| Patent Number |
Title Of Patent |
Date Issued |
| RE39471 |
Apparatus for and method for polishing workpiece |
January 16, 2007 |
| A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fl |
| RE39262 |
Polishing apparatus including turntable with polishing surface of different heights |
September 5, 2006 |
| A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable |
| RE39123 |
Plating apparatus |
June 13, 2006 |
| The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving |
| RE38878 |
Polishing apparatus |
November 15, 2005 |
| A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled |
| RE38854 |
Apparatus for and method for polishing workpiece |
October 25, 2005 |
| A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid |
| RE38826 |
Apparatus for and method for polishing workpiece |
October 11, 2005 |
| A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid |
| RE38228 |
Polishing apparatus |
August 19, 2003 |
| A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to pol |
| RE38215 |
Polishing apparatus |
August 12, 2003 |
| A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first l |
| RE37347 |
Substrate gripper device for spin drying |
September 4, 2001 |
| A substrate gripper device for gripping a substrate has a rotatable substrate stage, a plurality of fixing fingers vertically mounted on an outer edge of the rotatable substrate stage and having respective horizontal substrate rests for placing thereon an outer edge of the substrate, |
| RE37300 |
Pressurized internal circulating fluidized-bed boiler |
July 31, 2001 |
| A pressurized internal circulating fluidized-bed boiler is incorporated in a combined-cycle electric generating system in which a fuel such as coal, petro coke or the like is combusted in a pressurized fluidized bed and an exhaust gas produced by the combusted fuel is introduced into a g |
| RE36610 |
Evacuation apparatus and evacuation method |
March 14, 2000 |
| An evacuation apparatus and method using a turbomolecular pump having a rotor provided with a plurality of rotor blades and a spacer provided with a plurality of stator blades so that gas molecules are sucked in from a suction port, compressed and discharged from an exhaust port of the |
| D572673 |
Anode shaft |
July 8, 2008 |
|
| D556692 |
Electrical contact for use in a plating apparatus |
December 4, 2007 |
|
| D555595 |
Electrical contact for use in a plating apparatus |
November 20, 2007 |
|
| D491725 |
Container for transporting substrates |
June 22, 2004 |
|
| D479399 |
Container for transporting substrates |
September 9, 2003 |
|
| D252811 |
Centrifugal pump |
September 4, 1979 |
|
| 7413983 |
Plating method including pretreatment of a surface of a base metal |
August 19, 2008 |
| The present invention provides a plating method and a plating apparatus which can securely form a metal film (protective film) by electroless plating on the exposed surfaces of a base metal, such as interconnects without the formation of voids in the base metal. The plating method in |
| 7411191 |
Inspection system by charged particle beam and method of manufacturing devices using the system |
August 12, 2008 |
| An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the elec |
| 7408643 |
Method and apparatus for inspecting samples, and method for manufacturing devices using method a |
August 5, 2008 |
| A method for alignment of a chip in a substrate surface inspection is provided, in which a surface of a substrate including a chip formed therein is inspected by using a beam. The method is characterized in comprising: a step of placing the substrate so that the chip is positioned wi |
| 7408175 |
Apparatus for inspection with electron beam, method for operating same, and method for manufactu |
August 5, 2008 |
| A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate "S" to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving |
| 7407821 |
Substrate processing method |
August 5, 2008 |
| There is provided a substrate processing method and apparatus which can measure and monitor thickness and/or properties of a film formed on a substrate as needed, and quickly correct a deviation in process conditions, and which can therefore stably provide a product of constant quali |
| 7403279 |
Information recording medium examining apparatus and method |
July 22, 2008 |
| In an examining apparatus, an electron gun irradiates an intended position of an information recording medium with an electron beam. A stage holds the information recording medium such that the information recording medium can be moved along a rotation direction and a radial direction. A |
| 7402245 |
Digested sludge treatment apparatus |
July 22, 2008 |
| A first aspect of the present invention relates to a digested sludge treatment apparatus for treating digested sludge generated by subjecting organic waste matter to anaerobic digestion, comprising: an apparatus for decarbonating the digested sludge; a removal apparatus for removing |
| 7402227 |
Plating apparatus and method |
July 22, 2008 |
| An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a |
| 7399792 |
Solid reagents |
July 15, 2008 |
| An object of the present invention is to provide a novel solid reagent capable of solving the problems of conventional solid reagents based on resin beads.The present invention relates to a solid reagent comprising an organic polymer base in which a polymer side chain is introduced onto |
| 7398656 |
Absorption refrigerating machine |
July 15, 2008 |
| To provide a highly efficient and compact absorption refrigerating machine with water heated from 60 to 70 degrees Celsius as the heat source. In an absorption refrigerating machine including a regenerator G, condenser C, an absorber A, an evaporator E, an auxiliary regenerator GX and an |
| 7391036 |
Sample surface inspection apparatus and method |
June 24, 2008 |
| The present invention provides a surface inspection method and apparatus for inspecting a surface of a sample, in which a resistive film is coated on the surface, and a beam is irradiated to the surface having the resistive film coated thereon, to thereby conduct inspection of the su |
| 7390853 |
Solid reagents |
June 24, 2008 |
| An object of the present invention is to provide a novel solid reagent capable of solving the problems of conventional solid reagents based on resin beads.The present invention relates to a solid reagent comprising an organic polymer base in which a polymer side chain is introduced onto |
| 7390337 |
Fuel gasification system |
June 24, 2008 |
| The present invention provides a fuel gasification furnace including a gasification chamber (1) for fluidizing a high-temperature fluidizing medium therein to form a gasification chamber fluidized bed having an interface, and for gasifying a fuel in the gasification chamber fluidized |
| 7387717 |
Method of performing electrolytic treatment on a conductive layer of a substrate |
June 17, 2008 |
| A plating method and apparatus for a substrate fills a metal, e.g., copper, into a fine interconnection pattern formed in a semiconductor substrate. The apparatus has a substrate holding portion 36 horizontally holding and rotating a substrate with its surface to be plated facing upw |
| 7385197 |
Electron beam apparatus and a device manufacturing method using the same apparatus |
June 10, 2008 |
| Disclosed is an electron beam apparatus, in which a plurality of electron beams is formed from electrons emitted from an electron gun 21 and used to irradiate a sample surface via an objective lens 28, said apparatus comprising: a beam separator 27 for separating a secondary electron bea |
| 7374682 |
Method and apparatus for the methane fermentation treatment of wastewater containing sulfur comp |
May 20, 2008 |
| A method and apparatus for the anaerobic methane fermentation treatment of a wastewater containing a sulfur compound. An oxidizing agent is added to an organic wastewater to oxidize the sulfur compound contained therein to molecular sulfur before the anaerobic treatment step. The wastewa |
| 7374646 |
Electrolytic processing apparatus and substrate processing method |
May 20, 2008 |
| The present invention provides an electrolytic processing apparatus which is capable of increasing an in-plane uniformity of a film thickness of a plated film by making more uniform an electric field distribution over an entire surface to be processed of a substrate even if the substrate |
| 7374584 |
Interconnects forming method and interconnects forming apparatus |
May 20, 2008 |
| The present invention provides an interconnects-forming method and an interconnects-forming apparatus which can minimize the lowering of processing accuracy in etching, minimize light exposure processing for the formation of interconnect recesses in the production of multi-level inte |
| 7368048 |
Method for forming Re alloy coating film having high-Re-content through electroplating |
May 6, 2008 |
| Disclosed is a method for forming a high-Re-content alloy film, such as a Re-based film containing Re at 98% or more by atomic composition, or an alloy film containing Re in the range of 65 to less than 98% by atomic composition and at least one of Ni, Fe and Co. The method comprises |
| 7368016 |
Substrate processing unit and substrate processing apparatus |
May 6, 2008 |
| A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell |
| 7367873 |
Substrate processing apparatus |
May 6, 2008 |
| A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The poli |
| 7365324 |
Testing apparatus using charged particles and device manufacturing method using the testing appa |
April 29, 2008 |
| A system for further enhancing speed, i.e. improving throughput in a SEM-type inspection apparatus is provided. An inspection apparatus for inspecting a surface of a substrate produces a crossover from electrons emitted from an electron beam source 25.cndot.1, then forms an image und |
| 7361895 |
Electron beam apparatus and a device manufacturing method by using said electron beam apparatus |
April 22, 2008 |
| An electron beam apparatus, in which an electron beam emitted from an electron gun having a cathode and an anode is focused and irradiated onto a sample, and secondary electrons emanated from the sample are directed into a detector, the apparatus further comprising means for optimizing |
| 7361600 |
Semiconductor manufacturing apparatus having a built-in inspection apparatus and a device manufa |
April 22, 2008 |
| According to the present invention, a chemical and mechanical polishing apparatus (100) for a sample such as a wafer includes a built-in inspection apparatus (25) incorporated therein. The polishing apparatus (100) further comprises a load unit (21), a chemical and mechanical polishi |
| 7361076 |
Method for estimating polishing profile or polishing amount, polishing method and polishing appa |
April 22, 2008 |
| A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The po |
| 7360454 |
Flowmeter having a float and a displacement sensor |
April 22, 2008 |
| A flowmeter can measure a small flow rate of fluid with high measurement precision, can be made small-sized, can deal with a variety of types of chemicals, and can be produced easily at a low cost. The flowmeter includes: a casing having an enlarged portion and being disposed vertica |
| 7359069 |
Polishing pad surface shape measuring instrument, method of using polishing pad surface shape me |
April 15, 2008 |
| The main sensor 15 measures the distance Lm to the surface of the pad 2a, and the sub-sensor 16 measures the distance Ls to the surface of the reference block 12. What is actually taken as the measured value is the value of (Lm+Ls). The reference block 12 is used in order to give a r |
| 7357699 |
Substrate holding apparatus and polishing apparatus |
April 15, 2008 |
| A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic |
| 7352195 |
Electron beam apparatus with detailed observation function and sample inspecting and observing m |
April 1, 2008 |
| Provided is a sample observing method allowing for a detailed observation of a sample by using one and the same electron beam apparatus. The method uses an electron beam apparatus 1 comprising a primary optical system 10 serving for irradiating the electron beam onto the sample surface a |
| 7351969 |
Electron beam inspection system and inspection method and method of manufacturing devices using |
April 1, 2008 |
| An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary ele |
| 7347663 |
Abrasion resistant surface treatment method of a rotary member, runner, and fluid machine having |
March 25, 2008 |
| The invention provides a method for performing abrasion resistant surface treatment on a surface of a rotary member. The abrasion resistant surface treatment method is characterized by including steps of: dividing the surface of the rotary member into a plurality of areas A.sub.1, A.sub. |
| 7344986 |
Plating solution, semiconductor device and method for manufacturing the same |
March 18, 2008 |
| The present invention relates to a plating solution useful for forming embedded interconnects by embedding a conductive material in fine recesses for interconnects provided in the surface of a substrate, such as a semiconductor substrate, or for forming a protective layer for protect |
| 7341634 |
Apparatus for and method of processing substrate |
March 11, 2008 |
| A workpiece is processed uniformly, e.g., a uniform plated film is formed on a workpiece, by a processing liquid, e.g., a plating solution, which is maintained in an optimum state while minimizing the amount of the processing liquid to be used. An apparatus for processing the workpiece |
