| Patent Number |
Title Of Patent |
Date Issued |
| 7429338 |
Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for |
September 30, 2008 |
| A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The compos |
| 7427361 |
Particulate or particle-bound chelating agents |
September 23, 2008 |
| The invention generally relates to compositions and methods for chemically mechanically polishing a substrate, including a polishing accelerator, which is normally one or more oxidizers, an abrasive material, and chelating particles and/or metal-absorbent clay material. In addition, |
| 7427305 |
Free radical-forming activator attached to solid and used to enhance CMP formulations |
September 23, 2008 |
| This invention relates to a method of making selected oxidizers or other free radical-producing compounds become more effective chemical etchants and/or oxidizers for CMP activities by promoting the formation of the free radicals in a CMP composition with one or more activators. The |
| 7351662 |
Composition and associated method for catalyzing removal rates of dielectric films during chemic |
April 1, 2008 |
| A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the |
| 7344988 |
Alumina abrasive for chemical mechanical polishing |
March 18, 2008 |
| Methods of manufacturing alumina abrasive for use in chemical mechanical polishing are described, wherein the abrasive is in a slurry having gamma alumina formed in a low temperature fuming process, water, an acid sufficient to maintain the pH below about 7, wherein the slurry does not |
| 7316976 |
Polishing method to reduce dishing of tungsten on a dielectric |
January 8, 2008 |
| The present invention relates generally to compositions and associated methods for chemical-mechanical polishing of substrate surfaces having at least one feature thereon comprising tungsten and at least one feature thereon comprising a dielectric material. The compositions and associate |
| 7314823 |
Chemical mechanical polishing composition and process |
January 1, 2008 |
| A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adjusts the pH of the |
| 7276180 |
Chemical mechanical polishing composition and process |
October 2, 2007 |
| A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adjusts the pH of the |
| 7247566 |
CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfoni |
July 24, 2007 |
| The invention relates to chemical mechanical polishing of substrates using an abrasive and a fluid composition, wherein certain organosulfonic acid compounds are used as oxidizers, and particularly relates to a method of polishing substrates comprising copper, tungsten, titanium, and/or |
| 7153335 |
Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltri |
December 26, 2006 |
| A composition and associated method for chemical mechanical planarization (or other polishing) are described which afford high tantalum to copper selectivity in copper CMP and which are tunable (in relation to polishing performance). The composition comprises an abrasive and an N-acy |
| 7077880 |
Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for |
July 18, 2006 |
| A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stabilizer. The compos |
| 7033942 |
Chemical mechanical polishing composition and process |
April 25, 2006 |
| A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adjusts the pH of the |
| 7029508 |
Catalyst attached to solid and used to promote free radical formation in CMP formulations |
April 18, 2006 |
| The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a activator. The activator comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The com |
| 7022255 |
Chemical-mechanical planarization composition with nitrogen containing polymer and method for us |
April 4, 2006 |
| A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polyamidopolyethyleneim |
| 7014669 |
Catalytic composition for chemical-mechanical polishing, method of using same, and substrate tre |
March 21, 2006 |
| The present invention provides a composition for chemical-mechanical polishing which comprises at least one abrasive particle having a surface at least partially coated by a catalyst. The catalyst comprises a metal other than a metal of Group 4(b), Group 5(b) or Group 6(b). The compo |
| 6979252 |
Low defectivity product slurry for CMP and associated production method |
December 27, 2005 |
| A low defectivity colloidal silica-based product slurry for use in chemical mechanical planarization (CMP) and an associated production method are described. The product slurry is produced using centrifugation of and optionally with addition of a surfactant to a starting colloidal silica |
| 6893476 |
Composition and associated methods for chemical mechanical planarization having high selectivity |
May 17, 2005 |
| A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two different methods fo |
| 6743267 |
Gel-free colloidal abrasive polishing compositions and associated methods |
June 1, 2004 |
| Gel-free colloidal abrasive polishing compositions and associated methods for polishing (e.g., chemical mechanical polishing) are described. These abrasive polishing compositions are comprised of a surface-modified colloidal abrasive that has been modified with a boron-containing com |
