contact the surfaces of molten solder droplets and be flash vaporized upon c
6599372 Soldering flux July 29, 2003
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form
6524398 Low-residue, low-solder-ball flux February 25, 2003
A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.
6506448 Method of protective coating BGA solder alloy spheres January 14, 2003
A method of efficiently coating surfaces of solder alloy spheres by a vapor deposition process using a solvent-based coating solution including a low viscosity organic material and at least one solute, such as a surfactant. The method surface coats solder alloy spheres to minimize or eli
6467641 Container device with adjustable volume for immobilizing solder spheres and method thereof October 22, 2002
A container device with an adjustable volume is provided for holding and immobilizing solder spheres used in manufacturing printed circuit boards and other electronic assemblies. The container device includes a hollow containing portion having a first terminal end and a second terminal e
6345718 Method and apparatus for immobilizing solder spheres February 12, 2002
A containing device and method to hold and immobilize solder spheres during storage and transport including a container portion having an open top terminal end and an opposing closed bottom terminal end with at least one side wall connecting each terminal end, a removably attachable lid
6331201 Bismuth coating protection for copper December 18, 2001
Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth metal coating immersion-plated from a moderately to strongly acidic plating bath. The plating bath preferably contains dissolved bismuth, halide, and a s
6265776 Flip chip with integrated flux and underfill July 24, 2001
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing
6228681 Flip chip having integral mask and underfill providing two-stage bump formation May 8, 2001
The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can
6228678 Flip chip with integrated mask and underfill May 8, 2001
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then
6183871 Sealing glass paste for cathode ray tubes February 6, 2001
A sealing glass paste which comprises at least one sealing glass frit powder and an aqueous binder which comprises an aqueous solution, dispersion or emulsion of a polymeric material and a water soluble oxidant which decomposes at a temperature of below 475.degree. C., the polymeric
6090493 Bismuth coating protection for copper July 18, 2000
Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth coating.
5902438 Process for the formation of anisotropic conducting material May 11, 1999
A process for the preparation of an anisotropic conducting material including the steps of providing a strip or sheet of a non-conducting matrix and laminating at least one layer of a release material to each side thereof to form a composite matrix, forming an array of holes in a pre
5789068 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined in August 4, 1998
The invention provides a solder preform coated with a predetermined thickness of parylene which physically and chemically protects the preform, as well as a provides a unique optical interference coating which reflects at characteristic frequencies. When predetermined thicknesses of
5637176 Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, inc June 10, 1997
Ordered Z-axis electroconductive sheet materials are produced by entrapping bodies of fusible, polymeric, electroconductive adhesive at predetermined spaced locations in a sheet-like carrier of fusible, polymeric, dielectric adhesive including a thermoplastic component. The materials are
5631091 Bismuth coating protection for copper May 20, 1997
Copper-containing surfaces, such as a copper surface for use in an electrical circuit, are protected by the provision of a bismuth coating.
5571340 Rosin-free, low VOC, no-clean soldering flux and method using the same November 5, 1996
A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an ag
5531942 Method of making electroconductive adhesive particles for Z-axis application July 2, 1996
Electroconductive resin adhesive particles are incorporated in a dielectric-resin-adhesive-containing carrier to form a Z-axis adhesive. Particles are preferably produced by printing techniques or by in-fluid forming techniques, the latter being particularly suited for the formation
5297721 No-clean soldering flux and method using the same March 29, 1994
A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux i

 
 
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