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Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
AT&T Bell Laboratories Patents
Assignee:
AT&T Bell Laboratories
Address:
Murray Hill, NJ
No. of patents:
3358
Patents:




Patent Number Title Of Patent Date Issued
RE34811 Growable packet switch architecture December 27, 1994
This invention is large N.times.N packet switch, formed using a plurality of smaller packet switches. The invention comprises an N input, L output interconnect fabric (L>N), and a plurality of J.times.K smaller packet switches (J>K). Each of the J inputs to each packet switch is co
RE34755 Interconnect fabric providing connectivity between an input and arbitrary output(s) of a group o October 11, 1994
This invention is an inventive N input by L output interconnect fabric. In operation, packets comprising an information field and an address are received at the N inputs to the interconnect fabric, and the address in each packet is mapped to a group of outputs, rather than to any particu
RE34735 Call waiting arrangement providing options to both a subsequent calling party and to the called September 20, 1994
An improved call waiting arrangement where a caller is free to exercise discretion in interrupting ongoing telephone calls because the caller is prompted, for example via an audible announcement, that the called party is busy on another call but that the caller may request interruption o
RE34529 Arrangement for providing a call-connection service February 1, 1994
In a private communication network (10) served by a provider of call interconnection services, e.g., a carrier service node (15), the number of trunks (50-52) used within a call path is reduced without affecting the private nature of the private network. The service provider serves c
RE34269 Semiconductor integrated circuit packages June 1, 1993
A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as
RE34247 Digital speech processor using arbitrary excitation coding May 11, 1993
An arrangement for processing a speech message which uses arbitrary value codes to form time frame excitation signals. The arbitrary value codes, e.g., random numbers, are stored as well as signals indexing the codes and transform domain signals corresponding to the arbitrary codes are
RE33900 Error monitoring in digital transmission systems April 28, 1992
Errors in digital transmission are monitored by employing a cyclical-redundancy-check (CRC). A CRC code word having a predetermined number of bits is generated (via 310) from a block of bits (ESF) of a presently transmitted time division multiplexed (XTDM) signal. The code word bits
RE33693 Device using ordered semiconductor alloy September 17, 1991
An ordered-disordered transition is observed in semiconductor alloys which enables either the ordered or disordered structure to be produced.
RE33671 Method of making high mobility multilayered heterojunction device employing modulated doping August 20, 1991
The mobility of a relatively narrow bandgap semiconductor material can be significantly enhanced by incorporating it into a multilayered structure (10) comprising a first plurality of relatively narrow bandgap layers (12) of the material and a second plurality of wider bandgap semiconduc
RE33664 Data shifting and rotating apparatus August 13, 1991
.[.A circuit for rotating a multibit binary word in either the right or the left direction includes a scale factor decoder receiving a scale factor word which specifies the magnitude of the rotation and a direction control signal which specifies the direction of rotation and providing a
RE33651 Variable gap device and method of manufacture July 30, 1991
A variable gap device which comprises a suitable material with a cavity formed therein mounted over a body. Elements are formed on the surface of the body and on the top surface of the cavity. In one embodiment, the elements are electrodes of a variable capacitance device, and in another
RE33622 Integrated circuits having stepped dielectric regions June 25, 1991
Deposited silicon dioxide may be used as a field oxide layer or for other dielectric purposes in integrated circuits. However, etching a pattern in the layer usually produces steep sidewalls that prevent good step coverage of subsequently deposited conductor layers. The present technique
RE33459 Optical fiber cable November 27, 1990
An optical fiber cable includes a core (22) comprising optical fibers (24-24) in ribbon or single fiber form and a sheath system (50) which provides flexibility for ease of handling and installation, strength to resist tensile and torsional stresses and rodent and/or lightning protec
RE33380 Voiceband data set October 9, 1990
A full duplex, synchronous data set (10) includes primary signal processing circuitry which generates a modulated transmit data signal in response to serial data from a terminal interface (17). The modulated data signal is transmitted over a primary channel of a transmit line (11). The p
RE33368 Data set network diagnostic system October 2, 1990
A voiceband data set network includes a control data set (10), a plurality of tributary data sets (4a, 4b . . . 4n) and a diagnostic control device (5). User-provided data is communicated between the control data set and the tributary data sets via a primary channel within a four-wire pr
RE33041 Multi-dimensional coding for error reduction August 29, 1989
A stream of binary bits is converted into blocks of eight parallel bits. A first group of five of the eight bits addresses a memory device which has thirty-two code words each having four numbers representing the coordinates of signal points in four-dimensional space. The remaining t
RE32207 Method for making integrated semiconductor circuit structure with formation of Ti or Ta silicide July 15, 1986
The compounds TiSi.sub.2 and TaSi.sub.2 have been found to be suitable substitutes for polysilicon layers in semiconductor integrated circuits. Suitable conducting properties of the compounds are ensured by providing a relatively thin substrate of polysilicon.
RE32172 Endpoint detector June 3, 1986
An arrangement for endpoint detection improves speech recognition accuracy and lowers rejection rates by developing an ordered list of endpoint candidates. A triple thresholding technique defines energy signal pulses. The energy pulses are combined according to predetermined criteria to
RE32124 Predictive signal coding with partitioned quantization April 22, 1986
In a communication system an input predictive type signal is analyzed in successive time intervals to generate a set of prediction signals for the interval. A predictive residual signal is produced jointly responsive to the input signal and the interval prediction signals. The predictive
RE32090 Silicon integrated circuits March 4, 1986
A dynamic random access memory in which individual cells, including an access transistor and a storage capacitor, are formed in mesas formed on a silicon chip. The access transistor of the cell is formed on the top surface of the mess and one plate of the storage capacitor of the cell is
RE32012 Spoken word controlled automatic dialer October 22, 1985
A speech controlled dialing circuit identifies input utterances which may be a command word (mode select), repertory word (dialing name or number), or nonrecognized ("Other"). Responsive to the identification of each occurring input utterance, a set of predetermined templates are selecte
RE31969 Laser control circuit August 13, 1985
A control circuit for an injection laser includes a driver circuit which applies a driving current to the laser in response to an electrical modulating signal. A prebias circuit applies a prebias current to the laser in response to the difference between a signal derived from the ele
H97 Row-address-decoder-driver circuit August 5, 1986
A static noninverting driver circuit is used with a standard static address-row-decoder circuit in order to provide capacitance load drive capability and relatively high-speed operation. The driver circuit uses n-channel enhancement and depletion mode field effect transistors and a f
H73 Integrated circuit packages May 6, 1986
A package for wire-bonded semiconductor integrated circuit chips is disclosed. The chip is covered by a protective layer of material such as room temperature vulcanizing silicone rubber. The thickness of the layer is such that it covers a portion of the arched wires, thereby concentr
H65 Dynamic optical sensing: Robotic system and manufacturing method utilizing same May 6, 1986
Two opposing fingers of a robot hand are each provided with an array of optical devices which are capable of being in optical communication with one another through the gap between the fingers. One finger is provided with an array of light emitters and the other is provided with an array
H64 Full-wave rectifier for CMOS IC chip May 6, 1986
A full-wave rectifier is implemented in CMOS integrated circuit chip technology. Two transistors are used in a bridge arrangement with two diodes to implement the rectifier while avoiding parasitic transistor action which previously provided an unwanted current path through the chip
H54 Soldering external leads to film circuits April 1, 1986
Disclosed is a method of soldering external leads to film circuits formed on insulating substrates. The leads, usually in the form of lead frames, are clipped onto the substrates and a flux is applied. The assemblies are then immersed into molten solder. As they are withdrawn from the so
H36 Electroplating process with inert anodes March 4, 1986
The invention comprises improvements in inert anode electroplating processes that make possible the utilization of typically inexpensive and otherwise advantageous cation-yielding compounds for replenishing the plating bath, compounds that typically are not well suited for such use in
H208 Packaging microminiature devices February 3, 1987
One or more silicon-integrated-circuit chips are attached, active side up, to the top side of a silicon wafer. The top side of the wafer and all but peripheral portions of the attached chip(s) are then coated with an etch-resistant layer. Subsequently, the chips are etched to form sloped
H176 Slip tee pipe fitting December 2, 1986
A female tee pipe fitting has a stop only in one of its three openings, the other two coaxial openings which are perpendicular to the first opening have smooth inner surfaces and no stops. When two pipes are to be connected, one of the pipes is severed and a section of pipe removed l
H15 Broadband source of picosecond radiation January 7, 1986
The present invention relates to a means for generating a broadband source of picosecond radiation in the visible and near-infrared spectral regions. In operation, picosecond pulses with wavelength .lambda. are supplied by a laser pump source (10) and injected into the liquid core of a s
H147 High resistivity group III-V compounds by helium bombardment November 4, 1986
Helium-3 and helium-4 bombardment of InP over a fluence range of 10.sup.11 to 10.sup.16 ions/cm.sup.2 reproducibly forms highly resistive regions in both p-type and n-type single crystal material. Average peak resistivities are about 10.sup.9 ohm-cm for p-type InP and are about 10.sup.3
H13 Connecting a flat-pack-packaged chip to a printed circuit board January 7, 1986
A unique socket assembly is designed to interconnect a flat-pack-packaged integrated-circuit chip to a printed-circuit board in a manner that permits easy insertion and withdrawal of the packaged chip from the assembly. A base portion of the assembly includes a recess into which cond
H118 Synthesized sound telephone alerting means September 2, 1986
A telephone with electronic telephone alerting circuitry which includes a telephone ringing detector, a sound synthesizer activated by the ringing detector and an amplifier-speaker arrangement responsive to the synthesizer. Whenever ringing is detected, the synthesizer is activated a
H102 Controlling resolution of exposed resist in device lithography August 5, 1986
In certain negative resists utilized for high-resolution lithography, cross-linking persists even after the exposing radiation is removed. This phenomenon causes exposed features to become enlarged. In accordance with the present invention, cross-linking in exposed resist regions is
D350743 Videotelephone September 20, 1994
D348469 Electronics cabinet door July 5, 1994
D347371 Optical fiber splice re-entry tool May 31, 1994
D346750 Reference power module for measuring light energy entering an optical fiber splice May 10, 1994
D346154 Ornamental design for a circuit pack faceplate April 19, 1994
D345976 Telephone base April 12, 1994
D345975 Telephone set April 12, 1994
D345974 Housing for a handset base April 12, 1994
D345972 Video telephone set April 12, 1994
D345971 Video telephone station April 12, 1994
D345556 Housing for a telephone handset March 29, 1994
D344525 Telephone handset February 22, 1994
D344516 Telephone stand February 22, 1994
D344515 Telephone base February 22, 1994
D344514 Telephone handset February 22, 1994

 
 
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