| Patent Number |
Title Of Patent |
Date Issued |
| 6686651 |
Multi-layer leadframe structure |
February 3, 2004 |
| A leadframe and a package including the leadframe are disclosed. At least one lead includes a nonconductive layer on the inner end segment of the lead set back from its inner end. An electrically conductive layer is on a surface of the nonconductive layer. The nonconductive layer electri |
| 6686649 |
Multi-chip semiconductor package with integral shield and antenna |
February 3, 2004 |
| A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an an |
| 6686588 |
Optical module with lens integral holder |
February 3, 2004 |
| An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface |
| 6686580 |
Image sensor package with reflector |
February 3, 2004 |
| An image sensor package includes a substrate and an image sensor coupled to the substrate. The image sensor includes an upper surface having an active area. A reflector lid is coupled to the substrate. The reflector lid has a first panel having a planar surface. The planar surface is at |
| 6684496 |
Method of making an integrated circuit package |
February 3, 2004 |
| A method of making a package includes providing a metal leadframe having a die pad in a rectangular frame. Tabs extend from the frame toward the die pad. The die pad and tabs have side surfaces with reentrant portions and asperities. A die is attached to the die pad. The die is electrica |
| 6683795 |
Shield cap and semiconductor package including shield cap |
January 27, 2004 |
| A shield cap and a semiconductor package including a shield cap provide protection for passive components mounted on a substrate of a semiconductor package. The shield cap provides a means for manufacturing a semiconductor package that includes a semiconductor die and passive compone |
| 6683377 |
Multi-stacked memory package |
January 27, 2004 |
| A multiple chip package and method of making the package allow multiple same size or different size chips to be stacked over each other, thereby creating a thin profile multi-chip package. Chips are attached to one surface of a continuous flexible substrate. The substrate has a metal |
| 6677663 |
End grid array semiconductor package |
January 13, 2004 |
| A lead end grid array semiconductor package comprises a leadframe having a plurality of leads. The leads extend outwardly from a chip paddle and have an outer end that defines an outer perimeter of the leadframe. A plurality of inner protrusions and outer protrusions are located on a low |
| 6677662 |
Clamp and heat block assembly for wire bonding a semiconductor package assembly |
January 13, 2004 |
| A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars bei |
| 6672773 |
Optical fiber having tapered end and optical connector with reciprocal opening |
January 6, 2004 |
| A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includ |
| 6670698 |
Integrated circuit package mounting |
December 30, 2003 |
| A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated copper and are therefore harder and |
| 6670551 |
Image sensing component package and manufacture method thereof |
December 30, 2003 |
| The present invention discloses an image sensing semiconductor package and manufacture method thereof utilizing the plastic leaded chip carrier (PLCC) manufacture process to produce image sensing chips with a cheaper plastic carrier, and it also seals dry high-pressure gas inside the ima |
| 6667544 |
Stackable package having clips for fastening package and tool for opening clips |
December 23, 2003 |
| Embodiments of stackable packages for an electronic device, such as an integrated circuit chip or a micro-machine, are disclosed. The packages may be stacked and electrically interconnected without soldering. The package includes a molded plastic body. Stacking clips are molded into the |
| 6662493 |
Tree watering device |
December 16, 2003 |
| A tree watering device suitable for indicating the level of water pooled near the trunk of the tree for hydrating purposes. In one embodiment, the device comprises a hollow conduit with a perforated end cap on one end and a funnel on the other. The device also comprises a float positione |
| 6661080 |
Structure for backside saw cavity protection |
December 9, 2003 |
| A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of t |
| 6660559 |
Method of making a chip carrier package using laser ablation |
December 9, 2003 |
| A chip carrier package is made by using a laser-ablatable solder mask to cover areas of conductive traces on the surface of a substrate that were left uncovered during conventional processes using photoresist. These areas of the conductive traces are uncovered by using a laser to remove |
| 6657298 |
Integrated circuit chip package having an internal lead |
December 2, 2003 |
| A package for an integrated circuit chip is disclosed, along with structures and methods for making and mounting the package. An exemplary embodiment of the package includes a molded body having leads embedded therein with an aperture adjacent each of the leads. A portion of each lea |
| 6656765 |
Fabricating very thin chip size semiconductor packages |
December 2, 2003 |
| A method for fabricating LGA-, LCCY- and BGA-types of very thin, chip size semi-conductor packages ("VCSP's") includes substantially reducing the thickness of a semiconductor wafer containing the semiconductor chips to be packaged by grinding and/or etching the wafer from its back side p |
| 6650019 |
Method of making a semiconductor package including stacked semiconductor dies |
November 18, 2003 |
| This invention provides a method for making a semiconductor package with stacked dies that eliminates fracturing of the upper die(s) during the wire bonding process. One embodiment of the method includes the provision of a substrate and pair of semiconductor dies, each having opposite to |
| 6646339 |
Thin and heat radiant semiconductor package and method for manufacturing |
November 11, 2003 |
| A semiconductor package which is improved in thinness and heat radiation and a method for making the same. The package includes a semiconductor chip electrically connected to leads of a leadframe via input and output bond pads. The leadframe may have a ground ring formed therein. The lea |
| 6646290 |
Optical structure having an optical diode and a sensor in separate apertures inside double insul |
November 11, 2003 |
| An optic semiconductor package includes a plate shaped substrate having an insulation layer through which two spaced apart layer apertures are formed. The substrate further includes a plurality of electrically conductive patterns formed on the wall surfaces of the layer apertures and |
| 6642610 |
Wire bonding method and semiconductor package manufactured using the same |
November 4, 2003 |
| A semiconductor package including plural semiconductor chips, and a wire bonding step for electrically interconnecting the semiconductor chips, are disclosed. In an exemplary method, a substrate is provided. Conductive circuit patterns are provided outside of a chip mounting region of th |
| 6639308 |
Near chip size semiconductor package |
October 28, 2003 |
| A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a leadframe, a semiconductor chip attached to the leadframe, electrical connectors electrically conne |
| 6638789 |
Micromachine stacked wirebonded package fabrication method |
October 28, 2003 |
| To form a micromachine package, a bead is applied to the rear surface of a controller chip. The controller chip is positioned above an active area in a front surface of a micromachine chip. The bead is attached to the front surface of the micromachine chip to attach the controller chip t |
| 6632997 |
Personalized circuit module package and method for packaging circuit modules |
October 14, 2003 |
| A personalized circuit module package and method for packaging circuit modules provides graphical packaging for memory modules and other circuit modules. A removable housing is attached to a circuit module containing one or more integrated circuits bonded to a carrier and covered with an |
| 6630728 |
Plastic integrated circuit package and leadframe for making the package |
October 7, 2003 |
| Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad |
| 6630726 |
Power semiconductor package with strap |
October 7, 2003 |
| A semiconductor package and a method for fabricating a semiconductor package are disclosed. In one embodiment, the semiconductor package includes an exposed portion of a conductive strap at a package horizontal first surface and exposed surfaces of multiple leads at a package horizon |
| 6630661 |
Sensor module with integrated discrete components mounted on a window |
October 7, 2003 |
| An optical module includes a window having an interior, e.g., first, surface. The interior surface includes a central region and a peripheral region. A first electronic component is coupled to the peripheral region. The optical module further includes a substrate and an image sensor |
| 6629633 |
Chip size image sensor bumped package fabrication method |
October 7, 2003 |
| To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the up |
| 6627987 |
Ceramic semiconductor package and method for fabricating the package |
September 30, 2003 |
| A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically |
| 6627977 |
Semiconductor package including isolated ring structure |
September 30, 2003 |
| A semiconductor package includes a chip mounting pad having a peripheral edge. The package further includes a semiconductor chip attached to the chip mounting pad. The package further includes a plurality of leads which each have an inner end disposed adjacent the peripheral edge in spac |
| 6627976 |
Leadframe for semiconductor package and mold for molding the same |
September 30, 2003 |
| The invention relates to a leadframe for semiconductor packages and a mold for molding the semiconductor package. The leadframe of the invention reduces occurrences of chip-out and floating of a chip paddle upon singulation after encapsulation. The leadframe inner voids define a chip |
| 6627864 |
Thin image sensor package |
September 30, 2003 |
| A thin image sensor package includes an image sensor having an active area which is responsive to radiation. The image sensor is mounted to a substrate which is transparent to the radiation. The image sensor is mounted such that the active area of the image sensor faces the substrate. |
| 6624921 |
Micromirror device package fabrication method |
September 23, 2003 |
| A window is mounted directly to an upper surface of a micromirror device chip. More particularly, the window is mounted above a micromirror device area on the upper surface of the micromirror device chip by a bead. The window in combination with the bead form a hermetic enclosure about t |
| 6624005 |
Semiconductor memory cards and method of making same |
September 23, 2003 |
| Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a substrate having opposite fi |
| 6620862 |
Sheet resin composition and process for manufacturing semiconductor device therewith |
September 16, 2003 |
| A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabr |
| 6620646 |
Chip size image sensor wirebond package fabrication method |
September 16, 2003 |
| To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. A noncritical region of the upper surface of the image sensor is between the active area and bond pads of the image sensor. A lower surface of a step up ring is mounted above |
| 6616436 |
Apparatus for manufacturing semiconductor packages |
September 9, 2003 |
| A mold for manufacturing semiconductor packages, which allows leadframes to be easily separated from a top mold section after a molding process by utilizing eject pins therein. The mold includes a bottom mold section having housing parts on the upper surface so as to allow leadframes to |
| 6614102 |
Shielded semiconductor leadframe package |
September 2, 2003 |
| A semiconductor chip package includes a plurality of leadframe portions and a semiconductor die mounted on at least one of the leadframe portions. A shield element is attached to at least one of the leadframe portions. A package mold surrounds the semiconductor die and the shield element |
| 6611047 |
Semiconductor package with singulation crease |
August 26, 2003 |
| An integrated circuit chip package comprising a lead frame having an integrated circuit die electrically connected thereto. Partially encapsulating the lead frame and the integrated circuit die is a package body. The package body includes the central portion which is circumvented by |
| 6610167 |
Method for fabricating a special-purpose die using a polymerizable tape |
August 26, 2003 |
| A method includes adhesively mounting an adhesive lower surface of a protective layer to a top surface of a die such as an image sensor die or a micromachine die. A special-purpose area on the top surface of the die is contacted and protected by said protective layer. The protective laye |
| 6608497 |
Apparatus and method for allowing testing of semiconductor devices at different temperatures |
August 19, 2003 |
| An apparatus and method for maintaining a uniform temperature to allow for the environmental testing of an integrated circuit. A contactor assembly is used for connecting the integrated circuit to a piece of testing equipment. The contactor assembly is able to altering a temperature of t |
| 6605866 |
Stackable semiconductor package and method for manufacturing same |
August 12, 2003 |
| Micro lead frame (MLF)-type semiconductor packages that allow the semiconductor packages to be stacked on top of each other. One aspect of the semiconductor package includes a leadframe, a plurality of electrical connectors, a semiconductor chip, and a sealing material for encapsulating |
| 6605865 |
Semiconductor package with optimized leadframe bonding strength |
August 12, 2003 |
| A semiconductor package including a sealing part which is bonded to a lead frame. The lead frame is formed to include portions of reduced thickness for purposes of providing maximum crack prevention during a singulation process involved in the manufacture of the semiconductor package. |
| 6603183 |
Quick sealing glass-lidded package |
August 5, 2003 |
| An image sensor package includes a substrate and an image sensor mounted to the substrate. Bond pads of the image sensor are wirebonded to interior traces on the substrate by bond wires. An encapsulant encloses the bond wires, the encapsulant being formed of a first optically curable mat |
| 6603072 |
Making leadframe semiconductor packages with stacked dies and interconnecting interposer |
August 5, 2003 |
| In a leadframe type of semiconductor package, the internal electrical interconnectability of and signal routing between multiple dies laminated in a stack with the die paddle of the leadframe is substantially enhanced by laminating an "interposer" in the stack. The interposer comprises a |
| 6601293 |
Method of making an electromagnetic interference shield device |
August 5, 2003 |
| A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An electrically conductive dam structure is disposed on the surface of the substrate with the |
| 6597059 |
Thermally enhanced chip scale lead on chip semiconductor package |
July 22, 2003 |
| A thermally enhanced, chip-scale, Lead-on-Chip ("LOC") semiconductor package includes a substrate having a plurality of metal lead fingers in it. A semi-conductor chip having an active surface with a plurality of ground, power, and signal connection pads thereon is mounted on an upper |
| 6596212 |
Method and apparatus for increasing thickness of molded body on semiconductor package |
July 22, 2003 |
| A simple, inexpensive method and apparatus are provided for increasing the thickness of a body molded on a semiconductor package without the need for a new mold, or for reworking the parts of an existing mold. The method includes providing a mold having parts that engage each other at |
| 6593545 |
Laser defined pads for flip chip on leadframe package fabrication method |
July 15, 2003 |
| A method includes modifying wettable regions of a leadframe with a laser to form non wettable barriers. Wettable pads are defined with the non wettable barriers. Since the non wettable barriers are formed in a single automated step with the laser, the non wettable barriers are formed at |
