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Cookson Electronics, Inc. Patents |
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Assignee: Cookson Electronics, Inc.
Address: Foxborough, MA
No. of patents: 3
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6936644 |
Releasable microcapsule and adhesive curing system using the same |
August 30, 2005 |
| An uncured epoxy adhesive comprising a resin component, a hardener component, and a microencapsulated accelerator component. The microencapsulated accelerator component comprises an infrared absorber, an accelerator and a wall that covers substantially the entire surface of the accel |
| 6881074 |
Electrical circuit assembly with micro-socket |
April 19, 2005 |
| An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate |
| 6838372 |
Via interconnect forming process and electronic component product thereof |
January 4, 2005 |
| A process for masking an electronic component substrate involving application of a temporary mask material to the substrate to form a removably adhered temporary mask over the surface. Exemplary mask materials include polymer films and aqueous hardenable liquid coatings. An electroni |
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