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Disco Abrasive Systems, Ltd. Patents
Assignee:
Disco Abrasive Systems, Ltd.
Address:
Tokyo, JP
No. of patents:
19
Patents:












Patent Number Title Of Patent Date Issued
4947598 Method for grinding the surface of a semiconductor wafer August 14, 1990
A dresser made of bonded alundum-type abrasive is ground by a rotating blade made of bonded super abrasive to dress the blade. The surface of a semiconductor wafer is ground by the rotating dressed blade to convert it into a matte-finished surface substantially free from saw marks.
4872289 Cutter October 10, 1989
A cutter for cutting a plate-like material such as a glass sheet along concentric circular inside and outside cutting lines. The cutter includes a movably mounted supporting base stand, at least two material holding chucks disposed on the supporting base stand, and a moving device for
4843766 Cutting tool having concentrically arranged outside and inside abrasive grain layers and method July 4, 1989
A cutting tool comprising a supporting base and an outside and an inside abrasive grain layer projecting concentrically from the supporting base in a radially spaced relationship, and a method for its production. The outside and inside abrasive grain layers are formed by electrodepositin
4839996 Method and apparatus for machining hard, brittle and difficultly-machinable workpieces June 20, 1989
Machining of a hard, brittle and difficultly-machinable workpiece by a grinding wheel made of superabrasive grains. The grinding wheel is rotated at a peripheral speed of 1000 to 5500 m/min., and the grinding wheel and the workpiece are moved relative to each other in the machining direc
4817341 Cutting tool having concentrically arranged outside and inside abrasive grain layers and method April 4, 1989
A cutting tool comprising a supporting base and an outside and an inside abrasive grain layer projecting concentrically from the supporting base in a radially spaced relationship, and a method for its production. The outside and inside abrasive grain layers are formed by electrodepositin
4757550 Automatic accurate alignment system July 12, 1988
An automatic accurate alignment system for positioning an object to be worked which has a certain pattern on its surface at a required position. The system performs primary positioning of the object to be worked on the basis of low magnification pattern matching with respect to at least
4753049 Method and apparatus for grinding the surface of a semiconductor June 28, 1988
A method and an apparatus for grinding the surface of a semiconductor wafer by moving a holding table and a grinding wheel relative to each other in a predetermined direction substantially parallel to the surface of the semiconductor wafer held onto the holding table to cause the grindin
4720635 Automatic accurate alignment system January 19, 1988
An automatic accurate alignment system for positioning at a required position an object to be worked which has a certain pattern on its surface. The system includes a key pattern memory, a pattern matching device and movement control device. The key pattern memory memorizes a first s
4705016 Precision device for reducing errors attributed to temperature change reduced November 10, 1987
A precision device including a holding mechanism for holding an object and a supporting mechanism for supporting an operating element, one of which is movable in a predetermined direction. The precision device includes a detecting device for detecting the amount of movement of one of the
4696712 Semiconductor wafer mounting and cutting system September 29, 1987
A semiconductor wafer mounting and cutting system including a wafer mounting machine for mounting a semiconductor wafer to a frame and a wafer cutting machine for receiving the frame and the wafer mounted thereto fed from the wafer mounting machine and cutting the wafer as required. The
4693036 Semiconductor wafer surface grinding apparatus September 15, 1987
A grinding apparatus comprising a supporting base and at least one grinding wheel assembly disposed to face to the supporting base. The supporting base includes at least one holding table and the surface of the holding table protrudes beyond the surface of the supporting base. The grindi
4688540 Semiconductor wafer dicing machine August 25, 1987
A dicing machine for cutting a semiconductor wafer along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station, at least one alignment station, a cutting means disposed in the cutting station, a detecting means disposed in the alignment station for
4672557 Automatic accurate alignment system June 9, 1987
An accurate alignment system for positioning at a required position an object to be worked which has on its surface straight-line areas whose image density changes relatively abruptly at their both side edges. The system comprises holding means for holding the object to be worked, moving
4652135 Article holding apparatus and its use March 24, 1987
An article holding apparatus provided with a plate on which an article is placed. A light transmitting opening is formed in the plate. There is provided an optical system optically connected to the light transmitting opening. Reflection light from a part of the undersurface of the articl
4603609 Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer August 5, 1986
The invention provides an apparatus for cutting a sheet-like member such as an adhesive tape applied to a surface of a semiconductor wafer at the periphery of said semiconductor wafer.The apparatus comprises a heating rod to be brought into contact with the periphery of the semiconductor
4583325 Grinding machine April 22, 1986
A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging from coarse to fine, and rotating
4565034 Grinding and/or cutting endless belt January 21, 1986
For adaptation to grinding or cutting precise or minute parts, a grinding and/or cutting endless belt is made of grindstone comprising electrodeposited abrasive grains.
4547998 Electrodeposited grinding tool October 22, 1985
An electrodeposited grinding tool having an electrodeposited abrasive layer formed by electrodepositing abrasive grains to an electrodeposition thickness at least three times as large as the diameter of the abrasive grains. Pores are dispersed in the electrodeposited abrasive layer in a
4481738 Grinding machine November 13, 1984
A grinding machine adapted for grinding surfaces of thin workpieces comprises a rotating table provided with at least a workpiece holder on which a workpiece to be ground is held, and a plurality of grinding wheels having different grain sizes ranging from coarse to fine, and rotating

 
 
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