Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
DPAC Technologies Corp. Patents
Assignee:
DPAC Technologies Corp.
Address:
Garden Grove, CA
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
6660561 Method of assembling a stackable integrated circuit chip December 9, 2003
A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The chip package further comprises an integ
6573461 Retaining ring interconnect used for 3-D stacking June 3, 2003
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By perf
6573460 Post in ring interconnect using for 3-D stacking June 3, 2003
A post in ring interconnect used for 3-D stacking. A retaining ring is formed on a pad on a bottom surface of a top PCB substrate to be stacked with a bottom PCB substrate. A post is formed on a pad on a top surface of the bottom PCB substrate. A conductive paste is applied on the pad on
6566746 Panel stacking of BGA devices to form three-dimensional modules May 20, 2003
A chip stack comprising at least one base layer including a base substrate having a first conductive pattern disposed thereon. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon which is electrically connected to the first
6514793 Stackable flex circuit IC package and method of making same February 4, 2003
A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern to the edge portion. An IC device is mounted within a central aperture

 
 
  Recently Added Patents
SIC semiconductor device and method for manufacturing the same
Bread basket
Imidazole-5-carboxylic acid derivatives, the preparation method therefor and the uses thereof
Pipe coupling
Polymers derived from benzobis(silolothiophene) and their use as organic semiconductors
Remote management of networked systems using secure modular platform
Cellulose acylate laminate film, method for producing cellulose acylate laminate film, polarizer and liquid crystal display device
  Randomly Featured Patents
Friction lining
Ceramic envelope device, lamp with such a device, and method of manufacture of such devices
Method for assaying a biocomponent using 4-methoxy-1-naphthol and hydrogen peroxide
Detectors, and envelope arrangements and mounts for detectors
Form data extraction without customization
Fluid sealing system for a crystal puller
Make-up compact for mounting on a steering wheel
System and method for certifying that data received over a computer network has been checked for viruses
Patient examination gown
System which manages relationships between characters in a video game or other virtual environment