| Patent Number |
Title Of Patent |
Date Issued |
| 6589801 |
Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques |
July 8, 2003 |
| A method is disclosed for manufacturing chip-scale semiconductor packages at a wafer-scale level using wafer mapping techniques. In the method, a semiconductor wafer and/or a circuit substrate, each respectively comprising a plurality of individual chips and circuit pattern units, is |
| 6586826 |
Integrated circuit package having posts for connection to other packages and substrates |
July 1, 2003 |
| Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on |
| 6586824 |
Reduced thickness packaged electronic device |
July 1, 2003 |
| An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, |
| 6586677 |
Plastic integrated circuit device package having exposed lead surface |
July 1, 2003 |
| Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and l |
| 6580620 |
Matrix type printed circuit board for semiconductor packages |
June 17, 2003 |
| Disclosed is a matrix type printed circuit board (PCB) for semiconductor packages having a structure including a plurality of PCB units arranged in a matrix array having at least two rows in such a fashion that the mold runner gates of adjacent PCB units respectively arranged in adjacent |
| 6580167 |
Heat spreader with spring IC package |
June 17, 2003 |
| An RF shielded package includes a heat sink having a plurality of spring elements. The spring elements press the heat sink against a mold half during encapsulation to prevent encapsulant from leaking between the heat sink and the mold half. Further, the spring elements ground the heat si |
| 6580159 |
Integrated circuit device packages and substrates for making the packages |
June 17, 2003 |
| Integrated circuit device packages and substrates for making the packages are disclosed. One embodiment of a substrate includes a planar sheet of polyimide having a first surface, an opposite second surface, and apertures between the first and second surfaces. A planar metal die pad |
| 6580153 |
Structure for protecting a micromachine with a cavity in a UV tape |
June 17, 2003 |
| A protective layer includes a polymerized region, which forms a cavity in an interior surface of the protective layer. The protective layer is mounted to a micromachine chip such that an active area of the micromachine chip is located within the cavity of the protective layer. The pr |
| 6577013 |
Chip size semiconductor packages with stacked dies |
June 10, 2003 |
| Chip-size semiconductor packages ("CSPs") containing multiple stacked dies are disclosed. The dies are mounted on one another in a stack such that corresponding ones of the vias in the respective dies are coaxially aligned. An electrically conductive wire or pin is in each set of aligned |
| 6577012 |
Laser defined pads for flip chip on leadframe package |
June 10, 2003 |
| A leadframe includes a lead. The lead includes a wettable pad and a wettable lead surface. A non wettable barrier separates the wettable pad from the wettable lead surface, the non wettable barrier being formed from a modified portion of the leadframe. Solder wets only the wettable pad |
| 6576998 |
Thin semiconductor package with semiconductor chip and electronic discrete device |
June 10, 2003 |
| Semiconductor packages including at least one semiconductor chip and at least one electronic discrete device, such as a transistor, oscillator, optical sensor, resistor, capacitor, or inductor, are disclosed. The semiconductor chip and the discrete device are electrically coupled to |
| 6572944 |
Structure for fabricating a special-purpose die using a polymerizable tape |
June 3, 2003 |
| A structure for protecting a special-purpose area of an image sensor die or a micromachine die during singulation of the die from a wafer includes a protective layer that has a polymerized upper zone and an unpolymerized lower zone. At least part of the unpolymerized lower zone has an ad |
| 6571466 |
Flip chip image sensor package fabrication method |
June 3, 2003 |
| A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery o |
| 6570825 |
Method and circuit module package for automated switch actuator insertion |
May 27, 2003 |
| A method and circuit module package for automated switch actuator insertion provides automated assembly of circuit modules having an integrated switch actuator, such as Secure Digital cards. A switch actuator is inserted automatically into a circuit module package housing by a robotic |
| 6566164 |
Exposed copper strap in a semiconductor package |
May 20, 2003 |
| A semiconductor device includes include a package allowing for increased thermal dissipation. The device includes a power MOSFET die that is electrically connected to a portion of the substrate with a metal strap. The die and at least portions of the strap and substrate are encapsulated |
| 6564454 |
Method of making and stacking a semiconductor package |
May 20, 2003 |
| Semiconductor packages and methods of making packages are disclosed. An exemplary method includes providing a printed circuit board having a first surface with circuit traces thereon, first apertures, and a second aperture. Each circuit trace overlies a first aperture, and an end of the |
| 6563204 |
Microcircuit die-sawing protector |
May 13, 2003 |
| A method and apparatus for protecting hypersensitive microcircuits on the face of a semiconductor wafer from contamination and mechanical damage during die sawing and subsequent die handling operations include the provision of a plastic sheet having an array of protective domes formed |
| 6562655 |
Heat spreader with spring IC package fabrication method |
May 13, 2003 |
| An electronic component is mounted to an upper surface of a substrate. A heat sink is aligned above the electronic component and supported by spring elements of the heat sink on the upper surface of the substrate. The spring elements press the heat sink against a mold half during enc |
| 6555917 |
Semiconductor package having stacked semiconductor chips and method of making the same |
April 29, 2003 |
| Embodiments of semiconductor packages containing a stack of at least two semiconductor chips are disclosed, along with methods of making the same. One embodiment includes a substrate, which may be a ball grid array substrate or a metal leadframe. The stack of semiconductor chips is m |
| 6555899 |
Semiconductor package leadframe assembly and method of manufacture |
April 29, 2003 |
| A semiconductor package and the leadframe therefor having a reverse-down set part formed in the tie bar supporting the chip paddle. The reverse-down set part of the tie bar may be formed by a mechanical stamping process in such a way that it is present within the insulating body, int |
| 6552416 |
Multiple die lead frame package with enhanced die-to-die interconnect routing using internal lea |
April 22, 2003 |
| A multiple die package is formed, which allows multiple die to be interconnected using internal leads or traces from a lead frame. A plurality of slots in the paddle area of the lead frame are created which define the internal signal traces. Then the outer portions of the die paddle |
| 6548759 |
Pre-drilled image sensor package |
April 15, 2003 |
| An image sensor package includes a substrate having a central aperture. Electrically conductive traces on a lower surface of the substrate include tabs projecting below and under hanging the central aperture. An image sensor is flip chip mounted to the tabs and thus supported in the cent |
| 6546620 |
Flip chip integrated circuit and passive chip component package fabrication method |
April 15, 2003 |
| A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder pa |
| 6545345 |
Mounting for a package containing a chip |
April 8, 2003 |
| A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, |
| 6534876 |
Flip-chip micromachine package |
March 18, 2003 |
| A micromachine package includes a micromachine chip mounted as a flip chip to a substrate. The micromachine chip includes a micromachine area and bond pads formed on a front surface of the micromachine chip. The substrate includes traces formed on an upper surface of the substrate. The |
| 6534391 |
Semiconductor package having substrate with laser-formed aperture through solder mask layer |
March 18, 2003 |
| A semiconductor package and a method and a substrate for making the package are disclosed. The substrate of an exemplary package includes metal circuit patterns covered by a layer of an insulative nonphotoimageable solder mask material. A plurality of apertures are formed by laser ab |
| 6534338 |
Method for molding semiconductor package having a ceramic substrate |
March 18, 2003 |
| A method for overmolding a ceramic substrate for a semiconductor chip or other electrical device, and a resulting package, are disclosed. In one embodiment, plural ceramic substrate panels having a matrix of semiconductor chips thereon are precisely located on and attached to a tempo |
| 6532157 |
Angulated semiconductor packages |
March 11, 2003 |
| A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a right angle, between the portions. Each of the portions has electrically conductive paths |
| 6531784 |
Semiconductor package with spacer strips |
March 11, 2003 |
| A semiconductor package incorporates spacer strips enabling one or more semiconductor dies having central terminal pads to be stacked on top of one another within the package and reliably wire bonded to an associated substrate without shorting of the bonded wires. Each of the spacer stri |
| 6530735 |
Gripper assembly |
March 11, 2003 |
| A controlled material transport system (MTS) for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid robot vehicle mountable to a passive track system, which can be routed to service a |
| 6530515 |
Micromachine stacked flip chip package fabrication method |
March 11, 2003 |
| To form a micromachine package, bond pads on a front surface of a controller chip are aligned with corresponding traces on a front surface of a micromachine chip. The bond pads are physically connected to the traces thus mounting the controller chip as a flip chip to the micromachine |
| 6528875 |
Vacuum sealed package for semiconductor chip |
March 4, 2003 |
| A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is |
| 6528869 |
Semiconductor package with molded substrate and recessed input/output terminals |
March 4, 2003 |
| Semiconductor chip packages having molded plastic substrates and recessed I/O terminals are disclosed, along with methods of making such packages. In an exemplary embodiment, the molded plastic substrate includes a metal interconnect pattern and a plurality of indentations in a surface t |
| 6528857 |
Chip size image sensor bumped package |
March 4, 2003 |
| An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. Interior traces are formed on a lower surface of a step up ring. |
| 6526653 |
Method of assembling a snap lid image sensor package |
March 4, 2003 |
| An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is |
| 6525406 |
Semiconductor device having increased moisture path and increased solder joint strength |
February 25, 2003 |
| Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a plurality of tie bars. An perimeter of an upper and lower surface of the die pad is half-etched to |
| 6522015 |
Micromachine stacked wirebonded package |
February 18, 2003 |
| A micromachine package includes a micromachine chip having a micromachine area in a front surface of the micromachine chip. The package further includes a controller chip having a rear surface and a front surface. Bond pads are on the front surface of the controller chip. A bead secures |
| 6521987 |
Plastic integrated circuit device package and method for making the package |
February 18, 2003 |
| A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed to prevent the leads from being |
| 6521982 |
Packaging high power integrated circuit devices |
February 18, 2003 |
| The invention provides a method and apparatus for electrically connecting the die of a high power semiconductor device to a substrate with a conductive strap such that the connection is resistant to the shear stresses resulting with changes in temperature. In one embodiment, the meth |
| 6518659 |
Stackable package having a cavity and a lid for an electronic device |
February 11, 2003 |
| Package embodiments for housing an electronic device are disclosed, along with methods of making and interconnecting the packages. The package body may be formed of an injection molded plastic encapsulant. The package body includes a cavity in which the electronic device is contained. A |
| 6517656 |
Method of making an integrated circuit package using a batch step for curing a die attachment fi |
February 11, 2003 |
| Methods of making packages for integrated circuit devices, and in particular for attaching a plurality of integrated circuit die to a substrate strip, are disclosed. The substrate includes a plurality of die mounting sites. A B-staged epoxy film is on each site. An exemplary method i |
| 6515356 |
Semiconductor package and method for fabricating the same |
February 4, 2003 |
| There is provided a semiconductor package and method for fabricating the same. An embodiment of the semiconductor package includes: a semiconductor chip having a first face and a second face, the first face having a plurality of input/output pads formed thereon; a circuit board composed |
| 6515269 |
Integrally connected image sensor packages having a window support in contact with a window and |
February 4, 2003 |
| An image sensor package includes an image sensor having an active area, a window, and a window support in contact with the active area and in contact with the window. The window support entirely encloses, and thus protects, the active area of the image sensor. During use, radiation p |
| 6512288 |
Circuit board semiconductor package |
January 28, 2003 |
| A circuit board for semiconductor packages capable of fabricating a large number of semiconductor packages in a single circuit board, the circuit board including: a resin layer in the form of a rectangular sheet with first and second sides, the resin layer having a plurality of through |
| 6512219 |
Fabrication method for integrally connected image sensor packages having a window support in con |
January 28, 2003 |
| A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes |
| 6509637 |
Low profile mounting of thick integrated circuit packages within low-profile circuit modules |
January 21, 2003 |
| An assembly and method for mounting thick integrated circuit packages within a low-profile circuit module provides a low cost alternative to special integrated circuit packaging requirements. Pre-packaged thin-small-outline-packages (TSOP), thin-plastic-quad-flatpack (TQFP) and other |
| 6509560 |
Chip size image sensor in wirebond package with step-up ring for electrical contact |
January 21, 2003 |
| An image sensor package includes an image sensor having an upper surface. The image sensor further includes an active area and bond pads on the upper surface. A window is supported above the active area by a window support. A step up ring is mounted above a noncritical region of the uppe |
| 6507102 |
Printed circuit board with integral heat sink for semiconductor package |
January 14, 2003 |
| A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or "slug," for the mounting of one or more semiconductor chips, capable of efficiently conducting away at least five watts from the package in typ |
| 6503780 |
Wafer scale image sensor package fabrication method |
January 7, 2003 |
| To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pres |
| 6501184 |
Semiconductor package and method for manufacturing the same |
December 31, 2002 |
| A semiconductor package and method for manufacturing the same is disclosed. The semiconductor package comprises a semiconductor chip, a circuit board, an electrical connection means, an encapsulation material and a plurality of conductive balls. The semiconductor chip has a first surface |
