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Ebara Corporation Patents
Assignee:
Ebara Corporation
Address:
Tokyo, JP
No. of patents:
1473
Patents:












Patent Number Title Of Patent Date Issued
RE39471 Apparatus for and method for polishing workpiece January 16, 2007
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fl
RE39262 Polishing apparatus including turntable with polishing surface of different heights September 5, 2006
A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable
RE39123 Plating apparatus June 13, 2006
The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving
RE38878 Polishing apparatus November 15, 2005
A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled
RE38854 Apparatus for and method for polishing workpiece October 25, 2005
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid
RE38826 Apparatus for and method for polishing workpiece October 11, 2005
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid
RE38228 Polishing apparatus August 19, 2003
A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to pol
RE38215 Polishing apparatus August 12, 2003
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first l
RE37347 Substrate gripper device for spin drying September 4, 2001
A substrate gripper device for gripping a substrate has a rotatable substrate stage, a plurality of fixing fingers vertically mounted on an outer edge of the rotatable substrate stage and having respective horizontal substrate rests for placing thereon an outer edge of the substrate,
RE37300 Pressurized internal circulating fluidized-bed boiler July 31, 2001
A pressurized internal circulating fluidized-bed boiler is incorporated in a combined-cycle electric generating system in which a fuel such as coal, petro coke or the like is combusted in a pressurized fluidized bed and an exhaust gas produced by the combusted fuel is introduced into a g
RE36610 Evacuation apparatus and evacuation method March 14, 2000
An evacuation apparatus and method using a turbomolecular pump having a rotor provided with a plurality of rotor blades and a spacer provided with a plurality of stator blades so that gas molecules are sucked in from a suction port, compressed and discharged from an exhaust port of the
D669439 Electrical contact October 23, 2012
D660890 Unit bearing May 29, 2012
D659175 Sealing ring May 8, 2012
D651178 Electrical contact for use in a plating apparatus December 27, 2011
D650344 Vacuum contact pad December 13, 2011
D649986 Sealing ring December 6, 2011
D649126 Vacuum contact pad November 22, 2011
D634719 Elastic membrane for semiconductor wafer polishing apparatus March 22, 2011
D633452 Elastic membrane for semiconductor wafer polishing apparatus March 1, 2011
D629422 Pump mount base for vacuum compression apparatus December 21, 2010
D616389 Vacuum contact pad May 25, 2010
D583779 Electrolytic plating anode December 30, 2008
D572673 Anode shaft July 8, 2008
D556692 Electrical contact for use in a plating apparatus December 4, 2007
D555595 Electrical contact for use in a plating apparatus November 20, 2007
D491725 Container for transporting substrates June 22, 2004
D479399 Container for transporting substrates September 9, 2003
D252811 Centrifugal pump September 4, 1979
8585460 Method of making diagram for use in selection of wavelength of light for polishing endpoint dete November 19, 2013
A method of polishing end point detection includes polishing a surface of a substrate; applying light to the surface of the substrate and receiving reflected light from the substrate during the polishing of the substrate; measuring reflection intensities of the reflected light at respect
8582122 Polishing monitoring method, polishing method, and polishing monitoring apparatus November 12, 2013
A method accurately monitors the progress of polishing and accurately detects the polishing end point. The method includes directing light to the substrate during polishing of the substrate, receiving reflected light from the substrate, measuring an intensity of the reflected light a
8568199 Polishing endpoint detection apparatus October 29, 2013
Method and apparatus for detecting an accurate polishing endpoint of a substrate based on a change in polishing rate are provided. The method includes: applying a light to the surface of the substrate and receiving a reflected light from the substrate; obtaining a plurality of spectral
8298369 Liquid supply method, liquid supply apparatus, substrate polishing apparatus, and method of meas October 30, 2012
A liquid supply apparatus is to supply a polishing liquid from a polishing supply source onto a polishing surface of a polishing table at a predetermined flow rate. The liquid supply apparatus according to the present invention includes at least one supply tube for retaining the liqu
8292694 Substrate holding mechanism, substrate polishing apparatus and substrate polishing method October 23, 2012
A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding
8280664 XY-coordinate compensation apparatus and method in sample pattern inspection apparatus October 2, 2012
Stage orthogonal error and position errors caused by mirror distortion are reduced. A CPU calculates a coordinate error (.DELTA.x,.DELTA.y) between a measured XY coordinate (x,y) of each of arbitrary reference points on a wafer W.sub.0 loaded on a XY stage which is measured by a lase
8277653 Power recovery chamber October 2, 2012
A power recovery chamber is used for a positive-displacement power recovery apparatus in the seawater desalination plant or system. The power recovery chamber includes a cylinder, a piston disposed in the cylinder and capable of being reciprocated in a longitudinal direction of the c
8274047 Substrate surface inspection method and inspection apparatus September 25, 2012
A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a c
8267746 Substrate holding apparatus, polishing apparatus, and polishing method September 18, 2012
A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing su
8257143 Method and apparatus for polishing object September 4, 2012
A method can effectively eliminate a surface level difference (irregularities) in a film formed on an object without producing scratches in a surface of the film, and can polish and remove the film into a flat surface with greatly increased productivity. The method comprises carrying
8252167 Plating apparatus August 28, 2012
A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating appara
8251678 Vacuum pump unit August 28, 2012
The present invention relates to a dry vacuum pump unit capable of achieving ultimate pressure of about 1 Pa. The vacuum pump unit includes a main pump (15) disposed at an outside-pressure side, and a booster pump (16) disposed at a vacuum side. The booster pump (16) and the main pump
8246732 Exhaust gas cleaning apparatus August 21, 2012
An exhaust gas cleaning apparatus according to the present invention includes a wall member configured to form a gas passage for allowing an exhaust gas to pass therethrough, and a mist nozzle and a water film nozzle disposed in the gas passage. The mist nozzle forms mist in the gas
8246417 Polishing apparatus and polishing method August 21, 2012
The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a semiconductor wafer, to planarize the substrate. The polishing apparatus according to the present invention includes a polishing table (10) having a polishing surface, a
8241426 CMP polishing method, CMP polishing apparatus, and process for producing semiconductor device August 14, 2012
When the remaining slurry and polishing residue are removed by cleaning with a cleaning liquid (preferably a cleaning liquid containing a surfactant), organic matter in the cleaning liquid containing a surfactant seeps into the interlayer insulating film 3. Therefore, the substrate i
8226771 Substrate processing apparatus and substrate processing method July 24, 2012
A substrate processing apparatus includes: a polishing device 30A for polishing the surface of a substrate; and at least one of an ultrasonic cleaning device 42 for cleaning the surface of the substrate with ultrasonic waves transmitted through a liquid, and a two-fluid jet cleaning
8225803 Substrate processing method and apparatus July 24, 2012
A substrate processing method and apparatus can securely carry out a pre-plating treatment that enables uniform plating in the necessary area of the surface of a substrate. The substrate processing method carries out a cleaning treatment and a catalyst-imparting treatment of a surface
8211242 Substrate processing method, substrate processing apparatus, and control program July 3, 2012
A substrate processing method includes covering, in advance, the surface of a substrate with water, holding the substrate generally horizontally with the surface facing upward and rotating it in a horizontal plane, and blowing to the substrate top surface drying gas flow that is thin in
8206197 Polishing apparatus and program thereof June 26, 2012
A polishing apparatus includes a loading section (14) for placing therein a cassette (12) in which a plurality of polishing objects are housed; a first polishing line (20) and a second polishing line (30) for polishing a polishing object; a cleaning line (40) having cleaning machines (42
8205625 Apparatus and method for surface treatment of substrate, and substrate processing apparatus and June 26, 2012
A surface treatment apparatus of a substrate can clean a substrate surface in the air without employing a vacuum apparatus, and can remove a natural oxide film or an organic material, such as BTA, from the substrate surface without resorting to plasma cleaning. The surface treatment
8202139 Method of operating substrate processing apparatus and substrate processing apparatus June 19, 2012
A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, wi

 
 
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