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Akustica, Inc. Patents
Assignee:
Akustica, Inc.
Address:
Pittsburgh, PA
No. of patents:
11
Patents:












Patent Number Title Of Patent Date Issued
8203190 MEMS device including a chip carrier June 19, 2012
A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier
8144906 Wind immune microphone March 27, 2012
Disclosed is an acoustic device comprising an enclosed housing defining an inner volume and having a front and a back; an acoustic port penetrating the front of the enclosed housing; a first and second sense structure attached to the inside of the housing and defining a gap between t
8094980 Proof-mass with supporting structure on integrated circuit-MEMS platform and method of fabricati January 10, 2012
Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor l
7863714 Monolithic MEMS and integrated circuit device having a barrier and method of fabricating the sam January 4, 2011
An integrated circuit device includes a semiconductor die, the semiconductor die including a semiconductor substrate, driving/control circuitry disposed along a peripheral region of the semiconductor die, a MEMS device disposed within a central region of the semiconductor die, and a
7824943 Methods for trapping charge in a microelectromechanical system and microelectromechanical system November 2, 2010
Many inventions are disclosed. Some aspects are directed to MEMS, and/or methods for use with and/or for fabricating MEMS, that supply, store, and/or trap charge on a mechanical structure disposed in a chamber. Various structures may be disposed in the chamber and employed in supplyi
7763488 Method of fabricating MEMS device July 27, 2010
A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier
7640805 Proof-mass with supporting structure on integrated circuit-MEMS platform January 5, 2010
Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor l
7202101 Multi-metal layer MEMS structure and process for making the same April 10, 2007
The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabrica
7049051 Process for forming and acoustically connecting structures on a substrate May 23, 2006
The present invention describes a processes that builds an acoustic cavity, a chamber, and vent openings for acoustically connecting the chamber with the acoustic cavity. The dry etch processes may include reactive ion etches, which include traditional parallel plate RIE dry etch pro
6943448 Multi-metal layer MEMS structure and process for making the same September 13, 2005
The present invention is directed to a structure comprised of alternating layers of metal and sacrificial material built up using standard CMOS processing techniques, a process for building such a structure, a process for fabricating devices from such a structure, and the devices fabrica
6936524 Ultrathin form factor MEMS microphones and microspeakers August 30, 2005
A process comprises reducing the thickness of a substrate carrying a plurality of devices, with at least certain of the devices having a micro-machined mesh. A carrier wafer is attached to the back side of the substrate and the fabrication of the devices is completed from the top sid

 
 
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