| Patent Number |
Title Of Patent |
Date Issued |
| 7407608 |
Resin molding equipment and resin molding method |
August 5, 2008 |
| The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for |
| 7175405 |
Compression molding machine |
February 13, 2007 |
| A compression molding machine capable of maintaining dies parallel while precisely clamping work pieces and improving quality of molded products and productivity. The compression molding machine includes a fixed platen; a movable platen; a fixed die being held by the fixed platen; a |
| 7153116 |
Resin molding machine |
December 26, 2006 |
| The resin molding machine has a simple molding die, which can be easily maintained, and is capable of molding a work without pretreatments. The resin molding machine for molding the work with resin. The resin molding machine comprises: a press section having a molding die; a cavity plate |
| 6814556 |
Resin molding machine and resin tablet feeding machine |
November 9, 2004 |
| The resin molding machine is capable of executing many functions and easily expanding and modifying the structure. In the resin molding machine, a loader and an unloader are moved on common rail sections so as to convey a work piece and a molded product. An additional rail unit has a rai |
| 6743389 |
Resin molding machine and method of resin molding |
June 1, 2004 |
| The resin molding machine and a method of resin molding of the present invention are capable of securely and efficiently mold a work piece, on which a plurality of elements are arranged. The resin molding machine comprises: a lower die on which a work piece to be molded is set; an upper |
| 6459159 |
Apparatus for sealing a semiconductor device utilizing a release film |
October 1, 2002 |
| A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a tran |
| 6444157 |
Method of resin molding |
September 3, 2002 |
| A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the mo |
| 6350113 |
Resin molding machine |
February 26, 2002 |
| A resin molding machine is capable of preventing molded products from forming resin flash on their surfaces. The resin molding machine includes a press section, a loading section, an unloading section, an accommodating section, a film feeding section, and an air sucking mechanism. By pre |
| 6344162 |
Method of manufacturing semiconductor devices and resin molding machine |
February 5, 2002 |
| The method of manufacturing semiconductor devices is capable of efficiently manufacturing semiconductor devices and preventing production of bad products. The method is executed in a molding machine including an tipper die and a lower die, in one of which a plurality of cavities correspo |
| 6261501 |
Resin sealing method for a semiconductor device |
July 17, 2001 |
| A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a tran |
| 6224360 |
Resin sealing device for chip-size packages |
May 1, 2001 |
| A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection |
| 6187243 |
Method of resin molding |
February 13, 2001 |
| The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the moldin |
| 6080354 |
Resin molding method in which a movable cavity piece allows a direct resin feed |
June 27, 2000 |
| A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal |
| 6048483 |
Resin sealing method for chip-size packages |
April 11, 2000 |
| A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection |
| 5950531 |
Electric press machine |
September 14, 1999 |
| In a feeding mechanism 4 which reciprocates the feed arm 80 in a direction of transporting a lead frame, a movable body is linked via a second fulcrum 37 (movable fulcrum) with a rocking arm 30 which is pressingly contacted with a feed cam 11 and which rocks about a first fulcrum 31 |
| 5891384 |
Method of operating a molding machine with release film |
April 6, 1999 |
| An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a materia |
| 5824252 |
Method of resin molding and resin molding machine for the same |
October 20, 1998 |
| A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the |
| 5800841 |
Resin molding machine |
September 1, 1998 |
| A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by th |
| 5770128 |
Method of transfer molding and a transfer molding machine |
June 23, 1998 |
| Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first posi |
| 5666850 |
Motor-operated press mechanism |
September 16, 1997 |
| In a motor-operated press mechanism, a rocking link is rockingly supported by a supporting shaft which is pivotally supported by a top plate of a press machine, while a crank shaft which supports a crank is supported on one end portion of the rocking link, and a drive section is provided |
| 5636430 |
General-purpose lead working machine |
June 10, 1997 |
| An improved lead working machine has a mechanism portion that supplies a leadframe 100, a working and handling portion that performs the necessary working processes on the work as it is fed consecutively, and a receiving mechanism portion that receives the worked products. A plurality of |
| 5575610 |
Transport-by-suction type die |
November 19, 1996 |
| A transport-by-suction type die for use in a working machine having working stages, the die comprises a feed arm mounted in a position above the working stage in a lower part of the die to be slidable in the direction of consecutive feed and to be vertically movable with respect to a sur |
| 5507910 |
Lead frame taping machine |
April 16, 1996 |
| The object of the present invention is to provide a lead frame taping machine, which is capable of waiting the fade at a position away from a lead frame holding section and preventing the punch from shaking when the tape-chip is taped onto the lead frame. The lead frame taping machine of |
