| Patent Number |
Title Of Patent |
Date Issued |
| 7458496 |
Wire bonder and method of operating the same |
December 2, 2008 |
| Wire bonder having a bonding head which has a bonding tool and a bonding wire guide and, especially, a bonding wire cutting device which comprises a cutter for separation of that section of a bonding wire which projects beyond a bonding contact, the wire bonder having a camera with a |
| 6912906 |
Method and apparatus for the production and quality testing of a bonded wire connection |
July 5, 2005 |
| Method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound |
| 6905058 |
Bonding tool and wire bonder |
June 14, 2005 |
| Bonding tool for ultrasonic wire bonding, with a knife (3) that is inserted into or closely apposed to the bonding tool so as to be longitudinally movable with respect thereto, in order to cut a projecting part of a bonded wire immediately behind a bonded connection. |
| 6891730 |
Circuit housing |
May 10, 2005 |
| Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making external contact and the u |
| 6827248 |
Cutting device for bonded wires |
December 7, 2004 |
| Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence to the bonding con |
| 6786320 |
Chip-transferring station for a bonding machine |
September 7, 2004 |
| A bonding machine chip-transferring station, with a multi-axial positioning mechanism and a suction-needle module mounted and positionable thereon, with a housing, a suction needle connected to a vacuum conduit, and a suction-needle conveyance unit, including a drive motor, a belt tr |
| 6745629 |
Method and apparatus for the production and quality testing of a bonded wire connection |
June 8, 2004 |
| A method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound |
| 5979737 |
Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piez |
November 9, 1999 |
| A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is biased by a spring mounted at one e |
| 5950903 |
Bonding head |
September 14, 1999 |
| A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system (7, 8, 9) is provided for si |
| 5906706 |
Wire guide for a bonding machine |
May 25, 1999 |
| A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bonding wire to the wedge. Securemen |
| 5314105 |
Wire bonding ultrasonic control system responsive to wire deformation |
May 24, 1994 |
| A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic transducer 6, the bonding tool 2 being arranged to press the wire 8 against the contact sur |
| 5277354 |
Device for monitoring wire supply and consumption |
January 11, 1994 |
| A device for incorporation in a wire bonding machine for monitoring the supply of wire from a wire supply spool to a bonding wedge. The device includes a mount (12) for rotatably mounting a wire supply spool (1); a guide wheel (7) mounted on a lever (8), which lever (8) can be deflected |
