| Patent Number |
Title Of Patent |
Date Issued |
| D592583 |
Aircraft |
May 19, 2009 |
|
| 7599191 |
Electrochemical low ESR capacitor with connector |
October 6, 2009 |
| An electrochemical double layer capacitor (DLC) is configured for mounting on a PCB. A first connector component is configured at each individual terminal lead of the DLC capacitor. A second connector component is mounted on the PCB and includes a number of parallel connector elements |
| 7576968 |
Plated terminations and method of forming using electrolytic plating |
August 18, 2009 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs ar |
| 7573698 |
Window via capacitors |
August 11, 2009 |
| A method of forming a window via capacitor comprises a first step of providing a plurality of interleaved dielectric layers and paired electrode layers to create a multilayered arrangement characterized by top and bottom surfaces and a plurality pf side surfaces. First and second tra |
| 7554792 |
Cathode coating for a wet electrolytic capacitor |
June 30, 2009 |
| A wet electrolytic capacitor that comprises an anode, cathode, and working electrolyte is provided. The cathode contains a coating disposed over a surface of a current collector, wherein the coating comprises a plurality of electrochemically-active particles and a binder. The binder is f |
| 7532457 |
Fused electrolytic capacitor assembly |
May 12, 2009 |
| A fused electrolytic capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the fused electrolytic capacitor assembly contains an electrolytic capacitor element and a surface mount fuse that are con |
| 7511943 |
Wet electrolytic capacitor containing a cathode coating |
March 31, 2009 |
| A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a substrate and a coating overlying the substrate. The coating comprises a sintered body containing carbonaceous particles (e.g., activated carbon) and inorganic particles |
| 7480130 |
Wet electrolytic capacitor |
January 20, 2009 |
| A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto. The metal particles have a median size of from about 20 to about 500 micro |
| 7468882 |
Solid electrolytic capacitor assembly |
December 23, 2008 |
| An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a first solid electrolytic capacitor element and second solid electrolytic capacitor element posi |
| 7463474 |
System and method of plating ball grid array and isolation features for electronic components |
December 9, 2008 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of first and second polarity electrode layers. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the electrodes and |
| 7460358 |
Solid electrolytic capacitor containing a protective adhesive layer |
December 2, 2008 |
| An electrolytic capacitor containing a protective adhesive layer positioned between the dielectric layer and the solid electrolyte layer (e.g., a conductive polymer layer, manganese dioxide) is generally disclosed. The protective adhesive layer can include a polymer having a repeatin |
| 7460356 |
Neutral electrolyte for a wet electrolytic capacitor |
December 2, 2008 |
| A working electrolyte for use in a wet electrolytic capacitor is provided. The electrolyte is relatively neutral and has a pH of from about 5.0 to about 8.0, in some embodiments from about 5.5 to about 7.5, and in some embodiments, from about 6.0 to about 7.5. Despite possessing a neutra |
| 7456073 |
Wet electrolytic capacitors |
November 25, 2008 |
| A wet electrolytic capacitor that includes an anode, cathode, and a liquid electrolyte disposed therebetween is provided. The cathode contains a metal oxide coating, such as NbO.sub.2, in conjunction with other optional coatings to impart improved properties to the capacitor. |
| 7414857 |
Multilayer ceramic capacitor with internal current cancellation and bottom terminals |
August 19, 2008 |
| Low inductance capacitors include electrodes that are arranged among dielectric layers and oriented such that the electrodes are substantially perpendicular to a mounting surface. Vertical electrodes are exposed along a device periphery to determine where termination lands are formed, |
| 7410725 |
Electrochemical energy storage device having improved enclosure arrangement |
August 12, 2008 |
| An improved electrochemical single or multi-cell energy storage device and casing are provided. The casing may be a pair of U-shaped shells, a single foil piece or even a tube-shaped structure which encases the internal electrochemical cell stack. The energy storage device and casing |
| 7352563 |
Capacitor assembly |
April 1, 2008 |
| An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a multi-anode stack of at least two electrolytic capacitors and at least one ceramic component, w |
| 7344981 |
Plated terminations |
March 18, 2008 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electron |
| 7280343 |
Low profile electrolytic capacitor assembly |
October 9, 2007 |
| An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. The capacitor assembly contains multiple discrete solid electrolytic capacitors that are "finished" in the sense that they are provided with leads a |
| 7271995 |
Electrolytic capacitor with improved volumetric efficiency |
September 18, 2007 |
| Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent in a generally perpen |
| 7263764 |
Method for adjusting performance characteristics of a multilayer component |
September 4, 2007 |
| A method for adjusting the equivalent series resistance (ESR) of a multi-layer component includes providing at least first and second layers separated by an insulating layer, providing a resistive layer between the inslulating layer and one of the first or second electrode layers, and |
| 7177137 |
Plated terminations |
February 13, 2007 |
| A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electron |
| 7170737 |
Window via capacitor |
January 30, 2007 |
| A window via capacitor comprises a stacked multilayer configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. An alternative window via capacitor comprises a stacked configuration of a bottom window layer, a bottom tra |
| 7161794 |
Component formation via plating technology |
January 9, 2007 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 7154374 |
Plated terminations |
December 26, 2006 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many t |
| 7152291 |
Method for forming plated terminations |
December 26, 2006 |
| Improved method steps for terminating multilayer electronic components are disclosed. Monolithic components are formed with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many |
| 7133275 |
Integrated capacitor assembly |
November 7, 2006 |
| A single layer capacitive device including a portion of pre-fired ceramic material and one or more terminations is formed with manufacturing steps that are easily modified to customize size and other aspects of such devices. The single layer devices may be utilized by themselves or s |
| 7099143 |
Wet electrolytic capacitors |
August 29, 2006 |
| A wet electrolytic capacitor that includes an anode, cathode, and a liquid electrolyte disposed therebetween is provided. The cathode contains a metal oxide coating, such as NbO.sub.2, in conjunction with other optional coatings to impart improved properties to the capacitor. |
| 7077658 |
Angled compliant pin interconnector |
July 18, 2006 |
| An angled compliant pin connector is provided, comprising an insulative housing and a plurality of press fit pins. Each said pin includes a first leg and a second leg, the legs joining to define a V-shape. One or both such legs may define an aperture therethrough, the apertures at least |
| 7067172 |
Component formation via plating technology |
June 27, 2006 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 7057878 |
Discrete component array |
June 6, 2006 |
| Integrated passive component assemblies utilize array shell or array frame receiving structures to isolate and protect discrete passive components and provide a modular configuration for mounting to a substrate. Receiving structure embodiments include a base portion, spacer ribs, and |
| 7054136 |
Controlled ESR low inductance multilayer ceramic capacitor |
May 30, 2006 |
| A multilayer ceramic capacitor assembly capable of exhibiting low high-frequency inductance and a controlled equivalent series resistance (ESR) while maintaining a useful capacitance value includes respective pluralities of first and second electrode elements interleaved to form a st |
| 7016175 |
Window via capacitor |
March 21, 2006 |
| A window via capacitor includes a stacked configuration of at least one bottom layer, a plurality of first and second layers, a transition layer and a cover layer. Alternatively, bottom window and transition layers, a plurality of first and second layers, followed by top window and cover |
| 7006359 |
Modular electronic assembly and method of making |
February 28, 2006 |
| A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements |
| 6982863 |
Component formation via plating technology |
January 3, 2006 |
| Improved terminations, interconnection techniques, and inductive element features for multilayer electronic components are formed in accordance with disclosed plating techniques. Monolithic components are provided with plated terminations whereby the need for typical thick-film termi |
| 6972942 |
Plated terminations |
December 6, 2005 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typic |
| 6963493 |
Multilayer electronic devices with via components |
November 8, 2005 |
| A method of using blind via to house electronic components within an electrical device is provided. Such a method allows for the vertical orientation of various types of passive components within a layer of a printed circuit board (PCB) or an integrated passive device (IPD). One exem |
| 6960366 |
Plated terminations |
November 1, 2005 |
| Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typic |
| 6928727 |
Apparatus and method for making electrical connectors |
August 16, 2005 |
| A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the array is fitted between, and soldered to the boards to complete a circuit. The method of |
| 6898070 |
Transmission line capacitor |
May 24, 2005 |
| A transmission line capacitor includes at least two side-by-side capacitor portions spaced apart between a separating portion all contained in a single monolithic body. Such transmission line capacitors provide specific capacitor functionality for parallel transmission lines in a printed |
| 6870727 |
Electrolytic capacitor with improved volumetric efficiency |
March 22, 2005 |
| Surface mount electrolytic capacitors are provided with anode and cathode terminations having respective first termination portions provided on the bottom surface of a molded package in a generally coplanar configuration. A second cathode termination portion is bent in a generally perpen |
| 6864147 |
Protective coating for electrolytic capacitors |
March 8, 2005 |
| A solid electrolytic capacitor that comprises an anode that contains a valve-action metal (e.g., tantalum, niobium, and the like) and a dielectric film overlying the anode is provided. The capacitor also comprises a protective coating overlying the dielectric film, wherein the protec |
| 6860741 |
Apparatus and methods for retaining and placing electrical components |
March 1, 2005 |
| A hermaphroditic or non-gender specific electrical connector is provided having at least two portions which press or mate together in forming the connector. A first connection unit and a substantially identical second connection unit are joined. Elongated cantilever-type conductive conta |
| 6851954 |
Electrical connectors and electrical components |
February 8, 2005 |
| A hermaphroditic or non-gender specific electrical connector is provided having at least two portions which press or mate together in forming the connector. A first connection unit and a substantially identical second connection unit are joined. Elongated cantilever-type conductive conta |
| 6832420 |
Method of manufacturing a thin film capacitor array |
December 21, 2004 |
| An electronic device has a plurality of capacitors in an ultra-small integrated package. The device has a plurality of terminal structures on one terminal side of the package to permit inverted mounting to a printed circuit board. The terminals are widely spaced, with the individual |
| 6816354 |
Single layer capacitor milled part |
November 9, 2004 |
| A single layer capacitive device and a method of making the same are provided. Such method allows for perfect registration between the capacitive plates thus eliminating any significant amount of fringe capacitance and assuring a uniform fringe border around the device. Such a border |
| 6757152 |
Cascade capacitor |
June 29, 2004 |
| Multi-layer and cascade capacitors for use in high frequency applications and other environments are disclosed. The subject capacitor may have multiple capacitor components or aspects thereof in an integrated package. Such components may include, for example, thin film BGA components, |
| 6678927 |
Miniature surface mount capacitor and method of making same |
January 20, 2004 |
| Surface mount capacitors are made having ultra-small dimensions of length, width and height. For example, capacitors of 0402 size and smaller may be produced having lower height than has been achieved in the prior art. The components have L-shaped terminations on respective ends thereof, |
| 6674635 |
Protective coating for electrolytic capacitors |
January 6, 2004 |
| A solid electrolytic capacitor having an anode that contains a valve-action metal (e.g., tantalum, niobium, and the like) and a dielectric film overlying the anode is provided. The capacitor also include a protective coating overlying the dielectric film, wherein the protective coating |
| 6611421 |
Non-polarized tantalum capacitor and capacitor array |
August 26, 2003 |
| Non-polar tantalum capacitors and non-polar tantalum capacitor arrays with compact designs are provided. The reduced volume and footprint of the capacitors and arrays in turn reduces the amount of space required in any device in which they are used. In addition, the cost of materials is |
| 6579104 |
Low profile electrical connector |
June 17, 2003 |
| A thin profile electrical connector includes an insulating body member having a longitudinally extending leg defined between opposite ends. A plurality of adjacently disposed and spaced apart connector elements are mounted on the longitudinal leg, for example within recesses or grooves |
