| Patent Number |
Title Of Patent |
Date Issued |
| 5410804 |
Method for manufacturing a single product from integrated circuits received on a lead frame |
May 2, 1995 |
| Encapsulated integrated circuits (chips) (2, 3, 4, 5, 6) are manufactured by separating the encapsulated integrated circuits arranged on a lead frame (1), subsequently cutting away the lead-connecting strips (7) of the individual products, then bending the leads and finally cutting them |
| 5361486 |
System of machining devices |
November 8, 1994 |
| A system of machining lead frames (7), such as punching, cutting and bending of the leads consists of a number of machining devices (1, 2, 3) placed in series. Transport means (8) are provided for transporting the lead frames between the successive machining device. Each device comprises |
| 4877387 |
Automatic continuously cycleable molding system |
October 31, 1989 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4781282 |
Automatic continuously cycleable molding system and method |
November 1, 1988 |
| A receiving and arranging apparatus for bringing electronic components, or other workpieces, into a molding apparatus and unloading them from suitable magazines into a mechanism which arranges them in a proper orientation for placement into a mold. The apparatus includes a vertically |
| 4712994 |
Apparatus for cold runner transfer molding |
December 15, 1987 |
| A method and apparatus for cold runner transfer molding. Insulating and/or cooling means are provided so that the mold runnerblock is kept sufficiently cool to prevent curing of the plastic molding compound therein. By the addition of a plunger near the gate of the mold, a quasi-cont |
| 4710094 |
Automatic continuously cycleable molding system and method |
December 1, 1987 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4575328 |
Automatic continuously cycleable molding apparatus |
March 11, 1986 |
| An automatic continuously cycleable molding system wherein a plurality of mold sets are transported in predetermined timed cycles through a series of work stations wherein the various molding, curing and workpiece handling operations are accomplished, and wherein the mold sets are re |
| 4553420 |
Method and apparatus for touch-free lead bending |
November 19, 1985 |
| Apparatus is provided for bending one or two complete rows of leads on a dual-in-line semiconductor package at one time without damaging the leads. The leads of the dual-in-line package are initially in their manufactured position, extending horizontally from the sides of the package and |
| 4534921 |
Method and apparatus for mold cleaning by reverse sputtering |
August 13, 1985 |
| A method and apparatus for cleaning at least selected surfaces of a mold apparatus to remove plastic residue and surface contaminates and impurities to enable the molds to be used in a continuous in-line type process for encapsulating lead frame assemblies or similar semi-conductor c |
