| Patent Number |
Title Of Patent |
Date Issued |
| 6660561 |
Method of assembling a stackable integrated circuit chip |
December 9, 2003 |
| A stackable integrated circuit chip package comprising a carrier and a flex circuit. The flex circuit itself comprises a flexible substrate having opposed top and bottom surfaces, and a conductive pattern which is disposed on the substrate. The chip package further comprises an integ |
| 6573461 |
Retaining ring interconnect used for 3-D stacking |
June 3, 2003 |
| A retaining ring interconnect. A retaining ring is formed on a perimeter of a pad on each of two adjoining surfaces of two PCB substrates. A conductive paste is applied between the pads on the two adjoining surfaces. The retaining rings are aligned and facing with each other. By perf |
| 6573460 |
Post in ring interconnect using for 3-D stacking |
June 3, 2003 |
| A post in ring interconnect used for 3-D stacking. A retaining ring is formed on a pad on a bottom surface of a top PCB substrate to be stacked with a bottom PCB substrate. A post is formed on a pad on a top surface of the bottom PCB substrate. A conductive paste is applied on the pad on |
| 6566746 |
Panel stacking of BGA devices to form three-dimensional modules |
May 20, 2003 |
| A chip stack comprising at least one base layer including a base substrate having a first conductive pattern disposed thereon. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon which is electrically connected to the first |
| 6514793 |
Stackable flex circuit IC package and method of making same |
February 4, 2003 |
| A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern to the edge portion. An IC device is mounted within a central aperture |
