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ECI Technology, Inc. Patents
Assignee:
ECI Technology, Inc.
Address:
Totowa, NJ
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
8142640 Chloride analysis in acid copper plating baths March 27, 2012
The chloride concentration in an acid copper plating bath is determined from the chloride oxidation current measured under controlled hydrodynamic conditions at a noble metal electrode using specific voltammetric parameters. The measurement is made directly on the undiluted plating b
8118988 Analysis of copper ion and complexing agent in copper plating baths February 21, 2012
A simple titration method involving a single copper ion titrant detected by a copper ion specific electrode provides the concentrations of both copper ions and bath complexing agent (ethylene diamine, for example) in alkaline copper electroplating baths of the type used to deposit or
8008087 Analysis of silicon concentration in phosphoric acid etchant solutions August 30, 2011
Low concentrations of silicon in an etchant solution are analyzed by adding a predetermined concentration of fluoride ions to a test solution comprising a predetermined volume of the etchant solution, and measuring the concentration of fluoride ions in the test solution. Reaction with
7932094 Method and apparatus for determining the stability of an electroless plating bath April 26, 2011
The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint. The quantity of
7879222 Detection of additive breakdown products in acid copper plating baths February 1, 2011
An additive breakdown product in an acid copper plating bath sample is detected by performing a voltammetric analysis for the leveler additive in two measurement solutions comprising different volume fractions of the copper plating bath sample in a background electrolyte. When the platin
7351349 Method and apparatus for real-time dynamic chemical analysis April 1, 2008
Methods and apparatus for real-time dynamic analysis of a chemical etching process are provided. The apparatus comprises an optical element (36) operative to pass a beam of electromagnetic radiation at least at two points in time through a liquid phase (42) comprising at least one ch
7291253 Detection of an unstable additive breakdown product in a plating bath November 6, 2007
The 3-mercaptopropylsulfonic acid (MPSA) breakdown product of the bis(sodiumsulfopropyl)disulfide (SPS) additive used in acid copper plating baths accelerates copper electrodeposition and can be detected by cyclic voltammetric stripping (CVS) analysis. In the presence of oxygen, MPSA
6890758 Measurement of complexing agent concentration in an electroless plating bath May 10, 2005
The concentration of citrate complexing agent in an electroless cobalt or nickel plating bath is determined by titrating a sample of the electroless plating bath containing a small concentration of free fluoride ion with a standard lanthanum nitrate solution. During the titration, La.sup
6749739 Detection of suppressor breakdown contaminants in a plating bath June 15, 2004
Relative concentrations of active suppressor additive species and suppressor breakdown contaminants in an acid copper electroplating bath are determined by cyclic voltammetric stripping (CVS) dilution titration analysis using two negative electrode potential limits. The analysis resu
6733656 Voltammetric reference electrode calibration May 11, 2004
In the present invention, the test reference electrode used for voltammetric analysis of a plating bath is calibrated relative to the zero-current point between metal plating and stripping at a rotating platinum disk electrode in the plating bath supporting electrolyte. This calibrat
6709561 Measurement of the concentration of a reducing agent in an electroless plating bath March 23, 2004
The concentration of a reducing agent in an electroless bath for plating a first metal is determined from the effect of the reducing agent on the electrodeposition rate of a second metal. For electroless cobalt and nickel baths, a sample of the electroless plating bath is added to an aci
6572753 Method for analysis of three organic additives in an acid copper plating bath June 3, 2003
Acid copper electroplating baths used to form ultra-fine circuitry features on semiconductor chips contain suppressor, anti-suppressor and leveler additives that must be closely controlled in order to obtain acceptable copper deposits. Cyclic voltammetric stripping (CVS) methods are avai

 
 
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