| Patent Number |
Title Of Patent |
Date Issued |
| 7394024 |
Oxide superconductor current lead and method of manufacturing the same, and superconducting syst |
July 1, 2008 |
| An oxide superconductor current lead in which generation of Joule heat at joint portions with a system side conductor and a power supply side conductor is reduced with use of an oxide superconductor with less heat penetration into a super conducting equipment system is provided. A co |
| 7393596 |
Aluminum/ceramic bonding substrate and method for producing same |
July 1, 2008 |
| When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the alum |
| 7393473 |
Method for producing a composite plated product |
July 1, 2008 |
| There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on the surface thereof |
| 7387741 |
Power module member manufactured by wet treatment, and wet treatment method and wet treatment eq |
June 17, 2008 |
| The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit patte |
| 7368665 |
Circuit board and a power module employing the same |
May 6, 2008 |
| A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which is in contact with th |
| 7351372 |
Copper base alloy and method for producing same |
April 1, 2008 |
| As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus line temperature of |
| 7348493 |
Metal-ceramic circuit board |
March 25, 2008 |
| A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stress not higher than 320 |
| 7345418 |
Phosphor mixture and light emitting device using the same |
March 18, 2008 |
| A phosphor mixture containing four or more kinds of phosphors including a red phosphor, an orange phosphor, a blue phosphor, and a green phosphor, to produce emission having excellent color rendering of white light at a high color temperature, and emission in warm white which is low in c |
| 7332220 |
Iron nitride magnetic powder and method of producing the powder |
February 19, 2008 |
| An iron nitride magnetic powder consisting primarily of Fe.sub.16N.sub.2 phase whose average particle diameter determined by particle size measurement using a TEM micrograph is 20 nm or less and whose geometric standard deviation of the particle diameter is 1.4 or less. The iron nitr |
| 7314666 |
Iron nitride system magnetic powder having good storage stability |
January 1, 2008 |
| An iron nitride system magnetic powder comprising of particles comprised primarily of Fe16N.sub.2 (having an average particle diameter of up to 25 nm, for example) is provided, to which one or more elements selected from Si, P and Ti is adhered. The powder has a C/Fe atomic ratio of 0.5 |
| 7304378 |
Aluminum/ceramic bonding substrate |
December 4, 2007 |
| There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600 MPa in three-poin |
| 7276292 |
Insulating substrate boards for semiconductor and power modules |
October 2, 2007 |
| An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the Vickers hardness of the metal alloy laye |
| 7273568 |
Phosphor and production method of the same, method of shifting emission wavelength of phosphor, |
September 25, 2007 |
| A phosphor including a main production phase of a phosphor expressed by a composition formula of MmAaBbOoNn:Zz (where an element M is one or more bivalent elements, an element A is one or more trivalent elements, an element B is one or more tetravalent elements, O is oxygen, N is nit |
| 7273405 |
Sintered rare earth magnetic alloy wafer and wafer surface growing machine |
September 25, 2007 |
| A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary |
| 7256353 |
Metal/ceramic bonding substrate and method for producing same |
August 14, 2007 |
| There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and |
| 7255931 |
Aluminum/ceramic bonding substrate and method for producing same |
August 14, 2007 |
| When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grain size of the alum |
| 7255807 |
Bond magnet and ferrite magnetic powder for bond magnet |
August 14, 2007 |
| A ferrite magnetic powder for bond magnet that experiences only small decrease in coercivity when molded into a bond magnet is provided, which is a ferrite magnetic powder that includes an alkaline-earth metal constituent and exhibits a decrease in coercivity of not greater than 600 |
| 7252788 |
Phosphor, light source and LED |
August 7, 2007 |
| A phosphor with high efficiency having an excitation band corresponding to light of the ultraviolet-visible (300 to 550 nm) wavelength region emitted from a light emitting portion which emits blue or ultraviolet light is provided. A nitride of Ca, a nitride of Al, a nitride Si, and an |
| 7241501 |
Iron nitride magnetic powder and method of producing the powder |
July 10, 2007 |
| An iron nitride magnetic powder comprised primarily of Fe.sub.16N.sub.2 phase is characterized in that its coercive force Hc is 200 KA/m or greater and bulk switching field distribution BSDF is 2 or less. The magnetic powder can be produced by allowing a nitriding reaction of Fe part |
| 7238438 |
Powder for underlayer of coating-type magnetic recording medium |
July 3, 2007 |
| A powder for an underlayer of a coating-type magnetic recording medium, which powder comprises flat-acicular iron oxide particles having an average major axis length of 20 200 nm, a short axis cross-section taken perpendicularly to the long axis that has a long width and a short width, |
| 7238432 |
Metal member coated with metal layers |
July 3, 2007 |
| There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentially consisting of |
| 7235181 |
Metal powder for decomposition of organic halogen and method for manufacturing the same |
June 26, 2007 |
| The present invention is to provide metal powder capable of decomposing and remedying various range of organic halogen compounds including organic halogen compounds which are difficult to be decomposed by a conventional decomposition and remediation method. Metal powder for decomposi |
| 7235119 |
Copper particle clusters and powder containing the same suitable as conductive filler of conduct |
June 26, 2007 |
| Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivi |
| 7226573 |
Fine-grain silver oxide powder |
June 5, 2007 |
| A silver oxide powder that replaces silver powder as a silver conductive paste filler has a specific surface area measured by the BET method is 1.0 25.0 m.sup.2/g, average primary particle diameter is 1 50 nm, and average secondary particle diameter is 1 1000 nm. The silver oxide powder |
| 7219826 |
Method for producing metal/ceramic bonding substrate |
May 22, 2007 |
| There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic subst |
| 7189449 |
Metal/ceramic bonding substrate and method for producing same |
March 13, 2007 |
| In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surfac |
| 7180176 |
Radiation plate and power semiconductor module IC package |
February 20, 2007 |
| Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an |
| 7166172 |
Method of making ferromagnetic iron alloy powder for magnetic recording medium |
January 23, 2007 |
| A ferromagnetic iron alloy powder for a magnetic recording medium is composed of acicular iron-base particles of an average major axis length (X) of not less than 20 nm and not greater than 80 nm and have oxygen content of not less than 15 wt % and coercive force (Hc) of not less than |
| 7159757 |
Metal/ceramic bonding article and method for producing same |
January 9, 2007 |
| After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus lines of the alloy to bo |
| 7159310 |
Electronic part mounting substrate and method for producing same |
January 9, 2007 |
| In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an electronic part 16 being mounted on the |
| 7138756 |
Phosphor for electron beam excitation and color display device using the same |
November 21, 2006 |
| A phosphor, which has less reduction in emission efficiency and is capable of keeping high luminance even when density of an electron beam for exciting the phosphor increases, is provided. As raw materials, Ca.sub.3N.sub.2 (2N), AlN (3N), Si.sub.3N.sub.4 (3N), and Eu.sub.2O.sub.3 (3N |
| 7131483 |
Apparatus, mold, and method for manufacturing metal-ceramic composite member |
November 7, 2006 |
| A manufacturing apparatus capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member has a plurality of process regions, name |
| 7128844 |
Metal/ceramic circuit board and method for producing same |
October 31, 2006 |
| A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mixing ferric chloride with water without adding |
| 7122243 |
Metal/ceramic bonding substrate and method for producing same |
October 17, 2006 |
| There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal |
| 7090488 |
Heat treatment furnace |
August 15, 2006 |
| A heating zone (4), a cooling zone (5), and a quenching zone (6) are provided inside a linear furnace body in this order, the heating zone (4), the cooling zone (5), and the quenching zone (6) being separated by partition doors (2, 3). Conveying means of a work (W) is a tray pusher ( |
| 7074281 |
Magnetic powder for magnetic recording |
July 11, 2006 |
| A magnetic powder for magnetic recording is provided that has improved properties suitable for a magnetic recording medium used with a high-sensitivity read head utilizing an MR device. The magnetic powder is composed of iron-base acicular particles containing Co, Al, R (rare earth e |
| 7073703 |
Aluminum/ceramic bonding substrate and method for producing same |
July 11, 2006 |
| An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650.degree. C. in an inert gas to bond the aluminum plate 12 directly t |
| 7048866 |
Metal/ceramic bonding article and method for producing same |
May 23, 2006 |
| There is provided a method for producing a metal/ceramic bonding article wherein a metal member 12 is formed so as to have a predetermined shape by printing a resist 14 in a predetermined region on the metal member 12 to etch the metal member 12 after bonding the metal member 12 to a |
| 7024916 |
Vacuum heat treatment furnace and method of and apparatus for measuring carbon concentration in |
April 11, 2006 |
| A vacuum heat treatment furnace comprising a furnace shell, a casing arranged in an inner side of the furnace shell, a heat insulating layer consisting of a thick plate-like alumina-silica series ceramic fiber blanket and a thin plate-like alumina series ceramic material arranged in |
| 7012679 |
Inspection method and inspection system of surface of article |
March 14, 2006 |
| The present invention is a method for inspecting a surface of an article through an image thereof by photographing a surface to be inspected of the article with a CCD camera, in which the surface of the article is inspected by selecting two arbitrary pixels from among pixels showing the |
| 7008549 |
Circuit board, process for producing the same and a power module employing the same |
March 7, 2006 |
| Composite member 2 consisting of ceramic insulator substrate 3 and two metal layers 4A and 4B such as aluminum sheets is subjected to milling in order to remove the unwanted areas of metal layer 4A (where inter-element spacings are to be formed). In order to suppress cracking due to |
| 6997233 |
Mold and method for manufacturing metal-ceramic composite member |
February 14, 2006 |
| To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional prec |
| 6994756 |
Method of producing sintered rare earth magnetic alloy wafer |
February 7, 2006 |
| A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary |
| 6949150 |
Connector copper alloys and a process for producing the same |
September 27, 2005 |
| Copper alloy having the basic composition Cu--Zn--Sn contains 23-28 wt % Zn and 0.3-1.8 wt % Sn and satisfies the relation 6.0.ltoreq.0.25X+Y.ltoreq.8.5 (where X is the addition of Zn in wt % and Y is the addition of Sn in wt %). The alloy is cast into an ingot by melting and cooling |
| 6942742 |
Copper-based alloy excellent in dezincing resistance |
September 13, 2005 |
| A copper-based alloy excellent in dezincing resistance comprises, in percentage by weight, Cu: 57-69%, Sn: 0.3-3%, Si: 0.02-1.5%, Bi: 0.5-3%, and Pb: not more than 0.2%, where the ratio of Si/Sn expressed in weight percentage is in the range of 0.05-1 and apparent zinc content as defined |
| 6938333 |
Method of manufacturing a metal-ceramic circuit board |
September 6, 2005 |
| A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is |
| 6936337 |
Metal/ceramic circuit board |
August 30, 2005 |
| There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the cer |
| 6935554 |
Metal/ceramic bonding article and method for producing same |
August 30, 2005 |
| There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing |
| 6932852 |
Method and apparatus for enhanced purification of high-purity metals |
August 23, 2005 |
| A 99.99% pure indium feed is charged into a crucible and heated to 1250 .degree. C. by an upper heater in a vacuum atmosphere at 1.times.10.sup.-4 Torr, whereupon indium evaporates, condenses on the inner surfaces of an inner tube and drips to be recovered into a liquid reservoir in the |
| 6926999 |
Positive electrode active material for alkaline cell |
August 9, 2005 |
| A cathode active material for alkaline electrochemical cells comprising an Ag--Bi-M-containing oxidation product produced by oxidizing with an oxidizing agent an Ag--Bi-M-containing neutralized precipitate obtained by reacting inorganic acid salts of silver, bismuth and, optionally, M (M |
