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Alfachimici S.p.A. Patents |
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Assignee: Alfachimici S.p.A.
Address: Moncalieri, IT
No. of patents: 6
Patents:
| Patent Number |
Title Of Patent |
Date Issued |
| 6372027 |
Process for promoting adhesion between an inorganic substrate and an organic polymer |
April 16, 2002 |
| The invention relates to a process, and compositions for its implementation, to promote adhesion between an inorganic substrate and an organic polymer, especially between the copper surfaces of printed circuits for electronic use and a polymer resin, in which an organometallic layer |
| 5104687 |
Reduced cycle process for the manufacture of printed circuits, and a composition for carrying ou |
April 14, 1992 |
| A process for manufacturing printed circuits provided with through holes, which comprises a cleaning pretreatment including a possible treatment by an organic solvent, a treatment in an alcaline solution of permanganate and a treatment for permanganate reduction, and a subsequent metalli |
| 4443257 |
Stabilizing mixture for a chemical copper plating bath |
April 17, 1984 |
| An aqueous solution for electroless autocatalytic copper plating, containing a source of cupric ions, a source of hydroxylic ions, a reducing agent and a complexing agent in such a quantity as to render soluble the cupric ions in an alkaline medium, which further contains a stabilizi |
| 4439338 |
Solution for stripping a layer of tin or tin-lead alloy from a substrate by means of a spraying |
March 27, 1984 |
| The invention relates to a chemical solution capable of selectively stripping a layer of tin or tin-lead alloy from a substrate, generally of copper, by means of a spraying operation, without requiring the use of any specially designed machine, inasmuch as the solution does not exhibit a |
| 4167416 |
Composition for the electroless deposition of nickel base alloys |
September 11, 1979 |
| The electroless deposition of nickel base alloys is improved by incorporating in the bath ions of vanadium and of at least one of the metals thallium, vanadium, tin, zinc or tungsten. Three of these metals give even better results, and best results are obtained with four or all five. |
| 4082557 |
Silver base activating solutions for electroless copper deposition |
April 4, 1978 |
| A silver base activating solution, for use prior to electroless copper deposition, contains a salt of a weak oxyacid of an element of group III, IV, V or VI of the periodic system, e.g. sodium tetraborate. A relatively low silver concentration, within the range of 0.01 g/l to 1 g/l can |
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