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Daiwa Fine Chemicals Co., Ltd. Patents
Assignee:
Daiwa Fine Chemicals Co., Ltd.
Address:
Akashi, JP
No. of patents:
12
Patents:












Patent Number Title Of Patent Date Issued
7938948 Silver and silver alloy plating bath May 10, 2011
To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin,
7628903 Silver and silver alloy plating bath December 8, 2009
A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobi
7166152 Pretreatment solution for providing catalyst for electroless plating, pretreatment method using January 23, 2007
A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (II
7056448 Method for forming circuit pattern June 6, 2006
A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver
6852210 Plating method and plating bath precursor used therefor February 8, 2005
To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a
6607653 Plating bath and process for depositing alloy containing tin and copper August 19, 2003
The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating b
6338787 Redox system electroless plating method January 15, 2002
To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a
6235093 Aqueous solutions for obtaining noble metals by chemical reductive deposition May 22, 2001
An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto c
6183545 Aqueous solutions for obtaining metals by reductive deposition February 6, 2001
An aqueous solution for the reductive deposition of metals comprising, besides water,(A) a phosphine of the general formula (1) ##STR1## in which R.sub.1, R.sub.2, and R.sub.3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and(B) a
5651873 Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface July 29, 1997
An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene
5618404 Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use April 8, 1997
An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anio
4673470 Tin, lead, or tin-lead alloy plating bath June 16, 1987
A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydroc

 
 
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