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F & K Delvotec Bondtechnick GmbH Patents
Assignee:
F & K Delvotec Bondtechnick GmbH
Address:
Ottobrunn, DE
No. of patents:
1
Patents:




Patent Number Title Of Patent Date Issued
7156602 Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine January 2, 2007
A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are disposed on a movable holder

 
 
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