| Patent Number |
Title Of Patent |
Date Issued |
| 7938948 |
Silver and silver alloy plating bath |
May 10, 2011 |
| To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, |
| 7628903 |
Silver and silver alloy plating bath |
December 8, 2009 |
| A silver and silver alloy plating bath, includes (A) a soluble salt, having a silver salt or a mixture of a silver salt and a salt of a metal such as tin, bismuth, indium, lead, and the like; and (B) a particular aliphatic sulfide compound, such as thiobis(diethyleneglycol), dithiobi |
| 7166152 |
Pretreatment solution for providing catalyst for electroless plating, pretreatment method using |
January 23, 2007 |
| A pretreatment solution for providing a catalyst for electroless plating and a pretreatment method using the solution are provided. The pretreatment solution comprises a silver colloidal solution containing, as essential components, at least the following components (I), (II) and (II |
| 7056448 |
Method for forming circuit pattern |
June 6, 2006 |
| A method for forming a circuit pattern includes at least a step (a) of subjecting a non-conductor to electroless copper plating to form a copper film and a step (b) of etching the copper film so as to form a circuit pattern. As a catalyst for the electroless copper plating, a silver |
| 6852210 |
Plating method and plating bath precursor used therefor |
February 8, 2005 |
| To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a |
| 6607653 |
Plating bath and process for depositing alloy containing tin and copper |
August 19, 2003 |
| The present invention provides a tin-copper alloy plating bath, tin-copper-bismuth alloy plating bath or tin-copper-silver alloy plating bath containing a soluble metal compound and a specific sulfur-containing compound. The plating bath of the present invention is an alloy plating b |
| 6338787 |
Redox system electroless plating method |
January 15, 2002 |
| To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a |
| 6235093 |
Aqueous solutions for obtaining noble metals by chemical reductive deposition |
May 22, 2001 |
| An aqueous solution for obtaining a noble metal by chemical reduction containing at least one water-soluble compound or complex of a metal selected from the group consisting of gold, platinum, silver, and palladium as a source of the metal to be deposited, and at least one mercapto c |
| 6183545 |
Aqueous solutions for obtaining metals by reductive deposition |
February 6, 2001 |
| An aqueous solution for the reductive deposition of metals comprising, besides water,(A) a phosphine of the general formula (1) ##STR1## in which R.sub.1, R.sub.2, and R.sub.3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and(B) a |
| 5651873 |
Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface |
July 29, 1997 |
| An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene |
| 5618404 |
Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use |
April 8, 1997 |
| An electrolytic process for producing lead and tin sulfonates which comprises applying a DC voltage to an anode and a plurality of cathodes in an electrolytic cell and thereby dissolving lead or tin in an electrolytic solution. The electrolytic cell is partitioned by cation- and anio |
| 4673470 |
Tin, lead, or tin-lead alloy plating bath |
June 16, 1987 |
| A tin, lead, or tin-lead alloy plating bath comprising, as essential ingredients, an alkali metal salt, and a soluble divalent tin compound or/and a lead compound, all of an aliphatic or aromatic sulfocarboxylic acid of the general formula ##STR1## wherein R is a C.sub.1-4 hydroc |
