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DPAC Technologies Corp. Patents
Assignee:
DPAC Technologies Corp.
Address:
Garden Grove, CA
No. of patents:
5
Patents:












Patent Number Title Of Patent Date Issued
6660561 Method of assembling a stackable integrated circuit chip December 9, 2003
A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The chip package further comprises an integ
6573461 Retaining ring interconnect used for 3-D stacking June 3, 2003
A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By perf
6573460 Post in ring interconnect using for 3-D stacking June 3, 2003
A post in ring interconnect used for 3-D stacking. A retaining ring is formed on a pad on a bottom surface of a top PCB substrate to be stacked with a bottom PCB substrate. A post is formed on a pad on a top surface of the bottom PCB substrate. A conductive paste is applied on the pad on
6566746 Panel stacking of BGA devices to form three-dimensional modules May 20, 2003
A chip stack comprising at least one base layer including a base substrate having a first conductive pattern disposed thereon. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon which is electrically connected to the first
6514793 Stackable flex circuit IC package and method of making same February 4, 2003
A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern to the edge portion. An IC device is mounted within a central aperture

 
 
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